Structured adhesive layer

US10100227B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10100227-B2
Application numberUS-201314424270-A
CountryUS
Kind codeB2
Filing dateAug 29, 2013
Priority dateAug 29, 2012
Publication dateOct 16, 2018
Grant dateOct 16, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to the use of an adhesive tape to adhesively bond printing plates, during which the impairment of the adhesive bonds by air bubble inclusions between the adhesive tape and a substrate should be reduced. This is achieved by using an adhesive tape comprising at least one adhesive layer, wherein the adhesive layer has at least one groove that does not extend to one of the edges of the adhesive layer, and the portion of the entire groove volume of the adhesive layer that is associated with such grooves is more than 50%.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method comprising bonding a printing plate to a substrate with an adhesive tape, wherein the adhesive tape comprises at least one pressure-sensitively adhesive layer, wherein the adhesive layer has one or more grooves that do not extend to one of the edges of the adhesive layer, and wherein the adhesive layer does not have any grooves that extend to one of the edges of the adhesive layer. 2. The method as claimed in claim 1 , wherein the proportion of the total groove volume of the adhesive layer that is accounted for by such grooves that do not extend to one of the edges of the adhesive layer is more than 70%. 3. The method as claimed in claim 1 , wherein the printing plates are flexographic printing plates. 4. The method as claimed in claim 1 , wherein the nongrooved surface area of the adhesive layer is 50% to 99% of the total surface area of the adhesive layer. 5. The method as claimed in claim 1 , wherein the depth of the grooves that do not extend to one of the edges of the adhesive layer is 10 to 100 μm. 6. The method as claimed in claim 1 , wherein the width of the grooves that do not extend to one of the edges of the adhesive layer is 10 to 200 μm. 7. The method as claimed in claim 1 , wherein the grooves that do not extend to one of the edges of the adhesive layer are permanent grooves. 8. The method as claimed in claim 1 , wherein grooves of the adhesive layer have been obtained by embossing using a release liner having a complementary surface structure. 9. A method comprising bonding a printing plate to a substrate with an adhesive tape, wherein the adhesive tape comprises: (a) a pressure-sensitively adhesive layer; (b) a stabilizing film layer; (c) a foam layer; and either: (d1) a laminating adhesive between the stabilizing film layer and the foam layer; or (d2) a polyethylene layer or either side of the stabilizing film layer; wherein the pressure-sensitively adhesive layer has one or more grooves and no groove extends to one of the side edges of the adhesive layer. 10. The method as claimed in claim 9 , wherein the adhesive tape further comprises a grooved or ungrooved pressure-sensitive adhesive adhered to said foam layer. 11. The method as claimed in claim 10 , wherein the adhesive tape comprises the following layer sequence: grooved pressure-sensitive adhesive/stabilizing film/laminating adhesive/foam layer/grooved or ungrooved further pressure-sensitive adhesive.

Assignees

Inventors

Classifications

  • in the release coating · CPC title

  • by moulding material on preformed parts to be joined {(joining plastic parts by moulding B29C65/70)} · CPC title

  • by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title

  • C09J7/22Primary

    Plastics; Metallised plastics · CPC title

  • in the substrate · CPC title

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Frequently asked questions

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What does patent US10100227B2 cover?
The invention relates to the use of an adhesive tape to adhesively bond printing plates, during which the impairment of the adhesive bonds by air bubble inclusions between the adhesive tape and a substrate should be reduced. This is achieved by using an adhesive tape comprising at least one adhesive layer, wherein the adhesive layer has at least one groove that does not extend to one of the edg…
Who is the assignee on this patent?
Tesa Se
What technology area does this patent fall under?
Primary CPC classification C09J7/22. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).