Method and apparatus for forming interface between coaxial cable and connector

Patent metadata

Field	Value
Publication number	US-10090626-B2
Application number	US-201615065468-A
Country	US
Kind code	B2
Filing date	Mar 9, 2016
Priority date	Mar 10, 2015
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the solder element is positioned within a vacuum chamber; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with a mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.

First claim

That which is claimed is:

1. A method of forming a solder joint between a coaxial cable and a coaxial connector, comprising the steps of:
positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the solder element is positioned within a vacuum chamber;
providing a mounting structure that allows for the positioning of the connector on the mounting structure such that the solder element abuts the mounting structure;
melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the mounting structure;
applying suction to the melting solder element with the vacuum chamber to reduce the formation of bubbles within the solder joint; and
after forming the solder joint between the outer conductor and the connector body, removing the connector from the mounting structure.

2. The method defined in claim 1 , wherein the melting step comprises applying heat to the solder element with a heating element located inside the vacuum chamber.

3. The method defined in claim 2 , wherein the mounting structure is located within the vacuum chamber.

4. The method defined in claim 1 , wherein the melting step comprises applying heat to the solder element with a heating element located in a wall of the vacuum chamber.

5. The method defined in claim 4 , wherein the vacuum chamber is configured to form a seal with the coaxial cable.

6. The method defined in claim 1 , wherein the solder element is a solder preform mounted on the outer conductor of the cable.

7. The method defined in claim 1 , wherein the mounting structure is an interface pedestal.

8. The method defined in claim 1 , wherein the coaxial cable further comprises an inner conductor, and wherein an inner contact is mounted onto the inner conductor prior to the step of positioning the solder element, and wherein the mounting structure includes a cavity for receiving the inner contact.

9. A method for attaching a connector to a coaxial cable, comprising the steps of:
positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector;
positioning the connector body on a mounting structure such that the solder element abuts the mounting structure;
melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a surface formed by contact with the mounting structure, the melting step being performed as the solder element resides in a vacuum chamber; and
applying suction to the melting solder element with the vacuum chamber to reduce the formation of bubbles within the solder joint; and
after forming the solder joint between the outer conductor and the connector body, removing the connector from the mounting structure.

10. The method defined in claim 9 , wherein the melting step comprises applying heat to the solder element with a heating element located inside the vacuum chamber.

11. The method defined in claim 10 , wherein the mounting structure is located within the vacuum chamber.

12. The method defined in claim 9 , wherein the melting step comprises applying heat to the solder element with a heating element located in a wall of the vacuum chamber.

13. The method defined in claim 12 , wherein the vacuum chamber is configured to form a seal with the coaxial cable.

14. The method defined in claim 9 , wherein the solder element is a solder preform mounted on the outer conductor of the cable.

15. The method defined in claim 9 , wherein the mounting structure is an interface pedestal.

16. The method defined in claim 9 , wherein the coaxial cable further comprises an inner conductor, and wherein an inner contact is mounted onto the inner conductor prior to the step of positioning the connector body, and wherein the mounting structure includes a cavity for receiving the inner contact.

17. An apparatus for forming a solder joint between a coaxial cable and a coaxial connector, comprising:
a mounting structure with an upper surface configured to receive a connector body and a coaxial cable;
a heating element positioned to melt a solder element positioned between an end of an outer conductor of the coaxial cable and the connector body of the connector to form a solder joint between the connector body and the coaxial cable, the upper surface of the mounting structure positioned to form a lower surface of the solder joint;
a vacuum chamber; and
a vacuum source attached to the vacuum chamber and positioned to apply suction to the solder joint as it forms between the connector body and the coaxial cable, the solder joint forming in the vacuum chamber.

18. The apparatus defined in claim 17 , wherein the heating element is located inside the vacuum chamber.

19. The apparatus defined in claim 18 , wherein the mounting structure is located within the vacuum chamber.

20. The apparatus defined in claim 17 , wherein the heating element is located in a wall of the vacuum chamber.

Assignees

• Commscope Technologies Llc

Inventors

• Harwath Frank A
• Paynter Jeffrey D
• Fleming James P
• Smentek David J

Classifications

• Y10T29/49169

  Assembling electrical component directly to terminal or elongated conductor · CPC title

• H01R43/0263 Primary

  for positioning or holding parts during soldering or welding process · CPC title

• H01R43/0235

  for applying solder (H01R43/0228 takes precedence) · CPC title

• Y10T29/49179

  by metal fusion bonding · CPC title

• H01R9/05

  for coaxial cables · CPC title