PCB current track cooling in electrical climate compressors

Patent metadata

Field	Value
Publication number	US-10098219-B2
Application number	US-201615217057-A
Country	US
Kind code	B2
Filing date	Jul 22, 2016
Priority date	Jul 23, 2015
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

An assembly and a method for maximizing the current-carrying capacity of conductor tracks and the current-carrying capacity of conductors on or within a circuit board, allows for the use of copper materials, and minimizes the costs of materials and production of the circuit board. The circuit board is connected via a housing with a coolant of a cryogenic device in order to provide heat extraction. The extraction of heat from the circuit board occurs by connecting the circuit board via a housing with a coolant of a cryogenic device.

First claim

What is claimed is:

1. An assembly for maximizing a current-carrying capacity of conductor tracks comprising:
a circuit board;
a plurality of conductor tracks arranged on or within the circuit board;
a refrigerant compressor having a housing and a coolant, a part of the housing configured to be cooled by the coolant; and
an elevation directly coupled to the circuit board and directly coupled to the part of the housing configured to be cooled by the coolant, the elevation thereby thermally coupling the circuit board and the part of the housing configured to be cooled by the coolant and maximizing the current-carrying capacity of the plurality of conductor tracks, wherein the elevation directly contacts a portion of the circuit board where the plurality of conductor tracks are located, and wherein the elevation is directly coupled to the circuit board using screws disposed between adjacent ones of the plurality of conductor tracks.

2. The assembly according to claim 1 , further comprising a housing cover and a clamp, wherein the housing cover presses the clamp against one side of the circuit board causing another side of the circuit board to be pressed against the elevation to directly couple the elevation to the circuit board.

3. The assembly according to claim 2 , wherein the clamp is non-conductive and mechanically resilient.

4. The assembly according to claim 3 , wherein the elevation is arranged along a contour of the plurality of conductor tracks and the elevation is electrically insulated from the conductor tracks.

Assignees

• Hanon Systems

Inventors

• Werker Stephan
• Gerberich Holger
• Lenz Mario

Classifications

• H05K1/0201 Primary

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K7/20218

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• H05K7/20418

  the radiating structures being additional and fastened onto the housing · CPC title

• H05K1/181

  associated with surface mounted components · CPC title