Plasma processing apparatus with gas feed and evacuation conduit

Patent metadata

Field	Value
Publication number	US-10103007-B2
Application number	US-201514626952-A
Country	US
Kind code	B2
Filing date	Feb 20, 2015
Priority date	Aug 26, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A sample stage includes plural pushup pins that move a sample up/down above the stage, a recessed and protruding dielectric film on which the sample is loaded, a feeding port disposed on the film and through which gas is fed to a gap between the sample and the film, and openings of through-holes in which the pushup pins are housed, and the stage is connected to a feeding and evacuation conduit including a feeding path that communicates with the port and through which gas fed to the gap flows, an evacuation path that communicates with the opening and through which gas fed to the gap is discharged, and a connection path through which the feeding path and the evacuation path communicate. With communication between the feeding path and the evacuation path via the connection path interrupted, gas from the feeding path is fed to the gap and into the through-hole via the gap.

First claim

The invention claimed is:

1. A plasma processing apparatus that uses plasma generated in a processing chamber in a vacuum container to process a sample electrostatically attracted onto a sample stage disposed in the processing chamber, the sample stage comprising:
a plurality of pushup pins that move the sample up and down above the sample stage;
a recessed and protruding dielectric film on which the sample is loaded;
a feeding port disposed on the dielectric film and through which gas is fed to a gap between the sample and the dielectric film;
a plurality of through-holes in each of which each of the plurality of pushup pins are housed, each of the plurality of through-holes having openings wherein each opening is disposed in an upper surface of the dielectric film;
a plurality of bellows each of which is disposed below the sample stage and surrounding a lower portion of each of the pushup pins to separate an internal space including each of the pushup pins and the through-hole from an outside in an air-tight manner; and
a feeding and evacuation conduit which is connected to the sample stage, the feeding and evacuation conduit comprising a feeding path, and an evacuation path and a bypass conduit, where the feeding path communicates with the feeding port for the gas and a gas source and through which the gas fed to the gap flows, wherein the evacuation path communicates with a space inside the bellows and through which the gas fed to the gap is discharged, wherein the feeding path and the evacuation path communicated through the gap which provides a connection path, and an upstream valve disposed on the evacuation path between the space inside the bellows and an intersection portion of the evacuation path and the bypass conduit which connects the evacuation path with the feeding path at a lower portion of the sample stage,
wherein the plasma processing apparatus is configured to close the upstream valve such that communication between the feeding path and the evacuation path via the connection path is interrupted while the gas from the feeding path is fed to the gap and into the through-hole via the gap.

2. The plasma processing apparatus according to claim 1 , further comprising a feeding valve which is disposed on the feeding path between the gas source and the intersection portion of the feeding path and the bypass conduit which connects the evacuation path with the feeding path at the lower portion of the sample stage, and the plasma processing apparatus is further configured to open the upstream valve and to close the feeding valve so that the feeding path and the evacuation path are in communication with each other via the connection path while the gas is in the gap and the space inside the bellows including the through-hole is evacuated through the evacuation path.

3. The plasma processing apparatus according to claim 1 , wherein the dielectric film comprises a ring-like outer peripheral protruding portion that encloses an outer periphery of the gap and comes into abutting contact with a back surface of the sample and a ring-like protruding portion for the through-hole which encloses an outer periphery of the opening of the through-hole, and with the sample loaded on the dielectric film, a gap is formed between an upper surface of the protruding portion for the through-hole and the back surface of the sample.

4. The plasma processing apparatus according to claim 1 , wherein, when the gas is evacuated, a pressure of the gas in the gap is set higher than a pressure of the gas in the through-hole.

5. A plasma processing apparatus that uses plasma generated in a processing chamber in a vacuum container to process a sample electrostatically attracted onto a sample stage disposed in the processing chamber,
the sample stage comprising:
a plurality of pushup pins that move the sample up and down above the sample stage;
a recessed and protruding dielectric film on which the sample is located;
a feeding port disposed on the dielectric film and through which gas is fed to a gap between the sample and the dielectric film;
a plurality of through-holes in each of which each of the plurality of pushup pins are housed, each of the plurality of through-holes having openings wherein each opening is disposed in an upper surface of the dielectric film;
a plurality of bellows each of which is disposed below the sample stage and surrounding a lower portion of each of the pushup pins to separate an internal space including each of the pushup pins and the through-hole from an outside in an air-tight manner; and
a feeding and evacuation conduit which is connected to the sample stage, the feeding and evacuation conduit comprising a feeding path, and an evacuation path and a bypass conduit wherein the feeding path communicates with the feeding port for the gas and a gas source and through which the gas fed to the gap flows, wherein the evacuation path communicates with a space inside the bellows and an evacuation unit and through which the gas fed to the gap is discharged, wherein the feeding path and the evacuation path communicates through the gap which provides a connection path,
wherein the dielectric film further comprises a seal disposed on the connection path and a downstream valve disposed on the evacuation path between the evacuation unit and an intersection portion of the evacuation path and a bypass conduit which connects the evacuation path with the feeding path at a lower portion of the sample stage,
wherein the plasma processing apparatus is configured to close the downstream valve such that communication between the feeding path and the evacuation path via the connection path is interrupted while the gas from the feeding path is fed to the gap and into the through-hole via the gap.

6. The plasma processing apparatus according to claim 5 , further comprising a feeding valve which is disposed on the feeding path between the gas source and the intersection portion of the feeding path and the bypass conduit which connects the evacuation path with the feeding path at the lower portion of the sample stage, and the plasma processing apparatus is further configured open the downstream valve and to close the feeding valve so that the feeding path and the evacuation path are in communication with each other via the connection path while the gas is in the gap and the space inside the bellows including the through-hole is evacuated through the evacuation path.

7. The plasma processing apparatus according to claim 5 , wherein the seal is a ring-like outer peripheral protruding portion of the dielectric film that encloses an outer periphery of the gap and comes into abutting contact with a back surface of the sample and includes another ring-like protruding portion of the dielectric film for the through-hole which encloses an outer periphery of the opening of the through-hole, and with the sample loaded on the dielectric film, a gap is formed between an upper surface of the protruding portion for the through-hole and the back surface of the sample.

8. The plasma processing apparatus according to claim 5 , wherein, when the gas is evacuated, a pressure of the gas in the gap is set higher than a pressure of the gas in the through-hole.

Assignees

• Hitachi High Tech Corp

Inventors

• Tandou Takumi
• Makino Akitaka

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H01J37/32678

  Electron cyclotron resonance · CPC title

• H01J37/32192

  Microwave generated discharge (H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence) · CPC title

• H01J37/3244 Primary

  Gas supply means · CPC title

• H01L21/6831

  Electricity · mapped topic