Method and apparatus for chip-on board flexible light emitting diode

Patent metadata

Field	Value
Publication number	US-10097228-B2
Application number	US-201615138027-A
Country	US
Kind code	B2
Filing date	Apr 25, 2016
Priority date	Apr 23, 2015
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

A lighting device is disclosed having a plurality of LED chips mounted on a single planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation. A heat sink having an arcuate surface shaped to approximate the arcuate orientation of the flexible substrate is coupled to the flexible substrate between complementary arcuate surfaces. A luminescent coating is disposed about a top surface of the arcuate single planar flexible substrate.

First claim

The invention claimed is:

1. A lighting device mounted in a hand-held flashlight, comprising:
a plurality of LED chips mounted on a continuous planar flexible substrate, wherein the continuous planar flexible substrate is disposed in an arcuate orientation forming a ring with a hollow center, wherein each of the plurality of LED chips comprises an imaginary axis normal to the continuous planar flexible substrate wherein the imaginary axis of each of the LED chips is parallel to one another;
a heat sink having an arcuate surface shaped to approximate the arcuate orientation of the continuous planar flexible substrate, wherein a face of the heat sink is disposed in contact with and adjacent a back of the continuous planar flexible substrate;
a luminescent coating disposed about a top surface of the arcuate continuous planar flexible substrate; and
a power source coupled to the plurality of LED chips.

2. The lighting device of claim 1 , wherein the luminescent coating comprises a gel coating that encapsulates the plurality of LED chips disposed on the substrate.

3. The lighting device of claim 1 , wherein an imaginary axis normal to a center of at least one of the plurality of LED chips is parallel to an imaginary axis normal to a center of an adjacent one of the plurality of LED chips.

4. The lighting device of claim 1 , wherein the field of illumination of at least one of the plurality of LED chips is different than the field of illumination of at an adjacent one of the plurality of LED chips.

5. The lighting device of claim 1 , wherein the planar flexible substrate is rectangular.

6. The lighting device of claim 5 , further comprising a stiffening member disposed behind the LED chips.

7. The lighting device of claim 6 , wherein the stiffening member comprises a rectangular flexible material disposed about the back side of the flexible substrate.

8. The lighting device of claim 7 , wherein the stiffening member extends from a first end of the flexible substrate to a second edge of the flexible substrate.

9. The lighting device of claim 6 , wherein the stiffening member comprises a width that is at least as great as the width of the LED chip.

10. The lighting device of claim 6 , wherein the stiffening member comprises a heat resistant polymer film.

11. The lighting device of claim 1 , further comprising a tab extending from a lateral side of the flexible substrate, said tab comprising an electrical coupling for coupling to a power source.

12. The lighting device of claim 11 , wherein the tab is not covered by the luminescent coating.

13. A lighting device, comprising:
a plurality of coplanar LED chips mounted on a continuous planar flexible substrate, wherein the continuous planar flexible substrate is disposed in an arcuate orientation having a hollow center and wherein each of the plurality of LED chips is powered by a single power source;
wherein the continuous planar flexible substrate comprises an inner diameter and an outer diameter, the plurality of coplanar LED chips being mounted between the inner diameter and outer diameter of the continuous planar flexible substrate;
a continuous electrical connection line disposed about the continuous planar flexible substrate between each of the plurality of coplanar LED chips;
a luminescent coating disposed about a surface of the arcuate continuous planar flexible substrate forming an encapsulating layer about a top surface of the arcuate substrate;
a stiffener disposed behind the plurality of LED chips about a back surface of the flexible substrate; and
a power source coupled to the electrical connection line.

14. The lighting device of claim 13 , further comprising a tab extending laterally from a side edge of the flexible substrate.

15. The lighting device of claim 14 , further comprising a transparent housing enclosing the flexible substrate, a heat sink, and the coating.

16. A method of manufacturing a lighting device, comprising:
(a) disposing an intermediate plate atop a base plate, wherein the base plate comprises guide posts that correspond to alignment holes placed within the intermediate plate;
(b) disposing a flexible substrate assembly atop the intermediate plate, the flexible substrate assembly comprising alignment holes for placement about guide posts of the base plate and further comprising a plurality of rectangular flexible substrate strips removable from the flexible substrate assembly, wherein each of the flexible substrate strips comprises a plurality of wire bonding pads configured to receive a LED chip thereon;
(c) disposing a magnetic top plate atop the flexible substrate, the magnetic top plate comprising alignment holes corresponding to the guide posts disposed within the base plate, wherein the magnetic top plate further comprises apertures corresponding to at least the wire bonding pads; and
(d) securing a plurality of LED chips about each one of the plurality of flexible substrate strips.

17. The method of claim 16 , further comprising the step of removing the flexible substrate assembly from intermediate plate and disposed a stiffening member about the back side of the flexible substrate behind each of the plurality of LED chips.

18. The method of claim 17 , arranging the flexible substrate in an arcuate shape and placing the flexible substrate about an arcuate heat sink.

19. The method of claim 18 , further comprising placing the flexible substrate and arcuate heat sink in an arcuate housing.

20. The method of claim 19 , further comprising placing a luminescent composition within the arcuate housing.

21. The method of claim 20 , further comprising applying a vacuum to the arcuate housing to remove air bubbles from the luminescent composition.

22. A lighting device, comprising:
a plurality of LED chips mounted on a continuous planar flexible substrate, wherein the continuous planar flexible substrate is disposed in an arcuate orientation having a hollow center, wherein a first plurality of LED chips mounted on a first arcuate substrate comprises a first lighting sub-assembly and a second plurality of LED chips comprises a second lighting sub-assembly;
wherein each of the plurality of LEDs comprises an optical axis that is normal to the continuous planar flexible substrate and wherein the optical axes of the plurality of LEDs are parallel;
a continuous heat sink having an arcuate surface shaped to approximate the arcuate orientation of the continuous planar flexible substrate and coupled to the flexible substrate between a face of the continuous heat sink and a back of the continuous planar flexible substrate; and
a power source coupled to the plurality of LED chips.

23. The lighting device of claim 22 , wherein the first and second sub-assemblies each comprises a substantially 180-degree arc coupled together to form a substantially 360 degree ring.

24. The lighting device of claim 22 , wherein the first and second sub-assemblies are powered by a single power source.

25. The lighting device of claim 24 , wherein power may be provided selectively to each of the first and second sub-assemblies.

26. A lighting device, comprising:
a plurality of LED chips mounted on a single planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation and wherein each of the plurality of LED chips is powered by a single power source, wherein the planar flexible substrate is shaped t

Assignees

• Alliance Sports Group Lp

Inventors

• Cramer Steven

Classifications

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H04M1/185

  Improving the shock resistance of the housing, e.g. by increasing the rigidity · CPC title

• G03B2215/0517

  Housing · CPC title

• H04B1/3888 Primary

  Arrangements for carrying or protecting transceivers · CPC title

• F21Y2101/00

  Point-like light sources · CPC title