Display device
US-10725332-B2 · Jul 28, 2020 · US
US10095076B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10095076-B2 |
| Application number | US-201715432128-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 14, 2017 |
| Priority date | Jan 15, 2010 |
| Publication date | Oct 9, 2018 |
| Grant date | Oct 9, 2018 |
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A semiconductor device includes a photodiode, a first transistor, and a second transistor. The photodiode has a function of supplying a charge corresponding to incident light to a gate of the first transistor, the first transistor has a function of accumulating the charge supplied to the gate, and the second transistor has a function of retaining the charge accumulated in the gate of the first transistor. The second transistor includes an oxide semiconductor.
Opening claim text (preview).
The invention claimed is: 1. A semiconductor device comprising: a substrate; a backlight; a light-receiving element; a first transistor; and a second transistor, wherein the light-receiving element is electrically connected to a gate of the first transistor through the second transistor, wherein each of the first transistor and the second transistor comprises a crystalline oxide semiconductor in a channel formation region, wherein the crystalline oxide semiconductor comprises indium, gallium and zinc, wherein an off-state current of the second transistor per micrometer of a channel width is 10 aA/μm or less, wherein the light-receiving element is provided over the substrate, wherein the backlight is provided under the substrate, and wherein the light-receiving element is configured to receive a light emitted from the backlight. 2. The semiconductor device according to claim 1 , wherein the light-receiving element is a photodiode. 3. The semiconductor device according to claim 1 , wherein the light-receiving element comprises a single crystal semiconductor. 4. The semiconductor device according to claim 1 , wherein the crystalline oxide semiconductor is an intrinsic or substantially intrinsic semiconductor. 5. The semiconductor device according to claim 1 , wherein the off-state current is a current at 15° C. to 25° C. inclusive. 6. The semiconductor device according to claim 1 , further comprising an insulating layer over the first transistor, wherein the second transistor is provided over the insulating layer, and wherein the second transistor overlaps with the light-receiving element at least partly. 7. A semiconductor device comprising: a substrate; a backlight; a light-receiving element; a first transistor; a second transistor; and a third transistor, wherein the light-receiving element is electrically connected to a gate of the first transistor through the second transistor, wherein one of a source and a drain of the third transistor is electrically connected to the gate of the first transistor, wherein each of the first transistor, the second transistor and the third transistor comprises a crystalline oxide semiconductor in a channel formation region, wherein the crystalline oxide semiconductor comprises indium, gallium and zinc, wherein an off-state current of the second transistor per micrometer of a channel width is 10 aA/μm or less, wherein the light-receiving element is provided over the substrate, wherein the backlight is provided under the substrate, and wherein the light-receiving element is configured to receive a light emitted from the backlight. 8. The semiconductor device according to claim 7 , wherein the light-receiving element is a photodiode. 9. The semiconductor device according to claim 7 , wherein the light-receiving element comprises a single crystal semiconductor. 10. The semiconductor device according to claim 7 , wherein the crystalline oxide semiconductor is an intrinsic or substantially intrinsic semiconductor. 11. The semiconductor device according to claim 7 , wherein the off-state current is a current at 15° C. to 25° C. inclusive. 12. The semiconductor device according to claim 7 , further comprising an insulating layer over the first transistor, wherein the second transistor is provided over the insulating layer, and wherein the second transistor overlaps with the light-receiving element at least partly. 13. A semiconductor device comprising: a substrate; a backlight; a light-receiving element; a first transistor; an insulating layer over the light-receiving element and the first transistor; and a second transistor over the insulating layer, wherein the light-receiving element is electrically connected to the second transistor through an electrode, wherein the electrode is provided in an opening of the insulating layer, wherein the second transistor comprises a crystalline oxide semiconductor in a channel formation region, wherein the crystalline oxide semiconductor comprises indium, gallium and zinc, wherein an off-state current of the second transistor per micrometer of a channel width is 10 aA/μm or less, wherein the light-receiving element is provided over the substrate, wherein the backlight is provided under the substrate, and wherein the light-receiving element is configured to receive a light emitted from the backlight. 14. The semiconductor device according to claim 13 , wherein the light-receiving element is a photodiode. 15. The semiconductor device according to claim 13 , wherein the light-receiving element comprises a single crystal semiconductor. 16. The semiconductor device according to claim 13 , wherein the crystalline oxide semiconductor is an intrinsic or substantially intrinsic semiconductor.
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