Method for making an electronic product with flexible substrate

Patent metadata

Field	Value
Publication number	US-10104784-B2
Application number	US-201615254124-A
Country	US
Kind code	B2
Filing date	Sep 1, 2016
Priority date	Nov 6, 2015
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A method for making an electronic product. The method includes processing a flexible substrate (e.g., a web) with the use of a tensioner having a vacuum plate and an indexer that intermittently moves the flexible substrate for processing. While a designated location of the flexible substrate is stopped at a processing location, a process is performed on the designated location. Wherein while the designated location is stopped at the processing location, the vacuum plate of the tensioner moves in an opposite direction of the transport direction.

First claim

What is claimed is:

1. A method for making an electronic product comprising:
supplying a flexible substrate to an indexer through a tensioner with a vacuum plate so that the flexible substrate is transported over the vacuum plate;
moving by the indexer, a designated location of the flexible substrate along a transport direction for processing to a processing location;
stopping the designated location of the flexible substrate at the processing location;
while the designated location is stopped at the processing location, performing a process on the designated location, wherein while the designated location is stopped at the processing location, moving the vacuum plate of the tensioner in an opposite direction of the transport direction;
moving by the indexer, the designated location from the processing location after the performing the process;
after the moving, forming an electronic product wherein the forming includes separating the web into a plurality of separate structures wherein the electronic product includes a separate structure of the plurality of separate structures with an electronic component.

2. The method of claim 1 wherein the performing the process includes placing the electronic component at the designated location.

3. The method of claim 2 wherein a pick and place device performs the placing the electronic component.

4. The method of claim 2 wherein the electronic component is characterized as an integrated circuit.

5. The method of claim 1 wherein the performing the process includes applying an adhesive to the designated location.

6. The method of claim 1 wherein the performing the process is characterized as performing a curing process at the designated location.

7. The method of claim 6 wherein the performing a curing process includes applying heat to the designated location.

8. The method of claim 1 wherein the forming an electronic product includes applying a covering structure to the designated location after the performing the process.

9. The method of claim 1 wherein the forming an electronic product includes applying the covering structure before the separating.

10. The method of claim 1 wherein during the moving by the indexer to the processing location, during the performing the process, and during the moving by the indexer from the processing location, a relative speed between the indexer and the vacuum plate of the tensioner is maintained above a predefined threshold.

11. The method of claim 10 wherein during the moving by the indexer to the processing location, during the performing the process, and during the moving by the indexer from the processing location, the relative speed between the indexer and the vacuum plate of the tensioner is maintained in a linear region of a Stribeck curve.

12. The method of claim 1 wherein the indexer includes and indexer drum, wherein the moving by the indexer includes rotating the indexer drum.

13. The method of claim 12 wherein the indexer drum includes vacuum holes.

14. The method of claim 1 further comprising:
supplying the flexible substrate to a second indexer through a second tensioner with a vacuum plate so that the flexible substrate is transported over the vacuum plate of the second tensioner;
moving by the second indexer, the designated location of the flexible substrate along the transport direction for processing to a second processing location;
stopping the designated location of the flexible substrate at the second processing location;
while the designated location is stopped at the second processing location, performing a second process on the designated location, wherein while the designated location is stopped at the second processing location, moving the vacuum plate of the second tensioner in an opposite direction of the transport direction;
moving by the second indexer, the designated location from the second processing location after the performing the second process.

15. The method of claim 14 wherein the performing the process includes applying an adhesive to the designated location and the performing the second process includes placing the electronic component at the designated location.

16. The method of claim 15 wherein the forming an electronic product includes applying a covering structure to the designated location after the performing the process and the second process, wherein during the moving by the indexer to the processing location, during the performing the process, and during the moving by the indexer from the processing location, a relative speed between the indexer and the vacuum plate of the tensioner is maintained above a predefined threshold.

17. The method of claim 14 further comprising:
supplying the flexible substrate to a third indexer through a third tensioner with a vacuum plate so that the flexible substrate is transported over the vacuum plate of the third tensioner;
moving by the third indexer, the designated location of the flexible substrate along the transport direction for processing to a third processing location;
stopping the designated location of the flexible substrate at the third processing location;
while the designated location is stopped at the third processing location, performing a third process on the designated location, wherein while the designated location is stopped at the third processing location, moving the vacuum plate of the third tensioner in an opposite direction of the transport direction;
moving by the third indexer, the designated location from the third processing location after the performing the third process.

18. The method of claim 14 wherein the performing the process includes applying an adhesive to the designated location and the performing the second process includes placing the electronic component at the designated location, wherein the performing the third process is characterized as performing a curing process of the adhesive at the designated location.

19. The method of claim 1 where the moving of the flexible substrate by the indexer includes linearly moving the flexible substrate by the indexer.

20. The method of claim 1 wherein the electronic component is characterized as an integrated circuit.

21. A method for making an electronic product comprising:
supplying a flexible substrate to an indexer through a tensioner with a vacuum plate so that the flexible substrate is transported over the vacuum plate;
moving by the indexer, a designated location of the flexible substrate along a transport direction for processing to a processing location;
stopping the designated location of the flexible substrate at the processing location;
while the designated location is stopped at the processing location, placing an electronic component on the designated location, wherein while the designated location is stopped at the processing location, moving the vacuum plate of the tensioner in an opposite direction of the transport direction;
moving by the indexer, the designated location from the processing location after the performing the process;
after the moving, forming an electronic product wherein the forming includes separating the web into a plurality of separate structures wherein the electronic product includes a separate structure of the plurality of separate structures with the electronic component.

Assignees

• Nxp Bv

Inventors

• Stokkermans Jozep Petrus Wilhelmus
• Kampschreur Thomas Markus
• Ter Steeg Theodorus
• Houben Patrick J M

Classifications

• H10P72/0446 Primary

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