Latent heat storage member and building material provided with same, microcapsules and thermal storage material using microcapsules
US-9523539-B2 · Dec 20, 2016 · US
US10107564B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10107564-B2 |
| Application number | US-201615243537-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 22, 2016 |
| Priority date | Jul 21, 2010 |
| Publication date | Oct 23, 2018 |
| Grant date | Oct 23, 2018 |
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Methods of encapsulating a phase change material in a capsule including suspending a particle of the phase change material in an air stream, coating an entire surface of the suspended particle with at least one layer of a sacrificial compound, coating an entire surface of the layer of the sacrificial compound with at least one layer of a second material, and encapsulating the phase change material within a shell formed by the second material. The step of encapsulating comprising heating the particle coated with the sacrificial compound and the second material, thermally decomposing the sacrificial compound, and vaporizing the sacrificial, wherein the sacrificial compound has a decomposition temperature less than a phase change temperature of the phase change material and a phase change temperature of the second material.
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What is claimed is: 1. A method of encapsulating a phase change material in a capsule, said method comprising: suspending a particle of said phase change material in an air stream; coating an entire surface of said suspended particle with at least one layer of a sacrificial compound, said step of coating comprising atomizing a solution of said sacrificial compound; depositing at least one layer of said atomized sacrificial compound onto said surface of said suspended particle; and drying said layer of said sacrificial compound deposited on said suspended particle; coating an entire surface of said layer of said sacrificial compound with at least one layer of a second material and encapsulating said phase change material within a shell formed by said second material, said step of encapsulating comprising heating said particle coated with said sacrificial compound and said second material; thermally decomposing said sacrificial compound and vaporizing said sacrificial compound, wherein said sacrificial compound has a decomposition temperature less than a phase change temperature of said phase change material and a phase change temperature of said second material. 2. The method of claim 1 , wherein said capsule is shaped substantially like a sphere having a diameter in the range of 2 mm to 15 mm. 3. The method of claim 1 , wherein said step of encapsulating renders said second material impervious. 4. The method of claim 1 , further comprising rendering said second material impervious by coating an entire surface of said layer of said second material with one or more layers of a third material after said step of encapsulation. 5. The method of claim 4 , wherein said second material and said third material are same. 6. The method of claim 1 , further comprising substantially filling a substantial number of defects in said layer of said second material by applying one or more layers of a third material after the step of encapsulating, wherein said defects include cracks, crevices, holes and voids. 7. The method of claim 6 , wherein said second material and said third material are same. 8. The method of claim 1 , wherein said phase change material is selected from the group consisting of sodium nitrate, potassium nitrate, mixture of sodium nitrate and potassium nitrate, and inorganic salts. 9. The method of claim 1 , wherein said sacrificial compound is selected from the group consisting of an organic polymer, hydroxy-propyl methyl cellulose, carboxy-methyl cellulose, ethyl cellulose, polyethelene and poly vinyl chloride. 10. The method of claim 1 , wherein said second material is selected from the group consisting of sodium chloride, bonded metal particles, sintered metal particles, clay, and mixture of clay and metal. 11. The method of claim 1 , further comprising applying one or more additional layers of said sacrificial compound before coating with said second material. 12. The method of claim 11 , further comprising rendering said second material impervious by coating an entire surface of said layer of said second material with one or more layers of a third material after said step of encapsulation. 13. The method of claim 11 , further comprising substantially filling a substantial number of defects in said layer of said second material by applying one or more layers of a third material after the step of encapsulating, wherein said defects include cracks, crevices, holes and voids. 14. The method of claim 11 , further comprising applying one or more additional layers of said second material when encapsulating. 15. The method of claim 14 , wherein said step of encapsulating renders said second material impervious. 16. The method of claim 14 , further comprising rendering said second material impervious by coating an entire surface of said layer of said second material with one or more layers of a third material after said step of encapsulation. 17. The method of claim 14 , further comprising substantially filling a substantial number of defects in said layer of said second material by applying one or more layers of a third material after the step of encapsulating, wherein said defects include cracks, crevices, holes and voids. 18. The method of claim 1 , further comprising applying one or more additional layers of said second material when encapsulating. 19. The method of claim 18 , wherein said step of encapsulating renders said second material impervious. 20. The method of claim 18 , further comprising rendering said second material impervious by coating an entire surface of said layer of said second material with one or more layers of a third material after said step of encapsulation. 21. The method of claim 18 , further comprising substantially filling a substantial number of defects in said layer of said second material by applying one or more layers of a third material after the step of encapsulating, wherein said defects include cracks, crevices, holes and voids. 22. The method of claim 1 , further comprising submerging a plurality of capsules in a heat transfer fluid, wherein each one of said plurality of capsules encapsulates said phase change material; transferring at least a portion of thermal energy in said heat transfer fluid to one or more of said plurality of capsules; and subjecting at least a portion of said phase change material encapsulated in said one or more of said plurality of capsules to change from solid to liquid. 23. The method of claim 22 , further comprising transferring thermal energy to said heat transfer fluid from a heat exchanger. 24. The method of claim 22 , further comprising submerging a plurality of capsules in a heat transfer fluid, wherein each one of said plurality of capsules encapsulates said phase change material; subjecting at least a portion of said phase change material encapsulated in one or more of said plurality of capsules to change from liquid to solid and release thermal energy; and transferring at least a portion of said thermal energy release by said phase change material form one or more of said plurality of capsules to said heat transfer fluid. 25. The method of claim 24 , further comprising transferring thermal energy to said heat transfer fluid from a first heat exchanger; and transferring thermal energy from said heat transfer fluid to a second heat exchanger. 26. The method of claim 1 , further comprising submerging a plurality of capsules in a heat transfer fluid, wherein each one of said plurality of capsules encapsulates said phase change material; subjecting at least a portion of said phase change material encapsulated in one or more of said plurality of capsules to change from liquid to solid and release thermal energy; and transferring at least a portion of said thermal energy release by said phase change material form one or more of said plurality of capsules to said heat transfer fluid. 27. The method of claim 26 , further comprising transferring thermal energy from said heat transfer fluid to a heat exchanger.
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