Dual-cure nanostructure transfer film

US10106643B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10106643-B2
Application numberUS-201514674819-A
CountryUS
Kind codeB2
Filing dateMar 31, 2015
Priority dateMar 31, 2015
Publication dateOct 23, 2018
Grant dateOct 23, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.

First claim

Opening claim text (preview).

What is claimed is: 1. A transfer film comprising: a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows: preparing a mixture comprising: about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism, the multifunctional acrylate monomers selected from the group consisting of ethylene glycol diacrylate, ethylene glycol dimethacrylate, hexanediol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, glycerol triacrylate, pentaerthyitol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, neopentylglycol diacrylate, cycloaliphatic multifunctional (meth)acrylates, and combinations thereof; and about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups; curing the mixture by thermal cationic curing, wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming the thermal cationically cured layer; and wherein the backfill layer forms a pressure sensitive adhesive at room temperature. 2. The transfer film according to claim 1 , wherein the backfill layer includes a free radical photoinitiator to cure the multifunctional acrylate monomers via a photo free radical mechanism. 3. The transfer film according to claim 1 , wherein the backfill layer has a glass transition temperature value that is less than 25 degrees centigrade. 4. The transfer film according to claim 1 , wherein the epoxy comprises cycloaliphatic multifunctional epoxy monomers. 5. The transfer film according to claim 1 , wherein the multifunctional acrylate monomers are curable via a free-radical mechanism. 6. The transfer film according to claim 1 , further comprising a release liner disposed on a planar major surface of the back fill layer wherein the backfill layer is between the release liner and the structured non-planar release surface. 7. The transfer film according to claim 1 , wherein the backfill layer has an elastic modulus of less than 0.3×10 5 Pa. 8. An article comprising: the transfer film according to claim 1 disposed on a receptor substrate. 9. The article according to claim 8 , wherein the receptor substrate comprises glass or sapphire. 10. The article according to claim 8 , wherein the receptor substrate comprises an organic light emitting diode color filter element. 11. An article comprising: a receptor substrate having a receptor surface; a light transmission layer having a first major surface adhered to the receptor surface and an opposing second major surface having a structured non-planar surface, the light transmission layer comprising an interpenetrating network prepared as follows: preparing a mixture comprising: about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism, the multifunctional acrylate monomers selected from the group consisting of ethylene glycol diacrylate, ethylene glycol dimethacrylate, hexanediol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, glycerol triacrylate, pentaerthyitol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, neopentylglycol diacrylate, cycloaliphatic multifunctional (meth)acrylates, and combinations thereof; and about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups; curing the mixture by thermal cationic curing: wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming a partially cured layer; and curing the partially cured layer by free radical curing: wherein at least some of the acrylate functional groups of the multifuctional acrylate monomers and at least some of the acrylate functional groups of the compatibilizer are cured by the free radical curing to form a cross-linked acrylate, and wherein the cross-linked epoxy produced by the thermal cationic curing and the cross-linked acrylate produced by the free radical curing form the interpenetrating network of the light transmission layer; and wherein the light transmission layer has a haze value of less than 2% and a visible light transmission greater than 85% and a decomposition temperature greater than 250 degrees centigrade. 12. The article according to claim 11 , wherein the epoxy polymer comprises multifunctional cycloaliphatic epoxy monomers. 13. The article according to claim 11 , wherein the receptor substrate comprises an organic light emitting diode color filter element. 14. A transfer film comprising: a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows: preparing a mixture comprising: about 0.1 to about 15 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism; and about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups; curing the mixture by thermal cationic curing, wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming the thermal cationically cured layer; and wherein the backfill layer forms a pressure sensitive adhesive at room temperature. 15. A transfer film comprising: a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows: preparing a mixture comprising: about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 70 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism; and about 5 to about 40 wt-% of a c

Assignees

Inventors

Classifications

  • Inorganic coating · CPC title

  • Two or more independent types of crosslinking for one or more polymers · CPC title

  • Roughness · CPC title

  • B32B7/06Primary

    permitting easy separation · CPC title

  • Stepwise homogeneous crosslinking of one polymer with one crosslinking system, e.g. partial curing · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10106643B2 cover?
A transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different a…
Who is the assignee on this patent?
3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification B32B7/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 23 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).