Sealant composition

Patent metadata

Field	Value
Publication number	US-10108029-B2
Application number	US-201414190798-A
Country	US
Kind code	B2
Filing date	Feb 26, 2014
Priority date	Sep 15, 2011
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.

First claim

The invention claimed is:

1. A sealant composition comprising:
a partially (meth) acrylated epoxy resin,
a maleimide compound,
a hydrophobic oligomer selected from the group consisting of (meth) acrylate-modified polybutadiene, maleimide-modified polybutadiene, epoxy-modified and epoxylated polybutadiene, wherein a polybutadiene-backbone moiety may be optionally partially or entirely hydrogenated, and
a latent epoxy-curing agent having an onset of curing at 40° C. or higher, wherein
the sealant composition does not comprise a photoinitiator, and wherein at 100° C. or lower the sealant composition is cured.

2. The sealant composition according to claim 1 , wherein the maleimide compound is selected from compounds that are different from the hydrophobic oligomer if the hydrophobic oligomer have a maleimide group.

3. An article comprising the sealant composition according to claim 1 and a plastic substrate, wherein the sealant composition is used for sealing a plastic substrate.

4. The article according to claim 3 , wherein the plastic substrate is a liquid crystal display.

5. A method for manufacturing a liquid crystal display having a liquid crystalline layer between a first substrate and a second substrate, by means of a liquid-crystal-one-drop-filling process, wherein the first substrate and the second substrate are formed of plastic;
the method comprising the steps of:
(a) applying the sealant composition according to claim 1 on a sealing region at periphery of a surface of the first substrate;
(b) dropping liquid crystalline composition on a central area encircled by the sealing region of the surface of the first substrate;
(c) overlaying the second substrate on the first substrate;
(d) performing temporal fixation by photoirradiating the sealant composition; and
(e) performing final fixation by heating the sealant composition.

6. The method according to claim 5 , wherein the heating is performed at 100° C. or lower.

7. The sealant composition according to claim 1 , wherein the partially (meth)acrylated epoxy resin is liquid and has a viscosity in a range from 1,000 to 1,000,000 cps at 25° C.

8. The sealant composition according to claim 2 , wherein the maleimide compound comprises a maleimide compound having one or more substructures represented by moiety (I):

wherein R 1 and R 2 denote H or alkyl group having 1 to 6 carbons, or R 1 and R 2 together denote alkylene group having 2 to 6 carbons.

9. The sealant composition according to claim 1 , wherein the latent epoxy-curing agent has an onset of curing at 45° C. or higher.

10. The sealant composition according to claim 1 , wherein the latent epoxy-curing agent has an onset of curing at 80° C. or lower.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Chen Chenfu

Classifications

• C08G59/1466

  Acrylic or methacrylic acids · CPC title

• C09K2003/1062

  UV-curable materials · CPC title

• B32B2457/202

  LCD, i.e. liquid crystal displays · CPC title

• C08L75/16

  having terminal carbon-to-carbon unsaturated bonds · CPC title

• C09K2003/1059

  Heat-curable materials · CPC title