Backside ground plane for integrated circuit

Patent metadata

Field	Value
Publication number	US-10103135-B2
Application number	US-201615275068-A
Country	US
Kind code	B2
Filing date	Sep 23, 2016
Priority date	Sep 23, 2016
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

An integrated circuit (IC) device includes a die having an integrated passive device (IPD) layer. The integrated circuit device also includes a substrate supporting the die, a molding compound surrounding the die. The integrated circuit device further includes a backside conductive layer on a surface of the die that is distal from the IPD layer. The integrated circuit device also includes vias coupling the backside conductive layer to a ground plane through the molding compound.

First claim

What is claimed is:

1. An integrated circuit (IC) device, comprising:
a die including an integrated passive device (IPD) layer;
a substrate supporting the die;
a molding compound surrounding the die;
a backside conductive layer on a surface of the die that is distal from the IPD layer; and
a plurality of vias coupling the backside conductive layer to a ground plane through the molding compound, in which the ground plane is on a backside of the molding compound.

2. The IC device of claim 1 , in which the IPD layer comprises inductors and capacitors.

3. The IC device of claim 1 , in which the ground plane comprises a shielding layer surrounding a portion of the molding compound and the substrate.

4. The IC device of claim 3 , in which the shielding layer is arranged to cover sidewalls of the substrate.

5. The IC device of claim 1 , in which the ground plane is distal from the IPD layer.

6. The IC device of claim 1 , further comprising solder balls on a front side of the die for electrically coupling the substrate to the die.

7. The IC device of claim 1 , integrated into a radio frequency (RF) front end module, the RF front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.

8. A method of fabricating an integrated circuit (IC) device, comprising:
plating a backside conductive layer on a backside of a die including an integrated passive device (IPD) layer;
attaching a front side of the die to a packaging substrate;
spreading a molding material on the packaging substrate to surround the die with a molding compound;
exposing the backside conductive layer on the die through the molding compound; and
depositing a conductive material on the molding compound, the conductive material contacting the backside conductive layer on the die and providing a ground plane for the IPD layer, in which the ground plane is on a backside of the molding compound.

9. The method of claim 8 , in which the exposing comprises drilling through the molding material.

10. The method of claim 8 , in which the depositing comprises conformally coating the molding compound.

11. The method of claim 8 , in which the conductive material is arranged to cover sidewalls of the packaging substrate.

12. The method of claim 8 , in which the IPD layer comprises inductors and capacitors.

13. The method of claim 8 , in which the ground plane comprises a shielding layer surrounding a portion of the die and the packaging substrate.

14. The method of claim 8 , further comprising integrating the IC device into a radio frequency (RF) front end module, the RF front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.

15. An integrated circuit (IC) device, comprising:
a die including an integrated passive device (IPD) layer;
a substrate supporting the die;
a molding compound surrounding the die;
a backside conductive layer on a surface of the die that is distal from the IPD layer; and
means for coupling the backside conductive layer to a ground plane, in which the ground plane is on a backside of the molding compound.

16. The IC device of claim 15 , integrated into a radio frequency (RF) front end module, the RF front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.

17. A radio frequency (RF) front end module, comprising:
a filter, comprising a die including an integrated passive device (IPD) layer, a substrate supporting the die, a molding compound surrounding the die, a backside conductive layer on a surface of the die that is distal from the IPD layer, and a plurality of vias coupling the backside conductive layer to a ground plane, in which the ground plane is on a backside of the molding compound;
a diplexer coupled to the filter; and
an antenna coupled to an output of the diplexer.

18. The RF front end module of claim 17 , in which the IPD layer comprises inductors and capacitors.

19. The RF front end module of claim 17 , incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer.

Assignees

• Qualcomm Inc

Inventors

• Zuo Chengjie
• Kim Jonghae
• Berdy David Francis
• Yun Changhan Hobie
• Mudakatte Niranjan Sunil
• Velez Mario Francisco
• Gu Shiqun

Classifications

• H10W42/287

  materials for magnetic shielding, e.g. ferromagnetic materials · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title