Seal rings in electrochemical processors

US10087543B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10087543-B2
Application numberUS-201715423298-A
CountryUS
Kind codeB2
Filing dateFeb 2, 2017
Priority dateMay 17, 2012
Publication dateOct 2, 2018
Grant dateOct 2, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.

First claim

Opening claim text (preview).

The invention claimed is: 1. A seal for use in an electrochemical processor, comprising: a seal ring having an inner diameter and an outer diameter, and a flat horizontal top surface; an arc section at the inner diameter of the seal ring extending from the flat horizontal top surface of the seal ring to a straight vertical section of the seal ring; the straight vertical section adjoining a tip arc having a first radius of curvature; an outer wall adjoining a bottom surface of the seal ring, and an end radius having a second radius of curvature, the end radius between the outer wall and the tip arc, with the outer wall parallel to the straight vertical section, and with the first radius of curvature 2 to 30 times greater than the second radius of curvature; a support ring supporting the seal ring, the support ring having a flat inner edge inserted into an outward facing horizontal slot in the seal ring adjacent to the inner diameter of the seal ring, with the horizontal slot parallel to the top surface of the seal ring. 2. The seal of claim 1 wherein the outer wall is straight and vertical and an inner wall of the seal ring between the arc section and the tip arc is flat, parallel and co-axial with the outer wall. 3. The seal of claim 1 having a height of 1 to 5 mm. 4. The seal of claim 1 wherein the inside diameter is 294.6 to 295.7 mm. 5. The seal of claim 1 with the tip arc having a concave curvature. 6. The seal of claim 1 with the end radius having a radius of curvature of less than 0.13 mm. 7. The seal of claim 1 wherein the straight vertical section is flat and concentric with the outer wall. 8. The seal of claim 1 wherein the support ring comprises metal and the seal ring comprises a fluoroelastomer. 9. A seal for sealing against a semiconductor material wafer during electroplating in an electrochemical processor, comprising: a seal ring having an inner diameter, an outer diameter, and a top surface, wherein the entire top surface of the seal ring is horizontal and flat; an arc section at the inner diameter of the seal ring extending from the flat horizontal top surface of the seal ring to a straight vertical section of the seal ring; the straight vertical section adjoining a tip arc having a first radius of curvature; an outer wall adjoining a bottom surface of the seal ring, and an end radius having a second radius of curvature, the end radius between the outer wall and the tip arc, with the outer wall parallel to the straight vertical section, and with the first radius of curvature greater than the second radius of curvature; and a support ring supporting the seal ring, the support ring having a flat inner edge inserted into an outward facing horizontal slot in the seal ring parallel to the top surface of the seal ring. 10. The seal of claim 9 wherein the support ring is entirely flat. 11. The seal of claim 1 wherein the support ring is entirely flat.

Assignees

Inventors

Classifications

  • H10W76/40Primary

    Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

  • with at least one lip · CPC title

  • and with at least one flexible lip · CPC title

  • with at least one lip for each surface, e.g. U-cup packings · CPC title

  • Sealings · CPC title

Patent family

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Frequently asked questions

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What does patent US10087543B2 cover?
A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Kni…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10W76/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 02 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).