Method and apparatus for laser projection, and machining method

US10094652B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10094652-B2
Application numberUS-201615166394-A
CountryUS
Kind codeB2
Filing dateMay 27, 2016
Priority dateNov 29, 2012
Publication dateOct 9, 2018
Grant dateOct 9, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A laser projection method including the steps of: irradiating, from a laser projection unit, a workpiece that is a measurement object, with a laser while controlling a plurality of mirror angles; imaging the workpiece with a stereo camera, extracting a contour of the workpiece, and calculating a three-dimensional coordinate; calculating a positional relationship between the laser projection unit and the workpiece by comparing the calculated three-dimensional coordinate of the workpiece contour with the minor angle; and performing coordinate transformation of CAD data information and drawing CAD data from the laser projection unit to the workpiece, based on the positional relationship between the laser projection unit and the workpiece. The machining method including the steps of: selecting a component of a tool; assembling the component; imaging the tool assembled; and determining whether or not a desired tool has been assembled.

First claim

Opening claim text (preview).

The invention claimed is: 1. A machining method using a working machine controlled by an NC program comprising: a first step of selecting a tool to be attached to a main shaft of the working machine; a second step of assembling the tool selected in the first step to the main shaft of the working machine; a third step of imaging the tool assembled to the main shaft of the working machine in the second step; and a fourth step of determining, by collating a collation image, which is prepared in advance from an image of a tool having been correctly assembled to the main shaft of the working machine, with an image captured after assembly in the third step, whether or not a desired tool has been assembled. 2. The machining method according to claim 1 , further comprising: a fifth step of generating tool information; a sixth step of measuring a dimension of said tool; a seventh step of writing a measurement result of the sixth step to an information carrier; and an eighth step of attaching said information carrier to said tool, wherein in said fourth step, the collation image is collated with an image that is captured after said information carrier is attached to said tool, and also tool information generated in said firth step is collated with a content read from said information carrier that is attached to the tool in said eighth step, thereby determining whether a desired tool has been correctly assembled to the main shaft of the working machine. 3. The machining method according to claim 1 , wherein said collation image prepared from an image of a tool having been correctly assembled to the main shaft of the working machine is an image of an entire circumference of said tool captured while rotating said tool. 4. The machining method according to claim 1 , wherein imaging the tool in said third step includes capturing an image of an entire circumference of said tool while rotating said tool. 5. The machining method according to claim 1 , wherein said information carrier is a bar code label or a matrix type-two dimensional code label recognized by an image or a label with an IC tag electrically read.

Assignees

Inventors

Classifications

  • for indicating desired positions guiding the positioning of tools or workpieces (B25H1/0092 takes precedence) · CPC title

  • Tracking lasers follow object, reflection gives 3-D position · CPC title

  • characterised by using design data to control NC machines, e.g. CAD/CAM (G05B19/4093 takes precedence) · CPC title

  • of tools · CPC title

  • Compare measured, vision data with computer model, cad data · CPC title

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What does patent US10094652B2 cover?
A laser projection method including the steps of: irradiating, from a laser projection unit, a workpiece that is a measurement object, with a laser while controlling a plurality of mirror angles; imaging the workpiece with a stereo camera, extracting a contour of the workpiece, and calculating a three-dimensional coordinate; calculating a positional relationship between the laser projection uni…
Who is the assignee on this patent?
Mitsubishi Hitachi Power Sys
What technology area does this patent fall under?
Primary CPC classification G01B11/2545. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).