Thin film coil and electronic device having the same

Patent metadata

Field	Value
Publication number	US-10103554-B2
Application number	US-201715653725-A
Country	US
Kind code	B2
Filing date	Jul 19, 2017
Priority date	Mar 29, 2012
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.

First claim

What is claimed is:

1. A thin film coil, comprising:
a substrate comprising a first surface and a second surface, and formed of an insulating layer;
a first coil strand disposed on the first surface of the substrate, and including a spiral pattern and a lead-out pattern, the lead-out pattern having an end disposed inside the spiral pattern to be led out from the end, outwardly of the spiral pattern;
a second coil strand disposed on the second surface of the substrate, wherein the second coil strand overlaps and is insulated from the spiral pattern in a portion away from the lead-out pattern; and
a plurality of detour vias electrically connecting the first coil strand and the second coil strand to each other, while penetrating through the substrate in a position adjacent to the lead out pattern,
wherein windings of the spiral pattern are spaced apart from each other on the first surface and electrically maintained across the lead-out pattern by the second coil strand through at least one of the plurality of detour vias.

2. The thin film coil of claim 1 , further comprising two contact pads disposed outwardly of the spiral pattern, and electrically connected to both ends of at least one of the first coil strand or the second coil strand.

3. The thin film coil of claim 1 , wherein the first coil strand and the second coil strand are connected in parallel.

4. The thin film coil of claim 1 , wherein the second coil strand is provided with a conductive connection via disposed at each of both ends of the second coil strand, and is electrically connected to the first coil strand by the conductive connection via.

5. The thin film coil of claim 1 , wherein the first coil strand and the second coil strand are disposed in positions on two surfaces of the substrate, respectively, the positions corresponding to each other in a vertical direction.

6. The thin film coil of claim 1 , wherein the substrate comprises a circuit board.

7. The thin film coil of claim 1 , wherein the plurality of detour vias comprises two detour vias for a winding of the spiral pattern.

Assignees

• Samsung Electro Mech

Inventors

• Lim Dae Ki
• Kim Tae Sung
• Nam Hyeon Gil
• An Chan Gwang
• Lee Hyun Seok
• Chang Ki Won
• Han Chang Mok
• Bae Sang Woo
• Cho Sung Eun
• Sung Jae Suk

Classifications

• H01Q7/00

  Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

• H01Q7/06

  with core of ferromagnetic material (H01Q7/02 takes precedence) · CPC title

• H01F5/00

  Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) · CPC title

• H01F2017/0073

  with a special conductive pattern, e.g. flat spiral · CPC title

• H01F17/0006

  Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title