Multifunctional thermal management system and related method

Patent metadata

Field	Value
Publication number	US-10107560-B2
Application number	US-201113522264-A
Country	US
Kind code	B2
Filing date	Jan 13, 2011
Priority date	Jan 14, 2010
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A system and related method that provides, but is not limited thereto, a thin structure with unique combination of thermal management and stress supporting properties. An advantage associated with the system and method includes, but is not limited thereto, the concept providing a multifunctional design that it is able to spread, store, and dissipate intense thermal fluxes while also being able to carry very high structural loads. An aspect associated with an approach may include, but is not limited thereto, a large area system for isothermalizing a localized heating source that has many applications. For example it can be used to mitigate the thermal buckling of ship deck plates, landing pad structures, or any other structures subjected to localized heating and compressive forces. It can also be used as a thermal regulation system in numerous applications, including but not limited to under-floor heating for residential or commercial buildings or for the de-icing of roads, runways, tunnels, sidewalks, and bridge surfaces.

First claim

We claim:

1. An anisotropic thermal management system for thermally protecting a load-bearing surface, structure, or component against heat being transferred from a heat source to the load-bearing surface, structure, or component, said system comprising:
a high thermal conductivity layer comprising a high thermal conductivity material, said high thermal conductivity layer providing in-plane heat spreading across said high thermal conductivity layer, said high thermal conductivity material is an alloy of aluminum, silver, copper, diamond, graphite, or other high thermal conductivity material with a thermal conductivity greater than about 10 W/mK, said high thermal conductivity layer having a flat layer structure with uniform thickness, said high thermal conductivity layer comprising a heat pipe system having multiple heat pipes or heat pipe channels located within said thickness of said high thermal conductivity layer and surrounded and enclosed within said high thermal conductivity layer; and
a low thermal conductivity layer comprising a low thermal conductivity material, said low thermal conductivity layer reducing heat transfer from the heat source through said high thermal conductivity layer and said low thermal conductivity layer to the load-bearing surface, structure, or component, said low thermal conductivity material comprises at least one of the following materials: aramid, polymer, polymer foams, wood, plaster, cement, concrete or any other low thermal conductivity material with a thermal conductivity less than about 1 W/mK,
wherein the anisotropic thermal management system is configured to be installed or located between the heat source and the load-bearing surface, structure, or component to thermally and reduce heat transfer from the heat source to the load-bearing surface, structure, or component,
wherein the low thermal conductivity layer is disposed atop the load-bearing surface, structure, or component,
wherein the high thermal conductivity layer is disposed atop the low thermal conductive layer, and
wherein the heat source is located atop and facing the high thermal conductivity layer.

2. The system of claim 1 , wherein:
said system possesses a heat capacity such that, during periods in which heat flux causes transient build-up of heat, a rate of transient build-up of heat of said system is moderated to protect said load-bearing surface from said heat flux.

3. The system of claim 2 , wherein:
said high heat capacity is at least provided in part by one or more portions or segments of phase change material.

4. The system of claim 3 , wherein:
said phase change material comprises: paraffins, fatty acids, or hydrated salts.

5. The system of claim 3 , wherein:
said phase changing material comprises at least one of the following:

H 2 O; LiClO 3 .3H 2 O; ZnCl 2 .3H 2 O; K 2 HPO 4 .6H 2 O; NaOH.3½H 2 O; Na 2 CrO 4 .10H 2 O; KF.4H 2 O; Mn(NO 3 ) 2 .6H 2 O; CaCl 2 .6H 2 O; LiNO 3 .3H 2 O; Na 2 SO 4 .10H 2 O; Na 2 CO 3 .10H 2 O; CaBr 2 .6H 2 O; Na 2 HPO 4 .12H 2 O; Zn(NO 3 ) 2 .6H 2 O; KF.2H 2 O; K(CH 3 COO).1½H 2 O; K 3 PO 4 .7H 2 O; Zn(NO 3 ) 2 .4H 2 O; Ca(NO 3 ) 2 .4H 2 O; Na 2 HPO 4 .7H 2 O; Na 2 S 2 O 3 .5H 2 O; Zn(NO 3 ) 2 .2H 2 O; NaOH.H 2 O; Na(CH 3 COO).3H 2 O; Cd(NO 3 ) 2 .4H 2 O; Fe(NO 3 ) 2 .6H 2 O; NaOH; Na 2 B 4 O 7 .10H 2 O; Na3PO 4 .12H 2 O; Na 2 P 2 O 7 .10H 2 O; Ba(OH) 2 .8H 2 O; AlK(SO 4 ) 2 .12H 2 O; Kal(SO 4 ) 2 .12H 2 O; Al 2 (SO 4 ) 3 .18H 2 O; Al(NO 3 ) 3 .8H 2 O; Mg(NO 3 ) 2 .6H 2 O; (NH 4 )Al(SO 4 ).6H 2 O; Na 2 S.5½H 2 O; CaBr 2 .4H 2 O; Al 2 (SO 4 ) 3 .16H 2 O; MgCl 2 .6H 2 O; Mg(NO 3 ).2H 2 O; NaNO 3 ; KNO 3 ; KOH; MgCl 2 ; NaCl; Na 2 CO 3 ; or KF; K 2 CO 3 .

