Resin composition and molded article containing the same

Patent metadata

Field	Value
Publication number	US-10090077-B2
Application number	US-201213979981-A
Country	US
Kind code	B2
Filing date	Jan 12, 2012
Priority date	Jan 17, 2011
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

The present invention provides a polyamide resin composition not only having an appropriate melt viscosity despite addition of a conductive filler thereto but also having excellent moldability, conductivity, low-temperature impact resistance, and fuel barrier properties. The present invention is a polyamide resin composition containing specific amounts of a polyamide, a modified resin, and a conductive filler. The polyamide contains: dicarboxylic acid units containing 50 mol % or more of terephthalic acid units and/or naphthalenedicarboxylic acid units; and diamine units containing 60 mol % or more of aliphatic diamine units having 4 to 18 carbon atoms, and has terminal amino groups in an amount of 5 to 60 μmol/g. The modified resin has been modified with an unsaturated compound having a carboxyl group and/or an acid anhydride group. In the polyamide resin composition, a difference between the number of moles (M I ) of the terminal amino groups of the polyamide and the number of moles (M II ) of the carboxyl groups and the acid anhydride groups of the modified resin in 1 g in total of the polyamide and the modified resin is −5.0 μmol or more and less than 4.0 μmol, and the number of moles (M II ) is more than 4.0 μmol.

First claim

The invention claimed is:

1. A polyamide resin composition, comprising:
a polyamide (A) comprising: dicarboxylic acid units comprising 50 to 100 mol % of terephthalic acid units, naphthalenedicarboxylic acid units, or a combination thereof; and diamine units comprising 60 to 100 mol % of aliphatic diamine units having 4 to 18 carbon atoms, the polyamide (A) having terminal amino groups ([NH 2 ]) in an amount of 5 to 60 μmol/g;
a modified resin (B) that has been modified with an unsaturated compound having at least one of a carboxyl group and an acid anhydride group; and
a conductive filler (C),
wherein:
the polyamide resin composition comprises 40 to 96.5 parts by mass of the polyamide (A), 3 to 30 parts by mass of the modified resin (B), and 0.5 to 30 parts by mass of the conductive filler (C), with respect to 100 parts by mass in total of the polyamide (A), the modified resin (B) and the conductive filler (C);
a difference (M I −M II ) between the number of moles (M I ) of the terminal amino groups of the polyamide (A) and the number of moles (M II ) of the carboxyl groups and the acid anhydride groups of the modified resin (B) in 1 g in total of the polyamide (A) and the modified resin (B) is −1.0 μmol or more and 1.0 μmol or less, and the number of moles (M II ) is more than 4.0 μmol;
the conductive filler (C) is at least one selected from the group consisting of a conductive carbon black and a carbon nanotube; and
the polyamide resin composition does not contain a copper-containing stabilizer.

2. The polyamide resin composition according to claim 1 , wherein the aliphatic diamine units having 4 to 18 carbon atoms are 1,9-nonanediamine units, 2-methyl-1,8-octanediamine units, or a combination thereof.

3. The polyamide resin composition according to claim 1 , wherein the modified resin (B) is a resin in which at least one selected from the group consisting of a polyolefin resin, a styrenic resin, a polynitrile resin, and a fluorine resin having been modified with an unsaturated compound having at least one of a carboxyl group and an acid anhydride group.

4. The polyamide resin composition according to claim 1 , wherein the conductive filler (C) comprises a carbon nanotube having a diameter of 0.5 nm to 100 nm and an aspect ratio of 5 or more.

5. The polyamide resin composition according to claim 1 , wherein the melt viscosity of the polyamide resin composition is measured at a melting time of 4 minutes and at a melting time of 15 minutes, where the melt viscosity values of the polyamide resin composition was measured under the conditions of a measurement temperature of 310° C., a load of 5 kg, and a melting time of 4 minutes and a melting time of 15 minutes, using a melt indexer manufactured by Toyo Seiki Seisaku-sho, Ltd., and the melt viscosity value at 15 minutes was less than the melt viscosity measured at 4 minutes.

