Sensor device and electronic apparatus

Patent metadata

Field	Value
Publication number	US-10107653-B2
Application number	US-201514596853-A
Country	US
Kind code	B2
Filing date	Jan 14, 2015
Priority date	Jul 13, 2011
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

First claim

What is claimed is:

1. A sensor device comprising:
a housing member having first through sixth walls and an inside space enclosed by the first through sixth walls;
a through-hole provided in the first wall of the housing member;
a first board provided on an inner surface of the first wall so as to cover an opening of the through-hole;
second, third, and fourth boards respectively provided on inner surfaces of the second, third, and fourth walls;
a connector provided at the first board so as to be exposed to an outside of the sensor device through the through-hole; and
first through third sensor components respectively provided on the second, third, and fourth boards, wherein
the first through third sensor components respectively have first through third detection axes intersecting with each other
the connector outputs a signal from the first sensor component, a signal from the second sensor component, and a signal from the third sensor component, and
wherein the second wall has a first recess that is open toward the second board, and
the first sensor component is housed in the first recess so that the first sensor component is located between the second wall and the second board, and
a depth of the first recess is larger than a thickness of the first sensor component.

2. The sensor device according to claim 1 , wherein
the third wall has a second recess opened toward the third board, and
the second sensor component is housed in the second recess so that the second sensor component is located between the third wall and the third board.

3. The sensor device according to claim 2 , wherein:
four of the first through sixth walls define side walls of the sensor device,
remaining two of the first through sixth walls define upper and bottom lids of the sensor device, and
the housing member is in a rectangular parallelepiped shape.

4. The sensor device according to claim 2 , wherein:
five of the first through sixth walls define a main body of the sensor device,
a remaining one of the first through sixth walls defines a lid of the sensor device, and
the housing member is in a rectangular parallelepiped shape.

5. The sensor device according to claim 1 , wherein
the first through third sensor components are angular velocity sensors.

6. The sensor device according to claim 1 , wherein
the first through third sensor components are acceleration sensors.

7. An electronic apparatus comprising:
the sensor device according to claim 1 .

8. The sensor device according to claim 1 , wherein
a depth of the second recess is smaller than a thickness of the second sensor component.

Assignees

• Seiko Epson Corp

Inventors

• Sakuma Masayasu
• Kobayashi Yoshihiro
• Kitamura Shojiro
• Chino Taketo

Classifications

• G01D11/30

  Supports specially adapted for an instrument; Supports specially adapted for a set of instruments · CPC title

• G01D11/245 Primary

  Housings for sensors · CPC title

• G01C19/5769

  Manufacturing; Mounting; Housings · CPC title

• G01C21/16

  by integrating acceleration or speed, i.e. inertial navigation · CPC title

• G01C21/166

  Mechanical, construction or arrangement details of inertial navigation systems · CPC title