Singulation of valves

US10088076B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10088076-B2
Application numberUS-201615164573-A
CountryUS
Kind codeB2
Filing dateMay 25, 2016
Priority dateFeb 3, 2010
Publication dateOct 2, 2018
Grant dateOct 2, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method and apparatus for the singulation of valve plates and/or assembled valves from a lead-frame are described. The method and apparatus utilizes an electric current to fuse tabs which join the valve plate and/or the assembled valve to the lead-frame. The valve comprises a first and second valve plate with offsetting apertures and a flap disposed and movable between the first and second plates.

First claim

Opening claim text (preview).

We claim: 1. A valve formed by a process comprising the steps of: forming a first lead-frame having an opening with at least two tabs extending inwardly within the opening to a neck portion for supporting a first valve plate within the opening; chemically etching a groove into the neck portion of the at least two tabs; and applying an electrical current to the first lead-frame and the first valve plate to fuse the neck portion of the at least two tabs, the fusing facilitated by the groove and causing singulation of the first valve plate; wherein the first valve plate is formed from metal. 2. The valve formed by the process of claim 1 , wherein the metal is steel having a thickness between about 100 and about 200 microns. 3. The valve according to claim 1 , wherein forming the neck portions includes recessing the neck portions within the outer diameter of the first valve plate. 4. The valve formed by the process of claim 1 , the process further comprising: forming a second lead-frame having an opening with at least two second tabs extending inwardly within the opening of the second lead-frame to a second neck portion for supporting a second valve plate within the opening of the second lead-frame; and stacking the first lead-frame on top of the second lead-frame in electrical contact with the second lead-frame whereby the electrical current fuses the second neck portions of the at least two second tabs supporting the second valve plate. 5. The valve formed by the process of claim 4 , wherein forming the second neck portions includes recessing the second neck portions within the outer diameter of the second valve plate. 6. The valve formed by the process of claim 4 , wherein the valve further comprises a valve flap of insulating material between the at least two valve plates, the process further comprising: applying an electrical current to both the first lead-frame and the first valve plate, and the second lead-frame and the second valve plate. 7. The valve formed by the process of claim 4 , the process further comprising: forming a second groove in the second neck portions of the second tabs to facilitate fusing the second neck portions. 8. The valve formed by the process of claim 7 , wherein the second groove is formed by chemical etching. 9. The valve formed by the process of claim 4 , the process further comprising: forming a second groove in the second neck portions of the second tabs to facilitate fusing the second neck portions. 10. The valve formed by the process of claim 9 , wherein the second groove is formed by chemical etching. 11. A valve formed by a process comprising the steps of: forming a first lead-frame having an opening with at least two tabs extending inwardly within the opening to a neck portion for supporting a first valve plate within the opening; chemically etching a groove into the neck portion of the at least two tabs; and applying an electrical current to the first lead-frame and the first valve plate to fuse the neck portion of the at least two tabs, the fusing facilitated by the groove and causing singulation of the first valve plate; wherein a flap and the first valve plate are separated by a distance between about 5 microns and about 150 microns. 12. The valve formed by the process of claim 11 , wherein the flap is formed from a polymer having a thickness of about 3 microns and the distance between the flap and the first valve plate is between about 15 microns and about 50 microns. 13. The valve formed by the process of claim 11 , wherein forming the neck portions includes recessing the neck portions within the outer diameter of the first valve plate. 14. The valve formed by the process of claim 11 , the process further comprising: forming a second lead-frame having an opening with at least two second tabs extending inwardly within the opening of the second lead-frame to a second neck portion for supporting a second valve plate within the opening of the second lead-frame; and stacking the first lead-frame on top of the second lead-frame in electrical contact with the second lead-frame whereby the electrical current fuses the second neck portions of the at least two second tabs supporting the second valve plate. 15. The valve formed by the process of claim 14 , wherein forming the second neck portions includes recessing the second neck portions within the outer diameter of the second valve plate. 16. The valve formed by the process of claim 14 , wherein the valve further comprises a valve flap of insulating material between the at least two valve plates, the process further comprising: applying an electrical current to both the first lead-frame and the first valve plate, and the second lead-frame and the second valve plate.

Assignees

Inventors

Classifications

  • the valve being a membrane · CPC title

  • Integral resilient member forms plural valves · CPC title

  • Other details not peculiar to particular types of valves or cut-off apparatus · CPC title

  • with material shaping or cutting · CPC title

  • Integral resilient member forms plural valves · CPC title

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What does patent US10088076B2 cover?
A method and apparatus for the singulation of valve plates and/or assembled valves from a lead-frame are described. The method and apparatus utilizes an electric current to fuse tabs which join the valve plate and/or the assembled valve to the lead-frame. The valve comprises a first and second valve plate with offsetting apertures and a flap disposed and movable between the first and second pla…
Who is the assignee on this patent?
Kci Licensing Inc
What technology area does this patent fall under?
Primary CPC classification F16K99/0015. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Oct 02 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).