Flow sensor arrangement

Patent metadata

Field	Value
Publication number	US-10094691-B2
Application number	US-201514976799-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Dec 22, 2014
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

A flow sensor arrangement for determining the flow of a fluid comprises a substrate. A heater is arranged in or on the substrate as well as at least one first thermocouple for generating a first signal proportional to a temperature difference between a location downstream from the heater and a first reference location, and at least one second thermocouple for generating a second signal proportional to a temperature difference between a location upstream from the heater and a second reference location which second reference location is different from the first reference location. In addition, at least one third thermocouple is arranged in or on the substrate for generating a third signal proportional to a temperature difference between the first reference location and the second reference location. Means are provided for determining a sensing signal indicative of the flow of the fluid over the heater and the first and the second thermocouple dependent on the first signal, the second signal and the third signal.

First claim

The invention claimed is:

1. Flow sensor arrangement for determining the flow of a fluid, comprising a substrate, and arranged therein or thereon: —a heater, —at least one first thermocouple for generating a first signal proportional to a temperature difference between a location downstream from the heater and a first reference location, wherein the first thermocouple comprises a hot junction arranged at the location downstream from the heater and a cold junction arranged at the first reference location, at least one second thermocouple for generating a second signal proportional to a temperature difference between a location upstream from the heater and a second reference location which second reference location is different from the first reference location, wherein the second thermocouple comprises a hot junction at the location upstream from the heater and a cold junction arranged at the second reference location, —at least one third thermocouple for generating a third signal proportional to a temperature difference between the first reference location and the second reference location, a processor for determining a sensing signal indicative of the flow of the fluid over the heater and the first and the second thermocouple dependent on the first signal, the second signal and the third signal.

2. The flow sensor arrangement according to claim 1 , wherein the processor is adapted to determine a difference between the first and the second signal and to adjust the difference by subtracting the third signal therefrom for compensating for different temperatures at the first and the second reference location.

3. The flow sensor arrangement according to claim 1 , wherein the processor is adapted to subtract the second signal and the third signal from the first signal.

4. The flow sensor arrangement according to claim 1 ,
comprising a first thermopile with multiple first thermocouples comprising hot junctions arranged at the location downstream from the heater and cold junctions arranged at the first reference location by connecting terminals of adjacent first thermocouples, and
comprising a second thermopile with multiple second thermocouples comprising hot junctions arranged at the location upstream from the heater and cold junctions arranged at the second reference location by connecting terminals of adjacent second thermocouples.

5. The flow sensor arrangement according to claim 1 ,
wherein the third thermocouple comprises a hot junction arranged at the first reference location and a cold junction arranged at the second reference location, or
wherein the third thermocouple comprises a hot junction arranged at the second reference location and a cold junction arranged at the first reference location.

6. The flow sensor arrangement according to claim 5 ,
comprising a third thermopile with multiple third thermocouples comprising hot junctions arranged at one of the first reference location and the second reference location and cold junctions arranged at the second reference location or first reference location respectively by connecting terminals of adjacent third thermocouples.

7. The flow sensor arrangement of claim 5 ,
wherein each of the hot and cold junction of the third thermocouple is arranged in close proximity to the assigned cold junction of the first or second thermocouple respectively.

8. The flow sensor arrangement of claim 1 ,
comprising a recess in the substrate thereby defining a membrane extending over the recess,
wherein all junctions of the first, second and third thermocouple are arranged on the membrane.

9. The flow sensor arrangement according to claim 1 , wherein the processor is integrated into the substrate, and preferably wherein the determination means processing unit is hardwired logic.

10. The flow sensor arrangement according to claim 1 ,
wherein each of the first, second and third thermocouple comprises one of:
a hot junction connecting two metal elements of different material;
a hot junction connecting two polysilicon elements of different doping, and preferably wherein one of the polysilicon elements comprises an n+ doping while the other polysilicon element comprises a p+ doping;
a hot junction connecting a metal element and a polysilicon element;
and preferably wherein all the first, second and third thermocouples comprise the same material composition.

11. The flow sensor arrangement according to claim 1 ,
wherein the heater comprises one of a metal element and a polysilicon element,
and preferably wherein the heater comprises a metal element in case both of the elements of at least one of the first, second or third thermocouple comprises metal, or comprises polysilicon in case both of the elements of at least one of the first, second or third thermocouple comprises polysilicon.

12. The flow sensor arrangement according to claim 1 ,
wherein all of the heater and the first, second and third thermocouple are formed of one or more metal layers or polysilicon layers of a stack of CMOS layers arranged on a bulk material of the substrate.

13. Flow sensor arrangement for determining the flow of a fluid, comprising a substrate, and arranged therein or thereon: —a heater, —at least one first thermocouple for generating a first signal proportional to a temperature difference between a location downstream from the heater and a first reference location, at least one second thermocouple for generating a second signal proportional to a temperature difference between a location upstream from the heater and a second reference location which second reference location is different from the first reference location, —at least one third thermocouple for generating a third signal proportional to a temperature difference between the first reference location and the second reference location, a processor for determining a sensing signal indicative of the flow of the fluid over the heater and the first and the second thermocouple dependent on the first signal, the second signal and the third signal, wherein the substrate comprises a measuring region and a regular region, wherein a thermal conductance in the measuring region is lower than a thermal conductance in the regular region, and wherein the heater, the downstream location and the upstream location are arranged in the measuring region while the first reference location and the second reference location are arranged in the regular region.

14. The flow sensor arrangement according to claim 13 ,
comprising a recess in the substrate thereby defining a membrane extending over the recess respectively,
wherein the measuring region is defined by the membrane and the regular region is defined outside the measuring region.

15. The flow sensor arrangement according to claim 13 ,
wherein the first thermocouple comprises a hot junction arranged at the location downstream from the heater and a cold junction arranged at the first reference location,
wherein the second thermocouple comprises a hot junction at the location upstream from the heater and a cold junction arranged at the second reference location,
wherein the hot junction of the first thermocouple and the hot junction of the second thermocouple is arranged in the measuring region while the cold junction of the first thermocouple and the cold junction of the second thermocouple is arranged in the regular region.

16. The flow sensor arrangement according to claim 13 ,
wherein the third thermocouple comprises a hot junction arranged at the first reference location and a cold junction arranged at the second reference location, or
wherein the third thermocouple compris

Assignees

• Sensirion Ag

Inventors

• Figi Harry
• Hornung Mark
• Wuest Robert

Classifications

• G01F1/6888 Primary

  Thermoelectric elements, e.g. thermocouples, thermopiles · CPC title

• G01F15/022

  using electrical means · CPC title