Current sensor

Patent metadata

Field	Value
Publication number	US-10101368-B2
Application number	US-201515321327-A
Country	US
Kind code	B2
Filing date	Jun 26, 2015
Priority date	Jun 27, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A current sensor includes: a conductor through which a current to be measured flows; magnetoelectric conversion elements disposed near the conductor; and an isolating member for supporting the magnetoelectric conversion elements, and the conductor is disposed so as not to contact with the isolating member and not to support the isolating member.

First claim

The invention claimed is:

1. A current sensor comprising:
a conductor through which a current to be measured flows;
a first magnetoelectric conversion element disposed near the conductor;
a second magnetoelectric conversion element disposed on the opposite side of the first magnetoelectric conversion element across the conductor;
an isolating member for supporting the first and second magnetoelectric conversion elements; and
a metal plate isolated from the conductor, and wherein:
the isolating member is not supported by the conductor, but is supported by the metal plate, and
a part of the conductor has a level difference, and the conductor is disposed so as not to contact with the isolating member by the level difference.

2. The current sensor according to claim 1 , further comprising a mold member for molding the conductor, the first magnetoelectric conversion element, the second magnetoelectric conversion element, the isolating member and the metal plate, and wherein:
the metal plate is in contact with the isolating member, and
a part of the metal plate is exposed from the mold member.

3. The current sensor according to claim 2 , further comprising a signal processing IC disposed on the metal plate, and
wherein the first magnetoelectric conversion element and the second magnetoelectric conversion element are electrically connected to the signal processing IC.

4. The current sensor according to claim 3 , wherein the signal processing IC is configured to cancel an effect of an externally generated magnetic field to calculate a current value on the basis of a difference between respective outputs of the first magnetoelectric conversion element and the second magnetoelectric conversion element.

5. The current sensor according to claim 1 , wherein a space between the conductor and the isolating member is filled with mold resin.

6. The current sensor according to claim 1 , wherein the first magnetoelectric conversion element and the second magnetoelectric conversion element are die-bonded to the isolating member using a die attach film.

7. The current sensor according to claim 1 , wherein in a plan view the metal plate includes a concave part formed in a recessed manner on the opposite side of the conductor, and a protruding part provided on the both ends of the concave part and protruding toward the conductor, and
in the plan view the conductor includes a convex part formed along the concave part and the protruding part of the metal plate, respectively.

8. The current sensor according to claim 7 , wherein the conductor is formed so as to surround the first magnetoelectric conversion element, and
the second magnetoelectric conversion element is disposed outside the conductor formed so as to surround the first magnetoelectric conversion element.

9. The current sensor according to claim 1 , wherein each of a magnetosensitive part of the first magnetoelectric conversion element and a magnetosensitive part of the second magnetoelectric conversion element is provided between an upper surface and a lower surface of the conductor in a perpendicular direction of a plane with the conductor.

10. The current sensor according to claim 1 , wherein the following equations are satisfied:
10 μm>g>d1 μm  (1)

10 μm>g>d2 μm  (2)

where g is a distance between the conductor and the isolating member, d 1 is a thickness of the first magnetoelectric conversion element, and d 2 is a thickness of the second magnetoelectric conversion element.

11. The current sensor according to claim 1 , wherein each of a distance w between the conductor and the first magnetoelectric conversion element and a distance w between the conductor and the second magnetoelectric conversion element is not less than 50 μm and not more than 150 μm, in a plan view.

12. The current sensor according to claim 1 , wherein the isolating member is an isolating tape or an isolating sheet applied with adhesive.

Assignees

• Asahi Kasei Microdevices Corp

Inventors

• Koiwa Yosuke
• Takatsuka Toshinori
• Imajo Hideto
• Suzuki Kenji

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• G01R15/205

  using magneto-resistance devices, e.g. field plates · CPC title

• G01R15/20 Primary

  using galvano-magnetic devices, e.g. Hall-effect devices {, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices} · CPC title

• G01R15/207 Primary

  Constructional details independent of the type of device used · CPC title