6. The polyamide resin composition according to claim 1 , which exhibits a melt viscosity of from 1,870 to 3,200 Pa·s.

7. The polyamide resin composition according to claim 1 , wherein polyamide (A) is at least one member selected from the group consisting of:
a polyamide consisting of monomer units of terephthalic acid; 1,9-nonanediamine and 2-methyl-1,8-octanediamine; and benzoic acid;
a polyamide consisting of monomer units of terephthalic acid; 1,6-hexanediamine and 2-methyl-1,5-pentanediamine; and benzoic acid;
a polyamide consisting of monomer units of terephthalic acid; 1,10-decanediamine; and benzoic acid; and
a polyamide consisting of monomer units of 2,6-naphthalenedicarboxylic acid; 1,9-nonanediamine and 2-methyl-1,8-octanediamine; and benzoic acid.

8. The polyamide resin composition according to claim 1 , wherein modified resin (B) is at least one member selected from the group consisting of:
a maleic anhydride-modified ethylene-butene copolymer having an acid anhydride group content of 100 μmol/g;
a maleic anhydride-modified ethylene-butene copolymer having an acid anhydride group content of 50 μmol/g; and
a maleic anhydride-modified ethylene-butene copolymer having an acid anhydride group content of 25 μmol/g.

9. The polyamide resin composition according to claim 1 , wherein polyamide (A) has the terminal amino groups ([NH 2 ]) n amount of 5 to 30 μmol/g.

10. The polyamide resin composition according to claim 1 , wherein polyimide (A) has the terminal amino groups ([NH 2 ]) in an amount of 20 to 60 μmol/g.

11. The polyamide resin composition according to claim 1 , wherein polyamide (A) has the terminal amino groups ([NH 2 ]) in an amount of 25 to 60 μmol/g.

12. The polyamide resin composition according to claim 1 , wherein polyamide (A) has the terminal amino groups ([NH 2 ]) in an amount of 30 to 60 μmol/g.

13. The polyamide resin composition according to claim 1 , which does not contain a copper-containing compound.

14. The polyamide resin composition according to claim 1 , wherein:
the polyamide (A) is at least one member selected from the group consisting of
i) a polyamide comprising units of terephthalic acid and a 50:50 molar mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine,
ii) a polyamide comprising units of terephthalic acid and a 50:50 molar mixture of 1,9-nonanediamine and 2-methyl-1,5-pentanediamine,
iii) a polyamide comprising units of terephthalic acid and 1,10-decanediamine, and
iv) a polyamide comprising units of 2,6-naphthalenedicarboxylic acid and a 50:50 molar mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine;

the modified resin (B) is at least one member selected from the group consisting of
i) a maleic anhydride-modified ethylene-butene copolymer having an acid anhydride group content of 100 μmol/g,
ii) a maleic anhydride-modified ethylene-butene copolymer having an acid anhydride group content of 50 μmol/g, and
iii) a maleic anhydride-modified ethylene-butene copolymer having an acid anhydride group content of 25 μmol/g; and

the conductive filler (C) is at least one member selected from the group consisting of
i) carbon black, and
ii) carbon nanotubes having a diameter of from 10 to 15 nm, a fiber length of 3 μm, and an aspect ratio of from 200 to 300.

15. A molded article, comprising the polyamide resin composition according to claim 1 .

16. A fuel tube, comprising a layer containing the polyamide resin composition according to claim 1 .

Assignees

• Kumazawa Hiroe
• Yamasaki Hiroki
• Suzuki Hideaki
• Tamura Kozo
• Kuraray Co

Inventors

• Kumazawa Hiroe
• Yamasaki Hiroki
• Suzuki Hideaki
• Tamura Kozo

Classifications

• H01B1/24 Primary

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• C08K2201/011

  Nanostructured additives · CPC title

• C08G69/265

  from at least two different diamines or at least two different dicarboxylic acids · CPC title

• C08K7/24

  inorganic · CPC title

• F16L9/12

  of plastics with or without reinforcement (F16L9/16 - F16L9/22 take precedence) · CPC title