Carbon dioxide reducing method, carbon dioxide reducing cell, and carbon dioxide reducing apparatus
US-9598781-B2 · Mar 21, 2017 · US
US10087533B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10087533-B2 |
| Application number | US-201514795572-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 9, 2015 |
| Priority date | Aug 29, 2014 |
| Publication date | Oct 2, 2018 |
| Grant date | Oct 2, 2018 |
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A method for reducing carbon dioxide is provided. In the present method, used is an anode electrode comprises a stacked structure of a photoelectric conversion layer, a metal layer, and an In x Ga 1-x N layer (where 0<x≤1). The In x Ga 1-x N layer is of i-type or n-type. The metal layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer. When irradiating the anode electrode with light, a first light part included in the light is absorbed by the In x Ga 1-x N layer and a second light part included in the light travels through the In x Ga 1-x N layer. The second light part is absorbed by the photoelectric conversion layer to generate electric power in the photoelectric conversion layer. The second light part has a longer wavelength than the first light part. The carbon dioxide contained in the first electrolyte solution is reduced on the cathode electrode.
Opening claim text (preview).
The invention claimed is: 1. A method for reducing carbon dioxide, comprising: (a) preparing a carbon dioxide reduction device comprising: a cathode chamber storing a first electrolyte solution containing carbon dioxide; an anode chamber storing a second electrolyte solution; a proton exchange membrane interposed between the cathode chamber and the anode chamber; a cathode electrode that is in contact with the first electrolyte solution and that comprises a metal or a metal compound on the surface thereof; and an anode electrode that is in contact with the second electrolyte solution, wherein the carbon dioxide reduction device does not comprise an external power supply; the anode electrode comprises a stacked structure of a photoelectric conversion layer, a metal layer, and an In x Ga 1-x N layer (where 0<x≤1); the In x Ga 1-x N layer is of i-type or n-type; the metal layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer; the metal layer covers a part of the photoelectric conversion layer; the photoelectric conversion layer comprises a first p-type semiconductor layer and a first n-type semiconductor layer; the first p-type semiconductor layer is electrically connected to the In x Ga 1-x N layer; and the first n-type semiconductor layer is electrically connected to the cathode electrode; and (b) irradiating the anode electrode with light, wherein in the step (b), a first light part included in the light is absorbed by the In x Ga 1-x N layer; a second light part included in the light travels through the In x Ga 1-x N layer; the second light part is absorbed by the photoelectric conversion layer to generate electric power in the photoelectric conversion layer; the second light part has a longer wavelength than the first light part; and the carbon dioxide contained in the first electrolyte solution is reduced on the cathode electrode. 2. The method according to claim 1 , wherein the light has a wavelength not less than 290 nanometers and not more than 840 nanometers. 3. The method according to claim 2 , wherein the light is sunlight. 4. The method according to claim 1 , wherein the value of x is not more than 0.4. 5. The method according to claim 4 , wherein the value of x is not less than 0.05. 6. The method according to claim 5 , wherein the value of x is not more than 0.15. 7. The method according to claim 1 , wherein the anode electrode further comprises an n-type GaN layer; and the GaN layer is interposed between the In x Ga 1-x N layer and the metal layer. 8. The method according to claim 1 , wherein the first p-type semiconductor layer is formed of at least one selected from the group consisting of Si, GaAs, GaP, and Ge; and the first n-type semiconductor layer is formed of at least one selected from the group consisting of Si, GaAs, GaP, and Ge. 9. The method according to claim 1 , wherein the photoelectric conversion layer further comprises a second p-type semiconductor layer and a second n-type semiconductor layer; the first n-type semiconductor layer is interposed between the first p-type semiconductor layer and the second p-type semiconductor layer; and the second p-type semiconductor layer is interposed between the first n-type semiconductor layer and the second n-type semiconductor layer. 10. The method according to claim 1 , wherein the first p-type semiconductor layer and the first n-type semiconductor layer are formed of a different semiconductor from each other. 11. The method according to claim 1 , wherein the stacked structure further comprises a NiO y particle or a NiO y layer (0<y≤1); and the In x Ga 1-x N layer is interposed between the NiO y particle or the NiO y layer and the metal layer. 12. A carbon dioxide reduction device comprising: a cathode chamber storing a first electrolyte solution containing carbon dioxide; an anode chamber storing a second electrolyte solution; a proton exchange membrane interposed between the cathode chamber and the anode chamber; a cathode electrode that is in contact with the first electrolyte solution and that comprises a metal or a metal compound on the surface thereof; and an anode electrode that is in contact with the second electrolyte solution, wherein the carbon dioxide reduction device does not comprise an external power supply; the anode electrode comprises a stacked structure of a photoelectric conversion layer, a metal layer, and an In x Ga 1-x N layer (where 0<x≤1); the In x Ga 1-x N layer is of i-type or n-type; the metal layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer; the metal layer covers a part of the photoelectric conversion layer; the photoelectric conversion layer comprises a first p-type semiconductor layer and a first n-type semiconductor layer; the first p-type semiconductor layer is electrically connected to the In x Ga 1-x N layer; and the first n-type semiconductor layer is electrically connected to the cathode electrode. 13. A method for reducing carbon dioxide, comprising: (a) preparing a carbon dioxide reduction device comprising: a cathode chamber storing a first electrolyte solution containing carbon dioxide; an anode chamber storing a second electrolyte solution; a proton exchange membrane interposed between the cathode chamber and the anode chamber; a cathode electrode that is in contact with the first electrolyte solution and that comprises a metal or a metal compound on the surface thereof; and an anode electrode that is in contact with the second electrolyte solution, wherein the carbon dioxide reduction device does not comprise an external power supply; the anode electrode comprises a stacked structure of a photoelectric conversion layer, a transparent electrode layer, and an In x Ga 1-x N layer (where 0<x≤1); the In x Ga 1-x N layer is of i-type or n-type; the transparent electrode layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer; the photoelectric conversion layer comprises a first p-type semiconductor layer and a first n-type semiconductor layer; the first p-type semiconductor layer is electrically connected to the In x Ga 1-x N layer; and the first n-type semiconductor layer is electrically connected to the cathode electrode; and (b) irradiating the anode electrode with light, wherein in the step (b), a first light part included in the light is absorbed by the In x Ga 1-x N layer; a second light part included in the light travels through the In x Ga 1-x N layer; the second light part is absorbed by the photoelectric conversion layer to generate electric power in the photoelectric conversion layer; the second light part has a longer wavelength than the first light part; and the carbon dioxide contained in the first electrolyte solution is reduced on the cathode electrode. 14. The method according to claim 13 , wherein the light has a wavelength not less than 290 nanometers and not more than 840 nanometers. 15. The method according to claim 14 , wherein the light is sunlight. 16. The method according to claim 13 , wherein the value of x is not more than 0.4. 17. The method according to claim 16 , wherein the value of x is not less than 0.05. 18. The method according to claim 17 , wherein the value of x is not more than 0.15. 19. The method according to claim 13 , wherein the anode electrode further comprises an n-type GaN layer; and the GaN layer is interposed between the In x Ga 1-x
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