Input/output systems and devices for use with superconducting devices

Patent metadata

Field	Value
Publication number	US-10097151-B2
Application number	US-201715672506-A
Country	US
Kind code	B2
Filing date	Aug 9, 2017
Priority date	Jul 15, 2008
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

First claim

We claim:

1. An input/output system for use with a superconducting device sample, the input/output system comprising:
a first tier including a first set of electrical filter structures, wherein each of the electrical filter structures in the first set of electrical filter structures comprises a respective lumped element filter that is at least partially contained within a respective enclosure, and wherein each of the electrical filter structures in the first set of electrical filter structures has an input end and an output end;
a first set of electrical signal paths, each of the electrical signal paths in the first set of electrical signal paths including a filter input portion, a filter portion, and a filter output portion, wherein the filter input portion of each respective one of the electrical signal paths in the first set of electrical signal paths communicably couples to the input end of a respective one of the electrical filter structures from the first set of electrical filter structures, the filter portion of each respective one of the electrical signal paths in the first set of electrical signal paths includes at least a portion of the lumped element filter of a respective one of the electrical filter structures from the first set of electrical filter structures, and the filter output portion of each respective one of the electrical signal paths in the first set of electrical signal paths communicably couples to the output end of a respective one of the electrical filter structures from the first set of electrical filter structures, wherein at least a portion of each one of the electrical signal paths in the first set of electrical signal paths is superconducting and each one of the electrical signal paths in the first set of electrical signal paths provides electrical communication with at least a portion of the superconducting device sample;
a first composite plate structure having a first top plate and a first bottom plate, wherein the first top plate and the first bottom plate mate to form a first inner volume therebetween on a first side of the first top plate, and wherein each of the electrical filter structures in the first set of electrical filter structures is carried by a second side of the first top plate that is opposite the first side of the first top plate such that the filter output portion of at least one of the electrical signal paths from the first set of electrical signal paths extends from the second side of the first top plate, through the first top plate, and into the first inner volume;
a pedestal mounted to the first side of the first top plate inside the first inner volume; and
a device sample holder assembly selectively mountable to and dismountable from the pedestal inside the first inner volume, wherein the device sample holder assembly includes at least one printed circuit board, at least a portion of the device sample holder assembly superconductingly electrically couples to at least one of the electrical signal paths from the first set of electrical signal paths, and at least a portion of the device sample holder assembly superconductingly electrically couples to the superconducting device sample.

2. The system of claim 1 wherein the enclosure of at least one of the electrical filter structures is at least partially filled with a mixture of metal powder and epoxy.

3. The system of claim 2 wherein the metal powder includes at least one of brass powder and copper powder.

4. The system of claim 1 , further comprising:
a mounting plate for mounting to a refrigeration system.

5. The system of claim 1 wherein the respective enclosure of each of the electrical filter structures in the first set of electrical filter structures and the first composite plate structure are all formed of material that is substantially non-magnetic and predominately non-superconducting.

6. The system of claim 1 wherein at least one of the electrical signal paths in the first set of electrical signal paths is configured to carry at least a portion of a differential signal.

7. The system of claim 6 wherein at least a portion of the filter input portion of at least one of the electrical signal paths in the first set of electrical signal paths includes a shielded twisted pair cable, and wherein at least a portion of the filter output portion of at least one of the electrical signal paths in the first set of electrical signal paths includes a shielded twisted pair cable.

8. The system of claim 1 , further comprising:
a second tier including a second set of electrical filter structures, wherein each of the electrical filter structures in the second set of electrical filter structures comprises a respective lumped element filter that is at least partially contained within a respective enclosure, and wherein each of the electrical filter structures in the second set of electrical filter structures has an input end and an output end;
a second set of electrical signal paths, each of the electrical signal paths in the second set of electrical signal paths including a filter input portion, a filter portion, and a filter output portion, wherein the filter input portion of each respective one of the electrical signal paths in the second set of electrical signal paths communicably couples to the input end of a respective one of the electrical filter structures from the second set of electrical filter structures, the filter portion of each respective one of the electrical signal paths in the second set of electrical signal paths includes at least a portion of the lumped element filter of a respective one of the electrical filter structures from the second set of electrical filter structures, and the filter output portion of each respective one of the electrical signal paths in the second set of electrical signal paths communicably couples to the output end of a respective one of the electrical filter structures from the second set of electrical filter structures, wherein at least a portion of each of the electrical signal paths in the second set of electrical signal paths is superconducting and each of the electrical signal paths in the second set of electrical signal paths provides electrical communication with at least a portion of the superconducting device sample;
a second composite plate structure having a second top plate and a second bottom plate, wherein the second top plate and the second bottom plate mate to form a second inner volume therebetween on a first side of the second top plate, and wherein each of the electrical filter structures in the second set of electrical filter structures is carried by a second side of the second top plate that is opposite the first side of the second top plate such that the filter output portion of at least one of the electrical signal paths from the second set of electrical signal paths extends from the second side of the second top plate, through the second top plate, and into the second inner volume;
wherein the first inner volume and the second inner volume both form respective parts of a shielded enclosure that contains the pedestal and device sample holder assembly.

9. The system of claim 8 , further comprising:
a hollow conduit that extends between the first inner volume and the second inner volume and provides a shielded channel through which at least a portion of at least one electrical signal path from at least one of the first set of electrical signal paths and the second set of electrical signal paths may pass between the first inner volume and the second inner volume.

10. The system of claim 9 wherein a first end of the first tier is positioned adjacent to the first top plate of the first composite plate structure and a second end of the first tier is positioned ad

Assignees

• D Wave Systems Inc

Inventors

• Thom Murray C
• Tcaciuc Alexander M
• Lamont Gordon
• Petroff J Craig
• Neufeld Richard D
• Bruce David S
• Uchaykin Sergey V

Classifications

• H03H1/00 Primary

  Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers H03H9/00) · CPC title

• H01R13/46

  Bases; Cases · CPC title

• H03H7/0138

  Electrical filters or coupling circuits · CPC title

• H01F27/2823

  Wires (H01F27/2866 takes precedence) · CPC title

• H01F41/048

  Superconductive coils · CPC title