Resin, resist composition and method for producing resist pattern

Patent metadata

Field	Value
Publication number	US-10101657-B2
Application number	US-201615085443-A
Country	US
Kind code	B2
Filing date	Mar 30, 2016
Priority date	Mar 31, 2015
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A resist composition contains: a resin having an acid-labile group, a resin having a structural unit represented by formula (I), an acid generator, and a solvent;

wherein R i41 represents a hydrogen atom or a methyl group, R i42 represents a C 1 to C 10 hydrocarbon group that may be substituted with a hydroxy group, a C 2 to C 7 acyl group or a hydrogen atom, R i43 in each occurrence independently represents a C 1 to C 6 alkyl group or a C 1 to C 6 alkoxy group, “p” represents an integer of 0 to 4, Z represents a divalent C 3 to C 20 hydrocarbon group having a group represented by formula (Ia), and a methylene group contained in the hydrocarbon group may be replaced by an oxygen atom, a sulfur atom or a carbonyl group, *—[(CH 2 ) w —O] r — (Ia): wherein “w” and “r” each independently represents an integer of 1 to 10, and * represent a bonding position.

First claim

What is claimed is:

1. A resist composition comprising:
a resin having an acid-labile group but not having a structural unit represented by formula (I),
a resin consisting of the structural unit represented by formula (I) and a structural unit selected from the group consisting of a structural unit represented by formula (a2-1), a structural unit represented by formula (a2-2) and a structural unit represented by formula (a2-3),
an acid generator, and
a solvent:

wherein R i41 represents a hydrogen atom or a methyl group,
R i42 represents a C 2 to C 7 acyl group or a hydrogen atom, or a C 1 to C 10 hydrocarbon group in which a hydrogen atom can be replaced by a hydroxy group,
R i43 in each occurrence independently represents a C 1 to C 6 alkyl group or a C 1 to C 6 alkoxy group,
“p” represents an integer of 0 to 4,
Z represents a divalent C 3 to C 20 hydrocarbon group having a group represented by formula (Ia), and a methylene group contained in the hydrocarbon group may be replaced by an oxygen atom, a sulfur atom or a carbonyl group:
*—[(CH 2 ) w —O] r —  (Ia)

wherein “w” and “r” each independently represents an integer of 1 to 10, and
* represent a bonding position, provided that R i42 represents a C 2 to C 7 acyl group when “w” represents 1,

where R a7 , R a8 and R a9 each independently represent a hydrogen atom or a methyl group,
R a10 in each occurrence independently represents a C 1 to C 6 alkyl group or a C 1 to C 6 alkoxy group,
m′ represents an integer of 0 to 4,
R a11 represents a hydrogen atom, a C 1 to C 10 primary or secondary hydrocarbon group,
R a12 represents a C 1 to C 6 primary or secondary alkyl group,
L a1 represents a C 2 to C 6 alkanediyl group where the carbon atom bonding to an oxygen atom is a primary or secondary carbon atom, and
n represents an integer of 1 to 30; and
wherein the structural unit represented by formula (I) is a structural unit represented by formula (I-1) or formula (I-2):

wherein R i41 represents a hydrogen atom or a methyl group,
R i42 represents a C 1 to C 10 hydrocarbon group that may be substituted with a hydroxy group, a C 2 to C 7 acyl group or a hydrogen atom,
R i43 in each occurrence independently represents a C 1 to C 6 alkyl group or a C 1 to C 6 alkoxy group,
“p” represents an integer of 0 to 4,
R i44 represents a C 1 to C 10 hydrocarbon group,
“r” represents an integer of 1 to 10, and
R i45 represents a C 1 to C 10 hydrocarbon group that may be substituted with a hydroxy group, a C 2 to C 7 acyl group or a hydrogen atom.

2. The resist composition according to claim 1 wherein
the resin having an acid-labile group is a resin having a structural unit represented by formula (a1-2):

wherein R a5 represents a hydrogen atom or a methyl group,
R a1′ and R a2′ each independently represent a hydrogen atom or a C 1 to C 12 hydrocarbon group, R a33′ represents a C 1 to C 20 hydrocarbon group, or R a1′ represents a hydrogen atom or a C 1 to C 12 hydrocarbon group, and R a2′ and R a33′ are bonded together with a carbon atom and an oxygen atom bonded thereto to form a divalent heterocyclic group having 2 to 20 carbon atoms, and a methylene group contained in the hydrocarbon group represented by R a1′ and R a2′ or the divalent heterocyclic group may be replaced by an oxygen atom or a sulfur atom,
R a6 in each occurrence independently represents a C 1 to C 6 alkyl group or a C 1 to C 6 alkoxy group, and
“mz” represents an integer of 0 to 4.

3. The resist composition according to claim 1 wherein
the acid generator is a compound having a group represented by formula (B1):

wherein R b1 represents a C 1 to C 18 hydrocarbon group in which a hydrogen atom may have a fluorine atom and in which a methylene group may be replaced by an oxygen atom or a carbonyl group.

4. A method for producing a resist pattern comprising steps (1) to (4):
(1) applying the resist composition according to claim 1 onto a substrate;
(2) drying the applied composition to form a composition layer;
(3) exposing the composition layer; and
(4) developing the exposed composition layer.

5. A resin comprising a structural unit represented by formula (1-2):

wherein R i41 represents a hydrogen atom or a methyl group,
R i43 in each occurrence independently represents a C 1 to C 6 alkyl group or a C 1 to C 6 alkoxy group,
“p” represents an integer of 0 to 4,
R i44 represents a C 1 to C 10 hydrocarbon group,
“r” represents an integer of 1 to 10, and
R i45 represents a C 1 to C 10 hydrocarbon group that may be substituted with a hydroxy group, a C 2 to C 7 acyl group or a hydrogen atom.

Assignees

• Sumitomo Chemical Co

Inventors

• Sugihara Masako
• Nishimura Takashi

Classifications

• G03F7/00

  Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K) · CPC title

• G03F7/004 Primary

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0397

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title