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Elastic mounting of power modules
US10104812B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10104812-B2 |
| Application number | US-201113223538-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 1, 2011 |
| Priority date | Sep 1, 2011 |
| Publication date | Oct 16, 2018 |
| Grant date | Oct 16, 2018 |
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- Title
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- Abstract
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- Assignees and inventors
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a heat sink on which the base plate is mounted so that the base plate is interposed between the substrate and the heat sink and at least part of the inner region of the base plate contacts the heat sink. The module further includes a stress relief mechanism configured to permit the base plate to bend away from the heat sink in the edge region responsive to a thermal load so that at least part of the inner region of the base plate remains in contact with the heat sink.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor module, comprising: a base plate having an inner region adjacent an edge region; a substrate attached to the inner region of the base plate; a heat sink on which the base plate is mounted so that the base plate is interposed between the substrate and the heat sink and at least part of the inner region of the base plate contacts the heat sink; and a stress relief mechanism configured to permit the base plate to bend away from the heat sink in the edge region if a force applied by the base plate exceeds a certain threshold under a thermal load so that at least part of the inner region of the base plate remains in contact with the heat sink, wherein the stress relief mechanism comprises a spring washer interposed between the base plate and a head of a fastener, the fastener attaching the base plate to the heat sink through an opening in the base plate, and wherein the fastener is secured to the heat sink through a hollow cylinder press-fit into the opening in the base plate, the hollow cylinder configured to provide a gap between the edge region of the base plate and the heat sink by limiting the depth at which the fastener can move towards the heat sink when the fastener is secured to the heat sink.
Assignees
Inventors
Classifications
Heat exchanger or boiler making · CPC title
- H05K7/209Primary
Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Soldering or alloying · CPC title
Connecting techniques · CPC title
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Frequently asked questions
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- What does patent US10104812B2 cover?
- A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a heat sink on which the base plate is mounted so that the base plate is interposed between the substrate and the heat sink and at least part of the inner region of the base plate contacts the heat sink. The module further includes a stress …
- Who is the assignee on this patent?
- Bayerer Reinhold, Borghoff Georg, Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification H05K7/209. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).