Case for an electronic device and manufacturing methods formaking a case
US-2015295615-A1 · Oct 15, 2015 · US
Anti-slip substrates
US10104792B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10104792-B2 |
| Application number | US-201315021457-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 31, 2013 |
| Priority date | Oct 31, 2013 |
| Publication date | Oct 16, 2018 |
| Grant date | Oct 16, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method is provided for modifying a layer of a plastics material containing conductive fibers. The method includes electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.
First claim
Opening claim text (preview).
The invention claimed is: 1. A housing for a device, the housing comprising: a fiber reinforced plastics shell including conductive fibers, the fiber reinforced plastics shell defining a surface and the conductive fibers being exposed via openings at spaced apart locations of the surface of the fiber reinforced plastics shell; and a slip resistant finish applied to the surface of the fiber reinforced plastics shell, the slip resistant finish comprising electrophoretically deposited polymer material arranged at the openings of the spaced apart locations of the fiber reinforced plastics shell where the conductive fibers are exposed. 2. The housing of claim 1 , in which the slip resistant finish comprises discrete beads of the polymer material, the beads being deposited at the openings of the spaced apart locations of the fiber reinforced plastics shell. 3. The housing of claim 1 , in which the electrophoretically deposited polymer material comprises at least one of epoxy and polyacrylate polymers. 4. The housing of claim 1 , in which the plastics material is at least one of a thermoplastic and a thermosetting material. 5. The housing of claim 1 , in which the conductive fibers comprise carbon fibers. 6. The housing of claim 1 , in which the conductive fibers are arranged in a weave and the locations of the surface of the fiber reinforced plastics shell where the conductive fibers are exposed are regions where threads of the weave cross. 7. The housing of claim 1 , in which the conductive fibers are uni-directionally arranged in the fiber reinforced plastics shell.
Assignees
Inventors
Classifications
characterised by the article coated · CPC title
Human Necessities · mapped topic
Holders or carriers for hand articles; Holders or carriers for use while travelling or camping · CPC title
- H05K5/02Primary
Details · CPC title
Pretreatment · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10104792B2 cover?
- A method is provided for modifying a layer of a plastics material containing conductive fibers. The method includes electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.
- Who is the assignee on this patent?
- Hewlett Packard Development Co
- What technology area does this patent fall under?
- Primary CPC classification H05K5/02. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).