Cobalt-containing compounds, their synthesis, and use in cobalt-containing film deposition
US-2015368282-A1 · Dec 24, 2015 · US
US10106887B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10106887-B2 |
| Application number | US-201315035592-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 13, 2013 |
| Priority date | Nov 13, 2013 |
| Publication date | Oct 23, 2018 |
| Grant date | Oct 23, 2018 |
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Disclosed are Group 5 transition metal-containing thin film forming precursors. Also disclosed are methods of synthesizing and using the disclosed precursors to deposit Group 5 transition metal-containing thin films on one or more substrates via vapor deposition processes.
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The invention claimed is: 1. A Group 5 transition metal-containing thin film forming precursor having one of the following formulae: wherein the Group 5 transition metal-containing thin film forming precursor is tert-butylimidobis(diethylamido)mono(tert-butylalkoxo)Niobium(V) or tert-butylimidomono(diethylamido)bis(tert-butylalkoxo)Niobium(V). 2. The Group 5 transition metal-containing thin film forming precursor of claim 1 , wherein the Group 5 transition metal-containing thin film forming precursor is tert-butylimidobis(diethylamido)mono(tert-butylalkoxo)Niobium(V). 3. The Group 5 transition metal-containing thin film forming precursor of claim 1 , wherein the Group 5 transition metal-containing thin film forming precursor is tert-butylimidomono(diethylamido)bis(tert-butylalkoxo)Niobium(V). 4. A process for the deposition of a Group 5 transition metal-containing film on a substrate, comprising the steps of: introducing the vapor of the Group 5 transition metal-containing thin film forming precursor into a reactor having a substrate disposed therein and depositing at least part of the Group 5 transition metal-containing compound onto the substrate, the Group 5 transition metal-containing thin film forming precursor having one of the following formulae: wherein the Group 5 transition metal-containing thin film forming precursor is tert-butylimidobis(diethylamido)mono(tert-butylalkoxo)Niobium(V) or tert-butylimidomono(diethylamido)bis(tert-butylalkoxo)Niobium(V). 5. The process of claim 4 , further comprising introducing at least one reactant into the reactor. 6. The process of claim 5 , wherein the reactant is selected from the group consisting of H 2 , H 2 CO N 2 H 4 , NH 3 , SiH 4 , Si 2 H 6 , Si 3 H 8 , SiH 2 Me 2 , SiH 2 Et 2 , N(SiH 3 ) 3 , hydrogen radicals thereof, and mixtures thereof. 7. The process of claim 5 , wherein the reactant is selected from the group consisting of: O 2 , O 3 , H 2 O, H 2 O 2 NO, N 2 O, NO 2 , oxygen radicals thereof, and mixtures thereof. 8. The process of claim 5 , wherein the Group 5 transition metal-containing thin film forming precursor and the reactant are introduced into the reactor simultaneously and the reactor is configured for chemical vapor deposition. 9. The process of claim 5 , wherein the Group 5 transition metal-containing thin film forming precursor and the reactant are introduced into the reactor sequentially and the reactor is configured for atomic layer deposition. 10. The process of claim 5 , wherein the substrate is zirconium oxide (ZrO 2 ). 11. The process of claim 5 , wherein the Group 5 transition metal-containing thin film forming precursor is tert-butylimidobis(diethylamido)mono(tert-butylalkoxo)Niobium(V). 12. The process of claim 5 , wherein the Group 5 transition metal-containing thin film forming precursor is tert-butylimidomono(diethylamido)bis(tert-butylalkoxo)Niobium(V).
characterised by the metal · CPC title
the precursor containing a compound comprising Si · CPC title
deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title
using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition (deposition by physical ablation of a target H10P14/6329) · CPC title
the conductive layers comprising transition metals · CPC title
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