Metallized particle interconnect with solder components

Patent metadata

Field	Value
Publication number	US-10104772-B2
Application number	US-201414462721-A
Country	US
Kind code	B2
Filing date	Aug 19, 2014
Priority date	Aug 19, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

First claim

What is claimed is:

1. A method for connecting electrical components, the method comprising:
establishing an electrical connection between a first electrical component and a second electrical component using a compression tool to apply a compression force to an assembly that includes:
the first electrical component,
the second electrical component,
an interconnect comprising a sheet of metal particles which under compression form conductive metal particle columns of distinct but electrically connected particles between the first electrical component and the second electrical component, and
a set of solder components outside a boundary of the interconnect and extending from the first electrical component to the second electrical component and directly contacting a solder pad of the first electrical component and a solder pad of the second electrical component;

melting the set of solder components by applying heat to the assembly; solidifying the set of solder components by cooling the assembly so that the solder components maintain the compression force applied by the compression tool; and removing the compression tool.

2. The method of claim 1 , further comprising:
applying the solder components to a first set of solder pads located on the first electrical component.

3. The method of claim 2 , further comprising:
applying the solder components to a second set of solder pads located on the second electrical component.

4. The method of claim 3 , wherein the first set of solder pads and the second set of solder pads have sizes and a configuration according to a bond failure strength of the solder components.

5. The method of claim 1 , wherein the solidifying of the solder components establishes a bond between the first electrical component and the second electrical component.

6. The method of claim 1 , wherein the solidifying of the solder components establishes an electrical connection between the first electrical component and the second electrical component.

7. The method of claim 1 , wherein the first electrical component and the second electrical component have electrical contacts that have a common pattern.

8. The method of claim 7 , wherein the interconnect has conductive columns that extend from a top of the interconnect to a bottom of the interconnect and match the common pattern of the electrical contacts.

9. The method of claim 8 , wherein the electrical connection is established by the conductive columns making contact with the electrical contacts when the compression force is applied.

Assignees

• IBM
• Int Business Machines Incorporated

Inventors

• Berge Layne A
• Dangler John R
• Doyle Matthew S
• Hefner Jesse

Classifications

• B23K3/087

  Soldering or brazing jigs, fixtures or clamping means · CPC title

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• H05K2201/10515

  Stacked components · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/14 Primary

  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title