Clamping assembly having a pressure element

Patent metadata

Field	Value
Publication number	US-10103085-B2
Application number	US-201415323340-A
Country	US
Kind code	B2
Filing date	Jul 1, 2014
Priority date	Jul 1, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A clamping assembly includes a configuration of mechanically clamped components disposed one on top of the other to form a stack. A clamping device generates a mechanical compressive force on the configuration of the components and a pressure element transmits the mechanical compressive force from the clamping device to the configuration. The pressure element contains a metal foam for a planar, homogeneous transmission of the compressive force. A sub module of a converter having at least one series circuit of power semiconductor switching units implemented as the clamping apparatus is also provided.

First claim

The invention claimed is:

1. A clamping assembly, comprising:
a configuration of mechanically clamped components positioned above one another in a stack;
a clamping device for generating a mechanical compressive force on said configuration of said components; and
a pressure element for transferring the mechanical compressive force from said clamping device to said configuration, said pressure element containing a metal foam material, said pressure element being conical.

2. The clamping assembly according to claim 1 , wherein said metal foam material is one of a plurality of metal foam materials with different elastic properties in said pressure element.

3. The clamping assembly according to claim 1 , wherein said configuration includes a semiconductor element.

4. The clamping assembly according to claim 3 , wherein said configuration includes at least one cooling plate formed of conductive material, said at least one cooling plate lying against said semiconductor element and providing an electrical contact between said semiconductor element and said at least one cooling plate.

5. The clamping assembly according to claim 4 , wherein said semiconductor element is one of a plurality of semiconductor elements of said configuration, at least one cooling plate is associated with each respective semiconductor element, and said semiconductor elements form an electrical series circuit.

6. The clamping assembly according to claim 5 , wherein two cooling plates are associated with each respective semiconductor element and are disposed on both sides of said semiconductor element.

7. A sub module of a converter, the sub module comprising:
at least one series circuit of power semiconductor switching units;
each of said power semiconductor switching units including a respective power semiconductor configured to be switched on and off and configured to have the same forward conduction direction;
said power semiconductor switching units being conductive in a direction opposite to said forward direction;
an energy storage device connected in parallel with said at least one series circuit; and
said at least one series circuit being implemented as a clamping apparatus according to claim 1 .

8. A clamping assembly, comprising:
a configuration of mechanically clamped components positioned above one another in a stack;
a clamping device for generating a mechanical compressive force on said configuration of said components; and
a pressure element for transferring the mechanical compressive force from said clamping device to said configuration, said pressure element containing a metal foam material, said metal foam material being one of a plurality of metal foam materials with different elastic properties in said pressure element;
said configuration having an inside and an outside disposed along a central axis, said metal foam materials in said pressure element forming partial regions, and said partial regions each having a different stiffness rising from said inside to said outside along said central axis of said configuration.

9. The clamping assembly according to claim 8 , wherein said central axis extends in a clamping direction of the clamping assembly.

Assignees

• Siemens Ag

Inventors

• Brehm Holger Siegmund
• Boehm Matthias
• Schmitt Daniel

Classifications

• H03K17/567 Primary

  Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W40/613 Primary

  for stacked arrangements of a plurality of semiconductor devices · CPC title