Optical modulator and optical module

Patent metadata

Field	Value
Publication number	US-10095080-B2
Application number	US-201715650222-A
Country	US
Kind code	B2
Filing date	Jul 14, 2017
Priority date	Aug 1, 2016
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

An optical modulator includes an optical modulator chip configured to optically modulate an optical signal using an electrical signal input thereto; and a relay substrate configured to relay and couple the electrical signal to the optical modulator chip. The optical modulator chip includes a signal electrode and a ground electrode for the electrical signal, formed along a waveguide for the optical signal. One end of the optical modulator chip is arranged to face the relay substrate. An electrode connection portion coupling the electrical signal to the relay substrate by wire is provided at the one end. A distance between a tip of one end of the signal electrode in the electrode connection portion and the end of the optical modulator chip is less than a distance between a tip of an end of the ground electrode in the electrode connection portion and the end of the optical modulator chip.

First claim

What is claimed is:

1. An optical modulator comprising:
an optical modulator chip configured to optically modulate an optical signal using an electrical signal input thereto; and
a relay substrate configured to relay and couple the electrical signal to the optical modulator chip, wherein
the optical modulator chip includes a signal electrode and a ground electrode for the electrical signal, formed along a waveguide for the optical signal,
one end of the optical modulator chip is arranged to face the relay substrate, and an electrode connection portion is configured to couple the electrical signal to the relay substrate using a wire is provided at the one end,
the ground electrode has:
a first tip that is adjacent to the signal electrode; and
a second tip that is distant from the signal electrode, and
a distance between a tip of one end of the signal electrode positioned in the electrode connection portion and the one end of the optical modulator chip, and a distance between the first tip of one end of the ground electrode and the one end of the optical modulator chip are both less than a distance between the second tip of the one end of the ground electrode and the one end of the optical modulator chip.

2. The optical modulator according to claim 1 , comprising
a second electrode connection portion in which other ends of the signal electrode and the ground electrode are provided to face the one end of the optical modulator chip, the other ends of the signal electrode and the ground electrode being connected to a terminating portion facing thereto, by wires at the one end of the optical modulator chip.

3. The optical modulator according to claim 1 , comprising
a second electrode connection portion in which other ends of the signal electrode and the ground electrode are provided to face a second end of the optical modulator chip, the other ends of the signal electrode and the ground electrode being connected to a terminating portion facing thereto using wires at the second end of the optical modulator chip.

4. The optical modulator according to claim 1 , wherein
a material of a substrate of the optical modulator chip is a ferroelectric.

5. The optical modulator according to claim 1 , wherein
an end of the optical modulator chip and the relay substrate are adhered to each other or are arranged having a predetermined interval therebetween.

6. An optical module comprising:
the optical modulator according to claim 1 ;
a source of a light beam to be input into the optical waveguide;
an optical system for the optical signal; and
a controller configured to control an operation of the optical modulator.

7. An optical modulator comprising:
an optical modulator chip configured to optically modulate an optical signal using an electrical signal input thereto; and
a relay substrate configured to relay and couple the electrical signal to the optical modulator chip, wherein
the optical modulator chip includes a signal electrode and a ground electrode for the electrical signal, formed along a waveguide for the optical signal,
one end of the optical modulator chip is arranged to face the relay substrate, and an electrode connection portion configured to couple the electrical signal to the relay substrate using a wire is provided at the one end,
the ground electrode positioned in the electrode connection portion has:
a first tip that is adjacent to the signal electrode; and
a broad portion having a distance to the one end of the optical modulator chip becoming larger as the broad portion becomes more distant from the signal electrode, and

a distance between a tip of one end of the signal electrode positioned in the electrode connection portion and the one end of the optical modulator chip, and a distance between the first tip of one end of the ground electrode and the one end of the optical modulator chip are both less than a distance between the broad portion of the ground electrode and the one end of the optical modulator chip.

8. The optical modulator according to claim 7 , comprising
a second electrode connection portion in which other ends of the signal electrode and the ground electrode are provided to face the one end of the optical modulator chip, the other ends of the signal electrode and the ground electrode being connected to a terminating portion facing thereto, by wires at the one end of the optical modulator chip.

9. The optical modulator according to claim 7 , comprising
a second electrode connection portion in which other ends of the signal electrode and the ground electrode are provided to face a second end of the optical modulator chip, the other ends of the signal electrode and the ground electrode being connected to a terminating portion facing thereto using wires at the second end of the optical modulator chip.

10. The optical modulator according to claim 7 , wherein
a material of a substrate of the optical modulator chip is a ferroelectric.

11. The optical modulator according to claim 7 , wherein
an end of the optical modulator chip and the relay substrate are adhered to each other or are arranged having a predetermined interval therebetween.

12. An optical module comprising:
the optical modulator according to claim 7 ;
a source of a light beam to be input into the optical waveguide;
an optical system for the optical signal; and
a controller configured to control an operation of the optical modulator.

Assignees

• Fujitsu Optical Components Ltd

Inventors

• Ohmori Yasuhiro
• Kubota Yoshinobu
• Doi Masaharu
• Sugiyama Masaki

Classifications

• G02F1/0027

  Ferro-electric materials · CPC title

• G02F1/0123

  Circuits for the control or stabilisation of the bias voltage, e.g. automatic bias control [ABC] feedback loops · CPC title

• G02F1/2257

  the optical waveguides being made of semiconducting material · CPC title

• G02F2203/21

  Thermal instability, i.e. DC drift, of an optical modulator; Arrangements or methods for the reduction thereof · CPC title

• H04B10/50572

  to control the modulating signal amplitude including amplitude distortion · CPC title