Composition, connector, process for improving bonding between two or more means for conveying fluids, and system for conveying fluids

US10100170B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10100170-B2
Application numberUS-201314428402-A
CountryUS
Kind codeB2
Filing dateSep 20, 2013
Priority dateSep 28, 2012
Publication dateOct 16, 2018
Grant dateOct 16, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A composition comprising: (a) a thermoplastic polymer; (b) a plurality of particles, each said particle having core-shell structure and comprising, (i) a core comprising one or more magnetic materials and (ii) a shell comprising silicon dioxide; wherein the composition comprises particles (b) in an amount from 2 to 15 wt % is provided. Further provided is a connector comprising the composition, a system comprising the connector and a process for improving bonding between two or more means for conveying fluids.

First claim

Opening claim text (preview).

We claim: 1. A connector, wherein at least a portion of the connector comprises: a composition which comprises (a) a thermoplastic polymer comprising an ethylene-based polymer comprising units derived from ethylene and octene, and the ethylene-based polymer has a melt index, I 2 , from 0.001 g/10 min to 5 g/10 min, a density from 0.919 g/cm 3 to 0.959 g/cm 3 , and a melting point from 115° C. to 140° C.; (b) a plurality of particles, each said particle having a core-shell structure and comprising, (i) a core comprising one or more magnetic materials and (ii) a shell comprising silicon dioxide; wherein the composition comprises particles (b) in an amount from 2 to 15 wt %; wherein the connector is a first flange integral to a first thermoplastic pipe at an end of the first pipe; and the first flange abuts and is bonded to a second flange integral to a second thermoplastic pipe at an end of the second pipe. 2. The connector according to claim 1 , wherein the composition further comprises one or more additive selected from the group consisting of organic and/or inorganic pigments, organic and/or inorganic fillers, dyes, antioxidants, plasticizers, UV absorbers, carbon black, slip agents, fire retardants, and combinations of two or more thereof. 3. The connector according to claim 1 , wherein the cores of the particles comprise an iron oxide. 4. The connector according to claim 1 , wherein the particles (b) have an average diameter ranging from 30 to 70 nm. 5. The composition according to claim 1 , wherein the ethylene-based polymer has a melt index, I 2 , from 0.05 to 0.5 g/10 min. 6. The composition according to claim 5 , wherein the ethylene-based polymer has a density from 0.935 to 0.955 g/cm 3 . 7. The composition according to claim 1 , wherein the ethylene-based polymer has a melt index, I 2 , from 0.54 g/10 min to 0.56 g/10 min. 8. The connector of claim 1 , wherein the bonding between the first flange and the second flange can withstand fluid pressures up to 3,000 psig.

Assignees

Inventors

Classifications

  • Silicon-containing compounds · CPC title

  • with aliphatic 1-olefins containing one carbon-to-carbon double bond · CPC title

  • characterized by their specific function · CPC title

  • Silica · CPC title

  • Welded joints · CPC title

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Frequently asked questions

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What does patent US10100170B2 cover?
A composition comprising: (a) a thermoplastic polymer; (b) a plurality of particles, each said particle having core-shell structure and comprising, (i) a core comprising one or more magnetic materials and (ii) a shell comprising silicon dioxide; wherein the composition comprises particles (b) in an amount from 2 to 15 wt % is provided. Further provided is a connector comprising the composition,…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C08K5/0008. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).