Ceramic matrix composite articles and methods for forming same
US-2016251270-A1 · Sep 1, 2016 · US
US10093586B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10093586-B2 |
| Application number | US-201514632030-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 26, 2015 |
| Priority date | Feb 26, 2015 |
| Publication date | Oct 9, 2018 |
| Grant date | Oct 9, 2018 |
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A method for forming a ceramic matrix composite article includes forming by melt infiltration a ceramic matrix composite substrate inducing a ceramic fiber reinforcement material in a ceramic matrix material having a free silicon proportion and forming by chemical vapor infiltration a ceramic matrix composite outer layer including a ceramic fiber reinforcement material in a ceramic matrix material having no free silicon proportion disposed on at least a portion of the substrate.
Opening claim text (preview).
The invention claimed is: 1. A method for forming a ceramic matrix composite article, the method comprising: forming by melt infiltration a ceramic matrix composite substrate comprising a ceramic fiber reinforcement material in a ceramic matrix material having a free silicon proportion; and forming by chemical vapor infiltration a ceramic matrix composite outer layer comprising a ceramic fiber reinforcement material in a ceramic matrix material having no free silicon proportion disposed on at least a portion of the substrate. 2. The method of claim 1 wherein the substrate comprises generally silicon carbide and free silicon, and the outer layer comprises generally pure silicon carbide. 3. The method of claim 1 wherein the substrate comprises generally silicon carbide and free silicon, and the outer layer comprises generally silicon carbide and free carbon. 4. The method of claim 1 wherein the creep resistance of the outer layer is greater that the creep resistance of the substrate. 5. The method of claim 1 wherein the temperature capability of the outer layer is greater than the temperature capability of the substrate. 6. The method of claim 1 wherein the forming the ceramic matrix composite substrate comprise laying up a plurality of prepreg unidirectional tapes. 7. The method of claim 1 wherein the forming the ceramic matrix composite substrate comprise laying up a plurality of woven fiber plies. 8. The method of claim 1 wherein the forming the ceramic matrix composite outer layer comprise laying up at least one prepreg unidirectional tape onto the ceramic matrix composite substrate. 9. The method of claim 1 wherein the forming of the ceramic matrix composite outer layer comprise laying up a plurality of prepreg unidirectional tapes onto the ceramic matrix composite substrate. 10. The method of claim 1 wherein the forming the ceramic matrix composite outer layer comprise laying up one or more prepreg tapes made from woven fibers onto the ceramic matrix composite substrate. 11. The method of claim 1 wherein the ceramic fiber reinforcement material of the substrate is the same as the ceramic fiber reinforcement material of the outer layer. 12. The method of claim 1 wherein the forming the melt infiltration ceramic matrix composite substrate comprises forming by prepreg melt infiltration ceramic matrix composite substrate. 13. The method of claim 1 wherein the forming the melt infiltration ceramic matrix composite substrate comprises forming a slurry cast melt infiltration ceramic matrix compose to substrate. 14. The method of claim 1 wherein the forming by chemical vapor infiltration the ceramic matrix composite outer layer further comprises annealing the outer layer to increase the crystallinity or grain size of the ceramic matrix material of the outer layer. 15. The method of claim 1 wherein the forming by melt infiltration the ceramic matrix composite substrate further comprises removing silicon from the surface of the substrate.
Ceramics · CPC title
Carbon content · CPC title
Gas infiltration of green bodies or pre-forms · CPC title
based on silicon carbide · CPC title
Thermal properties, e.g. thermal expansion coefficient · CPC title
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