Substrate for wallboard joint tape and process for making same

US10106932B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10106932-B2
Application numberUS-201514681755-A
CountryUS
Kind codeB2
Filing dateApr 8, 2015
Priority dateJul 20, 2011
Publication dateOct 23, 2018
Grant dateOct 23, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lb f /inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lb f /inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making a multi-ply paper substrate, comprising using an air-laid papermaking machine, forming at least two layers, contacting one or both of the layers with an adhesive, and contacting the layers with one another, to form a two-layered web; and compressing the two-layered web, to make the paper substrate, the multi-ply paper comprising at least three adjoining plies, wherein at least two plies are bonded to one another by an adhesive therebetween, the adhesive being selected from the group consisting of starch, cooked starch, and adhesive starch; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lb f /inch width as measured by TAPPI method 494; a CD tensile of 10-300 lb f /inch width as measured by TAPPI method 494; and wherein at least one of said plies has an internal bond higher than that of the other of said plies, the adhesive, or both the adhesive and the other said plies. 2. The method of claim 1 , wherein at least one side of the multi-ply paper substrate has a Taber abrasion of 50-200 mg. 3. The method of claim 1 , wherein a wall side of the multi-ply paper substrate has a Taber abrasion of 50-200 mg. 4. The method of claim 1 , wherein a work side of the multi-ply paper substrate has a Taber abrasion of 50-200 mg. 5. The method of claim 1 , wherein the multi-ply paper substrate has a wet tensile strength of 5-60 lb f /inch width. 6. The method of claim 1 , wherein the multi-ply paper substrate has a caliper of 0.005-0.011 inch. 7. The method of claim 1 , wherein the multi-ply paper substrate comprises 3 to 11 plies. 8. The method of claim 1 , wherein the multi-ply paper substrate comprises 3 to 7 plies. 9. The method of claim 1 , wherein the multi-ply paper substrate comprises 3 to 5 plies. 10. The method of claim 1 , wherein the multi-ply paper substrate comprises a maximum of three plies. 11. The method of claim 1 , wherein at least one ply comprises cellulose fibers. 12. The method of claim 1 , wherein at least one ply comprises fibers, of which a majority are cellulose fibers. 13. The method of claim 1 , wherein at least one ply comprises fibers, of which at least a majority are hardwood fibers. 14. The method of claim 1 , wherein at least one ply comprises fibers, of which at least a majority are softwood fibers. 15. The method of claim 1 , wherein a single ply comprises an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541. 16. The method of claim 1 , wherein the adhesive comprises an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541. 17. The method of claim 1 , wherein the adhesive, a single ply, or both comprise an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541. 18. The method of claim 1 , wherein the adhesive comprises an internal bond of greater than 180 milli-ft.-lb/sq. in. as measured by TAPPI method 541. 19. The method of claim 1 , wherein one or more plies comprise an internal bond of greater than 180 milli-ft.-lb/sq. in. as measured by TAPPI method 541. 20. The method of claim 1 , wherein the adhesive, a single ply, or both comprise an internal bond of greater than 180 milli-ft.-lb/sq. in. as measured by TAPPI method 541. 21. The method of claim 1 , further comprising contacting one or both of the layers, the web, or both one or more of the layers and the web, with a binder. 22. The method of claim 21 , wherein the contacting comprises applying the binder in solid form, powder form, liquid form, melt form, or a combination thereof. 23. The method of claim 1 , wherein contacting one or both layers with the adhesive comprises applying the adhesive in solid form, powder form, liquid form, melt form, or combination thereof. 24. The method of claim 1 , further comprising sanding or abrading one or more outer surface of the paper substrate. 25. The method of claim 1 , further comprising contacting a wallboard surface with the paper substrate. 26. The method of claim 1 , further comprising heating one or both of the layers, the web, the substrate, or any combination thereof.

Assignees

Inventors

Classifications

  • Methods of surface bonding and/or assembly therefor · CPC title

  • Physical, chemical or physicochemical properties · CPC title

  • Pulp or paper, comprising cellulose or lignocellulose fibres of natural origin only · CPC title

  • next to another layer of paper or cardboard layer · CPC title

  • Physical treatment, e.g. heating, irradiating (D21H25/18 takes precedence; dryer section of machines for making continuous webs of paper D21F5/00) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10106932B2 cover?
A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lb f /inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lb f /inch width as measured by TAPPI method 494. Methods of making and…
Who is the assignee on this patent?
Int Paper Co
What technology area does this patent fall under?
Primary CPC classification D21H27/38. Mapped technology areas include Textiles & Paper.
When was this patent published?
Publication date Tue Oct 23 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).