Substrate joining method using rivet, and joining structure
US-9555466-B2 · Jan 31, 2017 · US
US10100863B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10100863-B2 |
| Application number | US-201615221046-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 27, 2016 |
| Priority date | Jul 27, 2016 |
| Publication date | Oct 16, 2018 |
| Grant date | Oct 16, 2018 |
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An external thermal heat-stake arrangement includes a polymeric base member having a collared heat-stake having an inner diameter and a second member disposed within the inner diameter of the collared heat-stake. The collared heat-stake is operatively configured to be deformed by a heated element to retain at least a portion of a peripheral edge of the second member to the polymeric base member.
Opening claim text (preview).
What is claimed is: 1. An external thermal heat-stake arrangement comprising: a polymeric base member including a collared heat-stake having an inner diameter, an outer diameter, and a thickness in between the inner and outer diameters; and a retention component disposed within the inner diameter of the collared heat-stake wherein the collared heat-stake is operatively configured to be deformed by a heated element to retain a peripheral edge of the retention component to the polymeric base member; wherein the polymeric base member further includes a base portion for the collared heat-stake and the retention component is a PALNUT®.
Hollow rivets; Multi-part rivets · CPC title
by deforming the material of the support, e.g. the sheet or plate · CPC title
using heated tools · CPC title
of different hardness, i.e. the hardness of one of the parts to be joined being different from the hardness of the other part · CPC title
for bolts or shafts without holes, grooves, or notches for locking members {(by rings resilient in their plane F16B21/18)} · CPC title
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