Adhesive having structural integrity and insulative properties

US10100231B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10100231-B2
Application numberUS-201715475685-A
CountryUS
Kind codeB2
Filing dateMar 31, 2017
Priority dateSep 10, 2010
Publication dateOct 16, 2018
Grant dateOct 16, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.

First claim

Opening claim text (preview).

The invention claimed is: 1. An article comprising a first substrate, a second substrate, and an adhesive composition interposed between the two substrates comprising: (a) about 50 to about 99.9 weight percent, on a dry weight basis, of an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof; (b) about 0.1 to about 10 weight percent, on a dry weight basis, of a plurality of expandable microspheres; (c) water; and (d) optionally, plasticizer and/or preservative; wherein the volume of the microspheres is greater than 200% in the dry adhesive upon expanding the microsphere. 2. The article of claim 1 wherein the first and the second substrate are selected from the group consisting of fiberboard, corrugated board, solid bleached boards, kraft paper, coated paper or oriented polypropylene film. 3. The article of claim 2 wherein the first and the second substrate are haft paper or coated paper. 4. The article of claim 2 wherein the boards and papers comprise a portion of recycled fiber. 5. The article of claim 1 , wherein the emulsion-based polymer is selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate. 6. The article of claim 1 , wherein the plurality of microspheres are present in an amount of from about 0.5 wt % to about 5 wt %, based on the total (wet) weight of the adhesive. 7. The article of claim 6 , wherein the microspheres are expandable polymeric microspheres. 8. The article of claim 1 , wherein the adhesive further comprises a crosslinker, filler, pigment, dye, stabilizer, rheology modifier, polyvinyl alcohol, humectant and the mixtures thereof. 9. The article of claim 1 , wherein the adhesive further comprises an accelerator that is a multivalent water-soluble salt. 10. The article of claim 9 , wherein the accelerator is selected from the group consisting of aluminum nitrate, zirconium acetate, ammonium zirconyl carbonate and mixtures thereof. 11. The article of claim 1 , which is selected from the group consisting of a cup, food container, case, carton, bag, box, lid, envelope, wrap or clamshell.

Assignees

Inventors

Classifications

  • Chemistry & Metallurgy · mapped topic

  • formed of different materials, e.g. laminated or foam filling between walls; (for shock absorbing purposes B65D81/1275) · CPC title

  • Packing paper (packaging materials of special type or form B65D65/38) · CPC title

  • Encapsulated ingredients · CPC title

  • being spherical, e.g. microcapsules, beads · CPC title

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Frequently asked questions

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What does patent US10100231B2 cover?
An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.
Who is the assignee on this patent?
Henkel IP & Holding GmbH
What technology area does this patent fall under?
Primary CPC classification C09J11/08. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).