6. The system of claim 3 , wherein:
said phase change materials are disposed in said high thermal conductivity layer and/or said low thermal conductivity layer.

7. The system of claim 1 , wherein:
said high thermal conductivity layer comprises at least one or more of the following: a uniform high thermal conductivity material, a non-uniform high thermal conductivity material, or a composite formed from a multiplicity of high thermal conductivity materials.

8. The system of claim 1 , wherein:
said heat pipe system comprises at least one or more heat pipe layers.

9. The system of claim 8 , wherein:
at least one of said one or more heat pipe layers comprises multiple heat pipes.

10. The system of claim 9 , wherein:
at least portions of said multiple heat pipes within each heat pipe layer are at least substantially parallel with other said multiple heat pipes in said heat pipe layer.

11. The system of claim 10 , wherein:
said multiple heat pipe layers are oriented in the same direction relative to each other.

12. The system of claim 9 , wherein:
said multiple heat pipe layers are oriented in different directions relative to each other, thereby said orientation is configured to provided in-plane heat spreading in different directions along said high thermal conductivity layer.

13. The system of claim 12 , wherein:
said orientation is at least substantially perpendicular.

14. The system of claim 8 , wherein:
said one or more heat pipe layers are disposed in a non-skid layer.

15. The system of claim 1 , wherein:
said heat pipe system comprises one or more layers of interconnected heat pipes and/or heat pipe channels, said interconnected heat pipes and/or interconnected heat pipe channels having contiguous inner spaces, wherein said interconnected heat pipes and/or interconnected heat pipe channels configured to provide in-plane heat spreading in different directions along said high thermal conductivity layer.

16. The system of claim 1 , wherein:
said heat pipe system comprises one or more layers of intersecting heat pipes or intersection heat pipe channels, wherein said intersection is defined by said heat pipes or heat pipe channels that merge through one another configured to provided in-plane heat spreading in different directions along said high thermal conductivity layer.

17. The system of claim 1 , wherein:
said heat pipe system comprises one or more layers of interconnected heat pipes or interconnected heat pipe channels and one or more layers of intersecting heat pipes or intersecting heat pipe channels, wherein said interconnected heat pipes or interconnected heat pipe channels and said intersecting heat pipes or intersection heat pipe channels configured to provide in-plane heat spreading in different directions along said high thermal conductivity layer.

18. The system of claim 1 , wherein:
said heat pipe system comprises one or more layers of intersecting heat pipes or heat pipe channels, wherein said intersection is defined by said heat pipes or heat pipe channels that cross over and/or under one another configured to provide heat spreading in different directions along said high thermal conductivity layer.

19. The system of claim 1 , wherein:
said heat pipe system is disposed in a non-skid layer.

20. The system of claim 1 , wherein:
said heat pipe system comprises radially arranged heat pipes configured to provide heat spreading in different directions along said high thermal conductivity layer.

21. The system of claim 20 , wherein:
said radial-arrangement further comprises an arterial arrangement.

22. The system of claim 20 , wherein:
said heat pipes are comprised of segmented pieces, wherein said segments pieces are coupled together.

23. The system of claim 1 , wherein:
said heat pipe system compris

Assignees

• Wadley Haydn N G
• Haj Hariri Hossein
• Zok Frank
• Norris Pamela M
• Univ Virginia Patent Foundation

Inventors

• Wadley Haydn N G
• Haj-Hariri Hossein
• Zok Frank
• Norris Pamela M

Classifications

• Y02E60/145

  Cross-Sectional Technologies · mapped topic

• Y10T29/49353

  Heat pipe device making · CPC title

• E01C11/26

  Permanently installed heating or blowing devices {(specially for combating fog E01H; built-in melting devices for dislodged snow E01H5/102); Mounting thereof} · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D15/046 Primary

  characterised by the material or the construction of the capillary structure · CPC title