Multilayer capacitor with an overcurrent protection device

Patent metadata

Field	Value
Publication number	US-10102971-B2
Application number	US-201615286122-A
Country	US
Kind code	B2
Filing date	Oct 5, 2016
Priority date	Oct 8, 2015
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

First claim

What is claimed is:

1. An electronic component comprising:
a multilayer capacitor;
an overcurrent protection device;
a first substrate;
a first metal terminal; and
a second metal terminal,
wherein the multilayer capacitor includes:
a first element body;
a first internal electrode and a second internal electrode that are disposed in the first element body, and opposing each other;
a first external electrode disposed at one end portion of the first element body, and connected with the first internal electrode; and
a second external electrode disposed at another one end portion of the first element body, and connected with the second internal electrode,
wherein the overcurrent protection device includes:
a second element body;
a protection circuit element disposed in the second element body;
a third external electrode disposed at one end portion of the second element body, and connected with the protection circuit element; and
a fourth external electrode disposed at another one end portion of the second element body, and connected with the protection circuit element,
wherein the first substrate includes:
a substrate main body having a first principal surface and a second principal surface opposing each other in a first direction;
a first connection electrode disposed on the first principal surface, and connected with the first external electrode;
a second connection electrode disposed on the first principal surface, and connected with the second external electrode;
a third connection electrode disposed on the second principal surface, and connected with the third external electrode; and
a fourth connection electrode disposed on the second principal surface, and connected with the fourth external electrode; and
wherein the first metal terminal includes:
a first connection portion fixed to one end portion side of the first substrate in a second direction orthogonal to the first direction, and electrically connected with the first connection electrode; and
a first leg portion extending from the first connection portion,
wherein the second metal terminal includes:
a second connection portion fixed to another one end portion side of the first substrate in the second direction, and electrically connected with the fourth connection electrode; and
a second leg portion extending from the second connection portion,
wherein the multilayer capacitor is disposed on the first principal surface side of the first substrate, and the overcurrent protection device is disposed on the second principal surface side of the first substrate, and
wherein the second connection electrode and the third connection electrode are electrically connected to each other.

2. The electronic component according to claim 1 ,
wherein the multilayer capacitor is disposed closer to the first and second leg portions than the first substrate, and
wherein the first external electrode is connected with the first leg portion.

3. The electronic component according to claim 1 ,
wherein the overcurrent protection device is disposed closer to the first and second leg portions than the first substrate, and
wherein the fourth external electrode is connected with the second leg portion.

4. The electronic component according to claim 1 ,
wherein one of the multilayer capacitor and the overcurrent protection device is smaller than another one, and
wherein the one of the multilayer capacitor and the overcurrent protection device is disposed closer to the first and second leg portions than the first substrate.

5. The electronic component according to claim 4 ,
wherein the first leg portion and the second leg portion each include a mounted region extending in a direction in which the first leg portion and the second leg portion oppose each other, and
wherein the one of the multilayer capacitor and the overcurrent protection device does not overlap each of the mounted regions when viewed in the first direction.

6. The electronic component according to claim 1 ,
wherein the first connection portion and the second connection portion each include a connection region that opposes the first substrate in the first direction and extends in a direction in which the first connection portion and the second connection portion oppose each other,
wherein the connection region of the first connection portion is fixed to the one end portion side of the first substrate, and
wherein the connection region of the second connection portion is fixed to the other one end portion side of the first substrate.

7. The electronic component according to claim 6 ,
wherein the first element body and the second element body have a rectangular parallelepiped shape,
wherein one of the multilayer capacitor and the overcurrent protection device is disposed closer to the first and second leg portions than the first substrate,
wherein a length in a longitudinal direction of the one of the multilayer capacitor and the overcurrent protection device is equal to or smaller than a length in a width direction of another one, and
wherein the multilayer capacitor and the overcurrent protection device are disposed in such a manner that a longitudinal direction of the first element body and a longitudinal direction of the second element body intersect with each other.

8. The electronic component according to claim 1 ,
wherein the first connection portion and the second connection portion each include at least a pair of connection regions that oppose each other and extend in a direction in which the first connection portion and the second connection portion oppose each other,
wherein the one end portion of the first substrate is fitted between at least the pair of connection regions of the first connection portion, and
wherein the other one end portion of the first substrate is fitted between at least the pair of connection regions of the second connection portion.

9. The electronic component according to claim 8 ,
wherein the first element body and the second element body have a rectangular parallelepiped shape,
wherein one of the multilayer capacitor and the overcurrent protection device is disposed closer to the first and second leg portions than the first substrate,
wherein a length in a longitudinal direction of the one of the multilayer capacitor and the overcurrent protection device is equal to or smaller than a length in a width direction of another one, and
wherein the multilayer capacitor and the overcurrent protection device are disposed in such a manner that a longitudinal direction of the first element body and a longitudinal direction of the second element body intersect with each other.

10. The electronic component according to claim 1 ,
wherein the multilayer capacitor is disposed closer to the first and second leg portions than the first substrate,
wherein the first element body includes a first side surface opposing the first principal surface of the substrate main body, a second side surface opposing the first side surface in the first direction, and first and second end surfaces opposing each other in the second direction,
wherein the first external electrode includes electrode portions disposed on the first side surface, the second side surface, and the first end surface,
wherein the second external electrode includes electrode portions disposed on the first side surface, the second side surface, and the second end surface, and
wherein the electrode portion of the first external electrode that is disposed on the second side surface, and the respective electrode portions of the second external electrode that are disposed on the second side surface and the second end surface are covered with an insulator.

Assignees

• Tdk Corp

Inventors

• Ando Norihisa
• Mori Masahiro
• Masuda Sunao
• Kusano Kayou

Classifications

• H01G4/1236

  based on zirconium oxides or zirconates (H01G4/1263 takes precedence) · CPC title

• H01G4/002 Primary

  Details · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/242

  the capacitive element surrounding the terminal · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title