Multi-material structure with embedded electronics

Patent metadata

Field	Value
Publication number	US-10091887-B2
Application number	US-201514677062-A
Country	US
Kind code	B2
Filing date	Apr 2, 2015
Priority date	Apr 2, 2015
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A multilayer structure for an electronic device, includes a flexible substrate film ( 202, 502 ) for accommodating electronics, a number of electronic components ( 308, 508 ) provided on a first surface area ( 401 A, 501 A) of the film, the film also including a second surface area adjacent ( 401 B, 501 B) to the first surface area, and a number of conductive traces ( 412, 512 ) printed on the substrate film for electrically connecting electronic components together, wherein the number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material ( 306, 506 ), the adjacent second surface area and at least part of the first area being overmolded with second thermoplastic material so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.

First claim

The invention claimed is:

1. A multilayer structure for an electronic device, comprising:
a flexible substrate film for accommodating electronics, the flexible substrate film having a first surface area and an adjacent second surface area;
a number of electronic components provided on the first surface area of the flexible substrate film;
a number of conductive traces printed on the flexible substrate film for electrically connecting the electronic components together;
a first thermoplastic material overmolded to the number of electronic components and the related first surface area of the flexible substrate film accommodating the electronic components; and
a second thermoplastic material overmolding the adjacent second surface area and at least part of the first surface area so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the flexible substrate film and the second thermoplastic material,
wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity, and
wherein the first thermoplastic material is configured to prevent the first surface area of the flexible substrate from deformation and the second thermoplastic material is configured to allow the flexible substrate to be bendable.

2. The structure of claim 1 , wherein the number of electronic components include at least one optoelectronic, light-emitting component.

3. The structure of claim 2 , wherein the at least one optoelectronic component is a side-emitting component.

4. The structure of claim 1 , wherein the first thermoplastic material exhibits lower elasticity and the second thermoplastic material exhibits higher elasticity.

5. The structure of claim 1 , wherein the first thermoplastic material comprises optically transparent or translucent material having regard to predefined wavelengths including wavelengths of visible spectrum.

6. The structure of claim 1 , wherein the flexible substrate film is optically opaque or translucent at least in places having regard to predefined wavelengths including wavelengths of visible spectrum.

7. The structure of claim 1 , wherein the flexible substrate film comprises a graphical pattern or coloration printed thereon.

8. The structure of claim 1 , wherein the flexible substrate film defines an opening through which light emitted by one or more of the electronic components is configured to propagate.

9. The structure of claim 1 , wherein the flexible substrate film defines an opening through which light emitted by one or more of the electronic components and first transmitted by the first thermoplastic material is configured to propagate.

10. The structure of claim 1 , wherein the second thermoplastic material comprises optically opaque or translucent material having regard to predefined wavelengths including wavelengths of visible spectrum.

11. The structure of claim 1 , wherein the number of electronic components include at least one light-emitting diode.

12. The structure of claim 1 , wherein the flexible substrate film comprises a graphical pattern or coloration printed on the side facing the first and second thermoplastic materials.

Assignees

• Tacto Tek Oy
• Tactotek Oy

Inventors

• Heikkinen Mikko
• Saaski Jarmo

Classifications

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title