Double-sided adhesive tape

Patent metadata

Field	Value
Publication number	US-10093835-B2
Application number	US-201414894236-A
Country	US
Kind code	B2
Filing date	Apr 22, 2014
Priority date	May 27, 2013
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

There is provided a double-sided adhesive tape includes a foam base, a resin film disposed on a surface of the foam base, an adhesive layer disposed on a surface of the resin film, and an adhesive layer disposed on another surface of the foam base. The foam base has a density of 0.45 g/cm 3 or less and an interlaminar strength of 10 N/cm or more. The adhesive layer has a 180°-peel adhesion of 10 N/20 mm or more. The 180°-peel adhesion is measured at a peeling speed of 300 mm/min when an adhesive tape including a 25-μm-thick PET base and a 25-μm-thick adhesive layer disposed on the PET base is bonded to an aluminium board at 23° C. and 65% RH by pressing the adhesive tape against the aluminium board with one stroke of a 2-kg roller and subsequently the adhesive tape is left standing for 1 hour at 23° C. and 50% RH.

First claim

The invention claimed is:

1. A double-sided adhesive tape comprising: a polyolefin foam base; a resin film disposed on a surface of the polyolefin foam base; an adhesive layer disposed on a surface of the resin film; an adhesive layer disposed on another surface of the polyolefin foam base; and a bonding-agent layer interposed between the polyolefin foam base and the resin film and dry-laminated so as to bond the foam base and the resin film to each other by a dry lamination method,
the polyolefin foam base having a thickness of 250 μm or less, a density of 0.45 g/cm 3 or less and a maximum strength of 10 N/cm or more, the adhesive layer having a 180° -peel adhesion of 10 N/20 mm or more, the 180° -peel adhesion of the adhesive layer being measured at a peeling speed of 300 mm/min when an adhesive tape including a 25-μm-thick polyethylene terephthalate base and a 25-μm-thick adhesive layer disposed on the polyethylene terephthalate base is bonded to an aluminium board under conditions of a temperature of 23° C. and a relative humidity of 65% RH by pressing the adhesive tape against the aluminium board with one stroke of a 2-kg roller, the adhesive tape is left standing for 1 hour under conditions of a temperature of 23° C. and a relative humidity of 50% RH, and subsequently the adhesive tape is left standing for 1 hour under conditions of a temperature of 23° C. and a relative humidity of 50% RH, wherein
the maximum strength is measured by pulling the polyolefin foam base having a width of 1 cm at a tensile speed of 15 m/min to tear the foam base in a thickness direction of the polyolefin foam base such that the maximum strength occurs when the foam base is torn.

2. The double-sided adhesive tape according to claim 1 , having an overall thickness of 300 μm or less.

3. The double-sided adhesive tape according to claim 1 , wherein the foam base has a tensile strength of 500 to 1300 N/cm 2 .

4. The double-sided adhesive tape according to claim 1 , wherein the resin film includes a polyester resin.

5. The double-sided adhesive tape according to claim 1 , wherein the bonding-agent layer includes a urethane resin.

6. The double-sided adhesive tape according to claim 1 , being used for fixing parts of electronic equipment to one another.

7. The double-sided adhesive tape according to claim 1 , wherein the thickness of the polyolefin foam base is 50 to 250 μm.

8. The double-sided adhesive tape according to claim 1 , wherein the thickness of the polyolefin foam base is 80 to 200 μm.

Assignees

• Dainippon Ink & Chemicals
• Dic Corp Tokyo

Inventors

• Yamakami Akira
• Takei Hideaki
• Ogawa Yuki
• Kamikawa Yumi
• Iwasaki Takeshi

Classifications

• C09J2467/001

  in the barrier layer · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J2467/006

  in the substrate · CPC title

• C09J2400/243

  in the substrate · CPC title

• C09J2475/00

  Presence of polyurethane · CPC title