Cover for heat sink

Patent metadata

Field	Value
Publication number	US-10095282-B2
Application number	US-201615191349-A
Country	US
Kind code	B2
Filing date	Jun 23, 2016
Priority date	Jun 23, 2016
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

A processor can be damaged by a heat sink. If the heat sink is improperly installed, the heat sink may damage the processor and/or the motherboard. Sequential tightening of mechanical fasteners is thus recommended, but the sequential tightening is challenging to implement. Sequential tightening of fasteners helps reduce damage to a processor. When a heat sink is fastened over the processor to a motherboard, mechanical fasteners are tightened in a sequence to reduce damage to the processor. To ensure sequential tightening of the mechanical fasteners, the heat sink is first secured with only two of the mechanical fasteners preinstalled in two of four holes in the heat sink and sequentially tightened into a bolster plate on a bottom side of the motherboard. A cover is then installed over the heat sink, and the cover has two mechanical fasteners that align with a remaining two of the four holes in the heat sink. A remaining two of the mechanical fasteners may then be sequentially tightened into the bolster plate.

First claim

What is claimed is:

1. A heat sink, comprising:
a body having cooling fins projecting therefrom, the body of the heat sink for cooling a processor electrically coupled to a socket of a motherboard, the body of the heat sink having first, second, third, and fourth body holes for sequential tightening of corresponding mechanical fasteners that align with holes in a bolster plate on a bottom side of the motherboard; and
a heat sink cover for installation over at least a portion of the body of the heat sink, the heat sink cover having only two holes that align with only two of the body holes in the body;
wherein the heat sink cover enforces the sequential tightening of the corresponding mechanical fasteners into the holes in the bolster plate via the two holes.

2. The heat sink of claim 1 , further comprising a fan for convecting air across the body of the heat sink.

3. The heat sink of claim 1 , further comprising an open end in the heat sink cover, the open end for convecting air along the cooling fins projecting from the body of the heat sink.

4. The heat sink of claim 1 , further comprising open ends in the heat sink cover, the open ends for convecting air along the cooling fins projecting from the body of the heat sink.

5. The heat sink of claim 1 , further comprising a processor clip that retains the processor to the body of the heat sink.

6. A method comprising:
attaching a processor to a processor clip;
attaching the processor clip to a heat sink, the heat sink having cooling fins projecting therefrom, and the heat sink having first, second, third, and fourth body holes for sequential tightening of four mechanical fasteners;
socketing the processor into a socket of a motherboard;
inserting two of the four mechanical fasteners through two of the body holes in the heat sink and through two clip holes in the processor clip;
sequentially tightening the two of the four mechanical fasteners into a bolster plate on a bottom side of the motherboard, with the bolster plate having two threaded holes that respectively engage the two of the four mechanical fasteners when inserted through the two of the body holes in the heat sink;
installing a heat sink cover over at least a portion of the heat sink, the heat sink cover having only two holes that only align with a remaining two of the body holes in the heat sink;
inserting a remaining two of the four mechanical fasteners through the two holes in the heat sink cover, through the remaining two of the body holes in the heat sink, and through another two clip holes in the processor clip; and
sequentially tightening the remaining two of the four mechanical fasteners into a remaining two threaded holes in the bolster plate on the bottom side of the motherboard, such that
the heat sink cover enforces the sequential tightening of the four mechanical fasteners into the bolster plate.

7. The method of claim 6 , further comprising attaching a cooling fan to the heat sink.

8. The method of claim 6 , further comprising supplying electrical power to the processor.

9. The method of claim 8 , further comprising supplying the electrical power to a cooling fan.

10. The method of claim 9 , further comprising convecting air across the heat sink to remove waste heat generated by the processor.

11. The method of claim 9 , further comprising convecting air within the heat sink cover to remove waste heat generated by the processor.

12. The method of claim 9 , further comprising convecting air between open ends of the heat sink cover to remove waste heat generated by the processor.

13. An information handling system, comprising:
a processor socketed into a socket of a motherboard;
a heat sink installed over the processor via a processor clip, the heat sink having cooling fins projecting therefrom, and the heat sink having four body holes for sequential tightening of four mechanical fasteners;
two of the four mechanical fasteners inserted through two of the four body holes in the heat sink and through two clip holes in the processor clip, the two of the four mechanical fasteners sequentially tightened into corresponding threaded holes in a bolster plate on a bottom side of the motherboard;
a heat sink cover installed over at least a portion of the heat sink, the heat sink cover only having two holes that only align with a remaining two of the four body holes in the heat sink; and
a remaining two of the four mechanical fasteners inserted through the two holes in the heat sink cover, through the remaining two of the four body holes in the heat sink, and through another two clip holes in the processor clip, the remaining two of the four mechanical fasteners sequentially tightened into remaining ones of the threaded holes in the bolster plate on the bottom side of the motherboard;
wherein the heat sink cover enforces the sequential tightening of the mechanical fasteners into the bolster plate.

14. The information handling system of claim 13 , further comprising a power supply for supplying electrical power to the processor.

15. The information handling system of claim 13 , further comprising a cooling fan attached to the heat sink.

16. The information handling system of claim 15 , further comprising a power supply for supplying electrical power to the cooling fan.

Assignees

• Dell Products Lp

Inventors

• Ingalls Andrew O
• Abdul-Razzak Neda
• Geist Edward D

Classifications

• H10W40/611

  Bolts or screws · CPC title

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• F28D2021/0029

  Heat sinks · CPC title

• G06F1/20 Primary

  Cooling means · CPC title