Heat dissipation assembly and electronic device

Patent metadata

Field	Value
Publication number	US-10103087-B2
Application number	US-201415125952-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Mar 18, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

First claim

What is claimed is:

1. A heat dissipation assembly, comprising:
a shielding element, wherein a via hole is disposed on a side of the shielding element, the shielding element is electrically connected to ground copper of a printed circuit board (PCB), and a heat-generating electronic element is disposed on the PCB;
a heat pipe, located on the via hole, wherein the heat pipe is electrically connected to the shielding element and is in contact with the via hole, and the heat pipe, the PCB, and the shielding element form an electromagnetic shielding can to accommodate the heat-generating electronic element; and
a first elastic thermal interface material, located between the heat pipe and the heat-generating electronic element, and mutually fitted to the heat pipe and the heat-generating electronic element.

2. The assembly according to claim 1 , wherein that the heat pipe is electrically connected to the shielding element by using an electrically conductive elastomer or an electrically conductive interface material.

3. The assembly according to claim 2 , wherein the assembly further comprises:
electrically conductive interface material, disposed around the via hole, and mutually fitted to the shielding element and the heat pipe.

4. The assembly according to claim 2 , wherein the shielding element comprises the electrically conductive elastomer, the electrically conductive elastomer is disposed around the via hole, and the electrically conductive elastomer is electrically connected to the heat pipe.

5. The assembly according to claim 1 , wherein the first elastic thermal interface material is an elastic electrically conductive thermal interface material or an elastic insulated thermal interface material, and the first elastic thermal interface material is mutually fitted to the heat pipe by using the via hole.

6. The assembly according to claim 1 , wherein the assembly further comprises:
a second elastic thermal interface material, mutually fitted to the heat pipe; and
a thermally conductive metal block, disposed between the second elastic thermal interface material and the PCB, and mutually fitted to the second elastic thermal interface material, wherein the thermally conductive metal block is connected to the heat-generating electronic element by using a thermally conductive layer on the PCB.

7. The assembly according to claim 6 , wherein the second elastic thermal interface material is an elastic electrically conductive thermal interface material or an electrically insulating thermal interface material.

8. An electronic device, comprising:
an enclosure; and
a heat dissipation assembly, located in the enclosure, wherein the heat dissipation assembly comprises a shielding element, a heat pipe, and a first elastic thermal interface material, wherein
a via hole is disposed on a side of the shielding element, the shielding element is electrically connected to ground copper of a PCB, and a heat-generating electronic element is disposed on the PCB; the heat pipe is in contact with the via hole, the heat pipe is electrically connected to the shielding element and is located on the via hole, and the heat pipe, the PCB, and the shielding element form an electromagnetic shielding can to accommodate the heat-generating electronic element; and the first elastic thermal interface material is located between the heat pipe and the heat-generating electronic element, and is mutually fitted to the heat pipe and the heat-generating electronic element.

9. The electronic device according to claim 8 , wherein that the heat pipe is electrically connected to the shielding element by using an electrically conductive elastomer or an electrically conductive interface material.

10. The electronic device according to claim 8 , wherein the electronic device further comprises a thermally conductive support that is located in the enclosure, and the thermally conductive support is connected to the heat pipe.

11. The electronic device according to claim 8 , wherein the heat dissipation assembly further comprises:
a second elastic thermal interface material, mutually fitted to the heat pipe; and
a thermally conductive metal block, disposed between the second elastic thermal interface material and the PCB, and mutually fitted to the second elastic thermal interface material, wherein the thermally conductive metal block is connected to the heat-generating electronic element by using a thermally conductive layer on the PCB.

12. The electronic device according to claim 11 , wherein the second elastic thermal interface material is an elastic electrically conductive thermal interface material or an elastic insulated thermal interface material.

13. An electronic device, comprising:
an enclosure; and
a heat dissipation assembly, located in the enclosure, wherein the heat dissipation assembly comprises a thermally conductive metal block, an elastic thermal interface material, and a heat pipe, wherein the thermally conductive metal block is disposed on a PCB and is connected, by using a thermally conductive layer of the PCB, to a heat-generating electronic element disposed on the PCB; the elastic thermal interface material is fitted on the thermally conductive metal block; and the heat pipe is fitted on the elastic thermal interface material; and, wherein the heat dissipation assembly further comprises:
a shielding element, wherein a via hole is disposed on the shielding element, the heat pipe is located on and is contact with the via hole, the shielding element is electrically connected to the heat pipe, and the heat pipe, the PCB, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element and the thermally conductive metal block.

14. The electronic device according to claim 13 , wherein the thermally conductive layer is at least one of: a first copper layer on a surface of the PCB, and a second copper layer inside the PCB.

15. The electronic device according to claim 13 , wherein that the shielding element is electrically connected to the heat pipe by using an electrically conductive elastomer or an electrically conductive interface material.

16. The electronic device according to claim 13 , wherein the electronic device further comprises a thermally conductive support that is located in the enclosure, and the thermally conductive support is connected to the heat pipe.

17. An electronic device, comprising:
an enclosure; and
a heat dissipation assembly, located in the enclosure, wherein the heat dissipation assembly comprises a shielding element, a heat pipe, and a first elastic thermal interface material, wherein the shielding element comprising a side that covers a heat-generating electronic element of a PCB, and the shielding element is electrically connected to a ground copper layer of the PCB; the heat pipe is located on a via hole of the shielding element and is in contact with the via hole, and the heat pipe is connected to the shielding element by means of welding or bonding; and the first elastic thermal interface material is fitted between the heat-generating electronic element and the shielding element.

18. The electronic device according to claim 17 , wherein the heat dissipation assembly further comprises:
a thermally conductive metal block, disposed on the PCB, wherein the thermally conductive metal block is connected to the heat-generating electronic element by using the ground copper layer; and
a second elastic thermal interface material, located between the thermally conductive metal block and the heat pi

Assignees

• Huawei Device Dongguan Co Ltd
• Huawei Device Dongguan Co Ltd

Inventors

• Jin Linfang
• Xiao Yongwang
• Wang Guoping
• Zou Jie
• Li Hualin

Classifications

• H10W42/265

  Shielding wires, e.g. constant potential wires · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title