Thermal management systems for electronics

Patent metadata

Field	Value
Publication number	US-10098260-B2
Application number	US-201615213212-A
Country	US
Kind code	B2
Filing date	Jul 18, 2016
Priority date	Jul 18, 2016
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

First claim

What is claimed is:

1. A refrigeration system for electronics, comprising:
a compressor configured to compress a refrigerant in the refrigeration system and disposed on a main line;
a condenser disposed downstream of the compressor on the main line;
an evaporator line in fluid communication with the main line downstream of the condenser, the evaporator line having an evaporator configured to receive heat into the refrigerant from an external heat source; and
an immersion line in fluid communication with main line downstream of the condenser, the immersion line having an immersion cooling container, the immersion cooling container configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

2. The system of claim 1 , wherein the evaporator line includes a first expansion valve and the immersion line includes a second expansion valve disposed in parallel with the first expansion valve, wherein the evaporator is downstream of the first expansion valve and the immersion cooling container is downstream of the second expansion valve, wherein the condenser is upstream of both of the first expansion valve and the second expansion valve.

3. The system of claim 2 , wherein the first expansion valve is different from the second expansion valve.

4. The system of claim 2 , further comprising a controller configured to actuate the first expansion valve and/or the second expansion valve.

5. The system of claim 4 , further comprising a liquid level sensor disposed in functional relationship with the immersion cooling container to sense a liquid level in the immersion cooling container.

6. The system of claim 5 , wherein the controller is operatively connected to the liquid level sensor to receive sensor readings from the liquid level sensor, wherein the controller is configured to control the second expansion valve as a function of the liquid level.

7. The system of claim 4 , further comprising a temperature sensor disposed in thermal communication with the evaporator and/or the evaporator line downstream of the evaporator to sense a temperature of the refrigerant.

8. The system of claim 7 , wherein the controller is operatively connected to the temperature sensor to receive sensor readings from the temperature sensor, wherein the controller is configured to actuate the first and/or second expansion valve as a function of the temperature.

9. The system of claim 7 , wherein the controller is operatively connected to the temperature sensor to receive sensor readings from the temperature sensor, wherein the controller is operatively connected to the compressor and configured to control a compressor speed as a function of the temperature.

10. The system of claim 2 , further comprising a flash tank disposed upstream of the first and second expansion valves and configured to partially expand the refrigerant.

11. The system of claim 10 , further comprising a flash tank orifice disposed upstream of the flash tank.

12. The system of claim 11 , further comprising a flash tank return valve configured to allow return flow to the compressor via a flash tank return line.

13. The system of claim 1 , further comprising a sub-cooler line in fluid communication with the main line downstream of the condenser, the sub-cooler line including a sub-cooler and a sub-cooler expansion valve disposed upstream of the sub-cooler, wherein the sub-cooler is in thermal communication with one or more of the main line, the evaporator line, or the immersion line and the sub-cooler line, wherein the sub-cooler is configured to cool the refrigerant upstream of the first expansion valve and the second expansion valve.

14. The system of claim 1 , wherein the electronics are aircraft electronics.

15. The system of claim 1 , wherein the external heat source is a fluid coolant line of an aircraft.

16. The system of claim 1 , wherein the compressor is a vapor cycle thermal management system compressor of an aircraft.

17. The system of claim 1 , wherein the refrigerant is a dielectric fluid.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Bouras Scott R
• Campbell Kris H
• Katsumata Shin
• Shepard Charles

Classifications

• H05K7/20881

  Liquid coolant with phase change · CPC title

• H05K7/20354

  Refrigerating circuit comprising a compressor · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K7/20309

  Evaporators · CPC title

• H05K7/203

  by immersion · CPC title