Sample supporting body and method of manufacturing sample supporting body

Patent metadata

Field	Value
Publication number	US-10103016-B2
Application number	US-201615540579-A
Country	US
Kind code	B2
Filing date	Aug 26, 2016
Priority date	Sep 3, 2015
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A sample support according to an aspect is a sample support for a surface-assisted laser desorption/ionization method, and includes: a substrate in which a plurality of through-holes passing from one surface thereof to the other surface thereof are provided; and a conductive layer that is formed of a conductive material and covers at least the one surface. The through-holes have a width of 1 to 700 nm, and the substrate has a thickness of 1 to 50 μm.

First claim

The invention claimed is:

1. A sample support for a surface-assisted laser desorption/ionization method comprising:
a substrate in which a plurality of through-holes passing from one surface thereof to the other surface thereof are provided; and
a conductive layer formed of a conductive material and configured to cover at least a portion of the one surface not provided with the through-holes so that each opening of the through-holes is not covered by the conductive layer,
wherein the through-holes have a width of 1 to 700 nm, and
the substrate has a thickness of 1 to 50 μm.

2. The sample support according to claim 1 , further comprising a frame mounted on an outer edge of the substrate.

3. The sample support according to claim 2 , wherein the conductive layer covers at least a portion of the one surface not provided with the through-holes, and a surface of the frame.

4. The sample support according to claim 2 , wherein:
the frame has a portion extending beyond the outer edge of the substrate; and
insertion holes for inserting screws are provided in the portion extending outside.

5. The sample support according to claim 2 , further comprising adhesive tape having an adhesive face and stuck on an outer edge of the frame such that the adhesive face faces the one surface of the substrate,
wherein the adhesive tape has a portion extending beyond the outer edge of the substrate.

6. The sample support according to claim 5 , wherein:
the conductive layer covers at least a portion of the one surface not provided with the through-holes, and a surface of the frame; and
the adhesive tape has conductivity and is stuck on a portion of the conductive layer covering the surface of the frame.

7. The sample support according to claim 1 , further comprising an adhesive layer provided at an outer edge of the other surface of the substrate and having an adhesive face facing a direction directed from the one surface to the other surface.

8. The sample support according to claim 1 , further comprising an adhesive tape having an adhesive face and stuck on an outer edge of the one surface such that the adhesive face faces the one surface of the substrate,
wherein the adhesive tape has a portion extending beyond the outer edge of the substrate.

9. The sample support according to claim 1 , wherein the substrate is formed by anodizing a valve metal or silicon.

10. The sample support according to claim 1 , wherein the conductive layer is configured to show a diffraction peak of a crystal of the conductive material in X-ray diffraction measurement.

11. The sample support according to claim 1 , wherein the substrate has a thickness of 5 to 10 μm.

12. A sample support for a surface-assisted laser desorption/ionization method comprising
a substrate which is formed of a conductive material and in which a plurality of through-holes passing from one surface thereof to the other surface thereof are provided;
wherein the through-holes have a width of 1 to 700 nm, and
the substrate has a thickness of 1 to 50 μm.

13. A manufacturing method of a sample support for a surface-assisted laser desorption/ionization method, the manufacturing method comprising:
a first process of anodizing a valve metal or silicon to obtain a substrate in which a plurality of through-holes passing from one surface thereof to the other surface thereof are provided; and
a second process of providing a conductive layer formed of a conductive material to cover at least a portion of the one surface not provided with the through-holes,
wherein the through-holes have a width of 1 to 700 nm, and
the substrate has a thickness of 1 to 50 μm.

14. The manufacturing method according to claim 13 , further comprising a baking process of baking the sample support having the substrate and the conductive layer after the second process.

15. A manufacturing method of a sample support for a surface-assisted laser desorption/ionization method, the manufacturing method comprising:
a first process of anodizing a valve metal or silicon to obtain a substrate in which a plurality of through-holes passing from one surface thereof to the other surface thereof are provided;
a second process of mounting a frame on an outer edge of the substrate obtained in the first process; and
a third process of providing a conductive layer formed of a conductive material to cover at least a portion of the one surface not provided with the through-holes, and a surface of the frame,
wherein the through-holes have a width of 1 to 700 nm, and
the substrate has a thickness of 1 to 50 μm.

16. The manufacturing method according to claim 15 , further comprising a baking process of baking the sample support having the substrate, the frame, and the conductive layer after the third process.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Naito Yasuhide
• Kotani Masahiro
• Ohmura Takayuki

Classifications

• B01L2300/0819

  Microarrays; Biochips · CPC title

• H01J49/0418 Primary

  for laser desorption, e.g. matrix-assisted laser desorption/ionisation [MALDI] plates or surface enhanced laser desorption/ionisation [SELDI] plates · CPC title

• B01L3/5027

  by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip · CPC title

• G01N27/62

  by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode · CPC title

• H01J49/0004

  Imaging particle spectrometry · CPC title