Component of a molding system for cooling a molded article

Patent metadata

Field	Value
Publication number	US-10093055-B2
Application number	US-201615363252-A
Country	US
Kind code	B2
Filing date	Nov 29, 2016
Priority date	Jun 21, 2012
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

Disclosed herein, amongst other things is a component of a molding system (e.g. mold component, post-mold component, etc.) having a heat dissipater that is configured to impart a profiled heat removal rate on a selected portion of a molded article that generally matches a heat distribution therein.

First claim

What is claimed is:

1. A component of a molding system, comprising:
a heat dissipater that is configured to impart a profiled heat removal rate on a selected portion of a molded article that generally matches a heat distribution therein;
the heat dissipater defines a heat pickup surface;

the heat dissipater includes a heat removal structure for removal of heat therefrom;
the heat dissipater includes a first body having a first thermal conductivity that includes at least one void embedded therein with which to vary a heat removal rate imparted, in use, on the selected portion of the molded article in accordance with the heat distribution therein;
the component is a mold component including at least one of a split insert, a core insert, or an interface component of a mold stack;
the molded article is a preform for blow molding into a container and the selected portion thereof is a neck portion that includes a cylindrical wall having a thread protruding therefrom;
the heat dissipater is configured to cool the thread at a first rate and the cylindrical wall at a second rate;
wherein the thread is interrupted by at least one slot and the heat dissipater is configured to cool the at least one slot at a third rate.

2. The component of claim 1 , wherein:
the heat pickup surface is configured to contact the selected portion of the molded article for removal of heat therefrom.

3. The component of claim 1 , wherein:
the heat pickup surface is configured to contact another component of the molding system for imparting the profiled heat removal rate on the selected portion of the molded article therein.

4. The component of claim 1 , wherein:
the heat dissipater has thermal conductivity that varies with a thickness of the selected portion of the molded article.

5. The component of claim 4 , wherein:
the heat dissipater includes relatively low thermal conductivity material next to relatively thin portions of the selected portion of the molded article.

6. The component of claim 4 , wherein:
the heat dissipater includes relatively high thermal conductivity material next to relatively thick sections of the selected portion of the molded article.

7. The component of claim 1 , wherein:
the heat removal structure is a coolant channel.

8. The component of claim 7 , wherein:
the coolant channel has a profile that varies such that its separation distance to the heat pickup surface varies inversely to a thickness of the selected portion of the molded article.

9. The component of claim 1 , wherein:
the neck portion further includes a pilfer band beneath the thread; and
the heat dissipater is configured to cool the pilfer band at a fourth rate.

10. The component of claim 1 , wherein:
the neck portion further includes a support ledge beneath the pilfer band; and
the heat dissipater is configured to cool the support ledge at a fifth rate.

Assignees

• Husky Injection Molding Systems Ltd

Inventors

• Niewels Joachim Johannes
• Stedman Scott Michael
• Witz Jean-Christophe
• Kmoch Sven
• Fisch Ralf Walter
• Luijs Ruud Maria Theodorus
• Yankov Peter

Classifications

• B29C45/7207

  of the moulded articles · CPC title

• B29C45/4225 Primary

  Take-off members or carriers for the moulded articles, e.g. grippers · CPC title

• B29C45/7312 Primary

  Construction of heating or cooling fluid flow channels · CPC title

• B29K2995/0013

  Conductive · CPC title

• B29C2045/7214

  Preform carriers for cooling preforms · CPC title