Heat dissipation unit of handheld electronic device

Patent metadata

Field	Value
Publication number	US-10101779-B2
Application number	US-201314103000-A
Country	US
Kind code	B2
Filing date	Dec 11, 2013
Priority date	Dec 11, 2013
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A heat dissipation unit of handheld electronic device is applied to and assembled with a handheld electronic device. The heat dissipation unit includes a main body having a heat absorption section and a heat dissipation section respectively disposed on two sides of the main body. The heat absorption section is made of ceramic material. The heat dissipation section is a heat dissipation conductor. The heat absorption section and the heat dissipation section are respectively correspondingly positioned in the handheld electronic device and outside the handheld electronic device. The heat generated inside the handheld electronic device can be quickly conducted from the ceramic-made heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device. Accordingly, the lifetime of the handheld electronic device is prolonged and the efficiency of the handheld electronic device is enhanced.

First claim

What is claimed is:

1. A heat dissipation unit of a handheld electronic device comprising a cover having a ceramic layer and a heat dissipation layer, the ceramic layer being made of ceramic material having properties of heat-resistance and low thermal expansion coefficient, the heat dissipation layer being a heat dissipation conductor, wherein the cover is assembled with a handheld electronic device, the ceramic layer and the heat dissipation layer being respectively positioned in the handheld electronic device and outside the handheld electronic device and the ceramic layer being in direct contact with a heat source so that heat generated inside the handheld electronic device is directly absorbed and conducted from the ceramic layer to the heat dissipation layer for dissipating, wherein the heat generated by the heat source is transferred from the ceramic layer to the heat dissipation layer by way of contact conduction.

2. The heat dissipation unit of the handheld electronic device as claimed in claim 1 , wherein the handheld electronic device further has a case with a receiving space, at least one side of the receiving space being an open side, at least one heat source being disposed in the receiving space, the cover being correspondingly mated with the case to close the receiving space, the ceramic layer of the cover being correspondingly disposed in the receiving space in attachment to the heat source, the heat dissipation layer of the cover being correspondingly positioned outside the case.

3. The heat dissipation unit of the handheld electronic device as claimed in claim 1 , wherein the handheld electronic device is a mobile phone or a tablet.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Yang Hsiu-Wei

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title