Methods for joining components by heat staking

US10099423B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10099423-B2
Application numberUS-201514634752-A
CountryUS
Kind codeB2
Filing dateFeb 28, 2015
Priority dateFeb 28, 2015
Publication dateOct 16, 2018
Grant dateOct 16, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present technology discloses methods for joining a first workpiece and a second workpiece through a heat stake, and products formed thereby. The first workpiece has an aperture configured to receive a stud positioned on a second workpiece. The system is formed by applying energy to the first workpiece using electrodes, which indirectly heats the stud, at least partially softening material of the stud. Pressure is then applied to the softened material of the stud, and causing the material to form according to a predetermined geometry. After pressure is released, the stud forms a stake forming an interlocked joint connecting the workpieces.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, for joining a first workpiece to a second workpiece, the first workpiece having a first surface, a second surface opposite the first surface, and an aperture having a first width, the second workpiece having a third surface and a stud extending from the third surface, the method comprising: positioning the first workpiece adjacent the second workpiece with the second surface contacting the third surface and the stud extending through the aperture; positioning, axial to a centerline of the stud, an electrical-conducting punching device comprising (i) a first electrode arranged and configured to contact the first surface adjacent the aperture and adjacent the stud, (ii) a second electrode, connectably attached to and electrically isolated from the first electrode and arranged and configured to contact the first surface adjacent the aperture and adjacent the stud, and (iii) a punch movably positioned between the first electrode and the second electrode within the electrical-conducing punching device; applying energy using the first electrode to heat a first portion of the first surface of the first workpiece and the second electrode to heat a second portion of the first surface of the first workpiece, wherein the energy is applied to the first portion and the second portion to soften material of the stud; and compressing, using the punch, the softened material of the stud, yielding a stake forming a joint connecting the first workpiece and the second workpiece. 2. The method of claim 1 wherein the first electrode and the second electrode form a passage between them having a second width being greater than the first width. 3. The method of claim 1 wherein the punch includes a probe tip having a third width being greater than the first width. 4. The method of claim 1 wherein the punch includes a probe tip having a cavity of a first predetermined geometry, forming in the stake a convex head corresponding to the first predetermined geometry. 5. The method of claim 1 further comprising an insulator positioned between the first electrode and the second electrode to electrically isolate the first electrode and the second electrode. 6. The method of claim 1 wherein the first workpiece includes, at least partially surrounding the aperture, an embossed pattern having protrusions on the first surface and indentations on the second surface, the protrusions configured to enhance interlock between the first surface and the softened material of the stud when compared to interlock between the first surface and the softened material when protrusions are not present and the indentations configured to enhance interlock between the second surface and the third surface when compared to interlock between the second surface and the third surface when the indentations are not present. 7. The method of claim 1 further comprising positioning, between the first surface and an edge of a probe tip, a washer to contact the first surface. 8. A method, for joining a first workpiece to a second workpiece, the first workpiece having a first surface, a second surface opposite the first surface, and an aperture having a first width, the second workpiece having a third surface and a stud extending from the third surface, the method comprising: positioning the first workpiece adjacent the second workpiece with the second surface contacting the third surface and the stud extending through the aperture; positioning, axial to a centerline of the stud, an electrical-conducting punching device comprising (i) a first electrode arranged and configured to contact a first portion of the first surface adjacent the aperture and adjacent the stud, (ii) a second electrode arranged and configured to contact a second portion of the first surface adjacent the aperture and adjacent the stud, (iii) an insulator positioned between the first electrode and the second electrode, and (iv) a punch movably positioned between the first electrode and the second electrode within the electrical-conducing punching device; applying energy using the first electrode to heat the first portion of the first surface and the second electrode to heat the second portion of the first surface, wherein the energy applied to the first portion and the second portion to soften material of the stud; and compressing, using the punch, the softened material of the stud, yielding a stake forming a joint connecting the first workpiece and the second workpiece. 9. The method of claim 8 wherein the first electrode and the second electrode form a passage between them having a second width being greater than the first width. 10. The method of claim 8 wherein the punch includes a probe tip having a third width being greater than the first width. 11. The method of claim 8 wherein the punch includes a probe tip having a cavity of a first predetermined geometry, forming in the stake a convex head corresponding to the first predetermined geometry. 12. The method of claim 8 wherein the first workpiece includes, at least partially surrounding the aperture, an embossed pattern having protrusions on the first surface and indentations on the second surface, the protrusions configured to enhance interlock between the first surface and the softened material of the stud when compared to interlock between the first surface and the softened material when protrusions are not present and the indentations configured to enhance interlock between the second surface and the third surface when compared to interlock between the second surface and the third surface when the indentations are not present. 13. The method of claim 8 further comprising positioning, between the first surface and an edge of a probe tip, a washer to contact the first surface.

Assignees

Inventors

Classifications

  • Use of PC, i.e. polycarbonates {or derivatives thereof}, as moulding material · CPC title

  • to metals or their alloys · CPC title

  • Glass · CPC title

  • without the use of separate rivets · CPC title

  • Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate · CPC title

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What does patent US10099423B2 cover?
The present technology discloses methods for joining a first workpiece and a second workpiece through a heat stake, and products formed thereby. The first workpiece has an aperture configured to receive a stud positioned on a second workpiece. The system is formed by applying energy to the first workpiece using electrodes, which indirectly heats the stud, at least partially softening material o…
Who is the assignee on this patent?
Gm Global Tech Operations Llc
What technology area does this patent fall under?
Primary CPC classification B29C65/606. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).