Co- tolerant catalyst for pafc
US-2015380758-A1 · Dec 31, 2015 · US
US10103388B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10103388-B2 |
| Application number | US-201314890181-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 13, 2013 |
| Priority date | May 13, 2013 |
| Publication date | Oct 16, 2018 |
| Grant date | Oct 16, 2018 |
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Disclosed is a method for producing a fine catalyst particle comprising a palladium-containing particle and a platinum outermost layer covering the palladium-containing particle, wherein a first composite body containing palladium and platinum is formed by mixing the palladium-containing particle with a first solution in which a platinum compound is dissolved, and then covering at least part of a surface of the palladium-containing particle with platinum; wherein a second composite body containing palladium, platinum and copper is formed by mixing the first composite body with a second solution in which a copper compound is dissolved, and then covering at least part of a surface of the first composite body with copper using copper underpotential deposition; and wherein the copper in the second composite body is substituted with platinum derived from a third solution in which a platinum compound is dissolved.
Opening claim text (preview).
The invention claimed is: 1. A method for producing a fine catalyst particle comprising a palladium-containing particle and a platinum outermost layer covering the palladium-containing particle, wherein a first composite body containing palladium and platinum is formed by mixing the palladium-containing particle with a first solution in which a platinum compound is dissolved, and, as a result of bringing the palladium-containing particle into direct contact with the first solution, then covering at least part of a surface of the palladium-containing particle with platinum; wherein a second composite body containing palladium, platinum and copper is formed by mixing the first composite body with a second solution in which a copper compound is dissolved, and then covering at least part of a surface of the first composite body with copper using copper underpotential deposition; wherein the copper in the second composite body is substituted with platinum derived from a third solution in which a platinum compound is dissolved, by mixing the second composite body with the third solution; and wherein an amount of platinum atoms contained in the first solution is 70 atm % or less, when a minimum amount of platinum atoms required to cover the palladium-containing particle with a monatomic layer of platinum is 100 atm %. 2. The method for producing the fine catalyst particle according to claim 1 , wherein the palladium-containing particle is supported on a carrier. 3. The method for producing the fine catalyst particle according to claim 1 , wherein the palladium-containing particle is subjected to an acid treatment in advance, before the first composite body is formed. 4. The method for producing the fine catalyst particle according to claim 2 , wherein the palladium-containing particle is subjected to an acid treatment in advance, before the first composite body is formed.
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