Method for reducing carbon dioxide and device used therefor

US10087533B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10087533-B2
Application numberUS-201514795572-A
CountryUS
Kind codeB2
Filing dateJul 9, 2015
Priority dateAug 29, 2014
Publication dateOct 2, 2018
Grant dateOct 2, 2018

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  5. First independent claim

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Abstract

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A method for reducing carbon dioxide is provided. In the present method, used is an anode electrode comprises a stacked structure of a photoelectric conversion layer, a metal layer, and an In x Ga 1-x N layer (where 0<x≤1). The In x Ga 1-x N layer is of i-type or n-type. The metal layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer. When irradiating the anode electrode with light, a first light part included in the light is absorbed by the In x Ga 1-x N layer and a second light part included in the light travels through the In x Ga 1-x N layer. The second light part is absorbed by the photoelectric conversion layer to generate electric power in the photoelectric conversion layer. The second light part has a longer wavelength than the first light part. The carbon dioxide contained in the first electrolyte solution is reduced on the cathode electrode.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for reducing carbon dioxide, comprising: (a) preparing a carbon dioxide reduction device comprising: a cathode chamber storing a first electrolyte solution containing carbon dioxide; an anode chamber storing a second electrolyte solution; a proton exchange membrane interposed between the cathode chamber and the anode chamber; a cathode electrode that is in contact with the first electrolyte solution and that comprises a metal or a metal compound on the surface thereof; and an anode electrode that is in contact with the second electrolyte solution, wherein the carbon dioxide reduction device does not comprise an external power supply; the anode electrode comprises a stacked structure of a photoelectric conversion layer, a metal layer, and an In x Ga 1-x N layer (where 0<x≤1); the In x Ga 1-x N layer is of i-type or n-type; the metal layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer; the metal layer covers a part of the photoelectric conversion layer; the photoelectric conversion layer comprises a first p-type semiconductor layer and a first n-type semiconductor layer; the first p-type semiconductor layer is electrically connected to the In x Ga 1-x N layer; and the first n-type semiconductor layer is electrically connected to the cathode electrode; and (b) irradiating the anode electrode with light, wherein in the step (b), a first light part included in the light is absorbed by the In x Ga 1-x N layer; a second light part included in the light travels through the In x Ga 1-x N layer; the second light part is absorbed by the photoelectric conversion layer to generate electric power in the photoelectric conversion layer; the second light part has a longer wavelength than the first light part; and the carbon dioxide contained in the first electrolyte solution is reduced on the cathode electrode. 2. The method according to claim 1 , wherein the light has a wavelength not less than 290 nanometers and not more than 840 nanometers. 3. The method according to claim 2 , wherein the light is sunlight. 4. The method according to claim 1 , wherein the value of x is not more than 0.4. 5. The method according to claim 4 , wherein the value of x is not less than 0.05. 6. The method according to claim 5 , wherein the value of x is not more than 0.15. 7. The method according to claim 1 , wherein the anode electrode further comprises an n-type GaN layer; and the GaN layer is interposed between the In x Ga 1-x N layer and the metal layer. 8. The method according to claim 1 , wherein the first p-type semiconductor layer is formed of at least one selected from the group consisting of Si, GaAs, GaP, and Ge; and the first n-type semiconductor layer is formed of at least one selected from the group consisting of Si, GaAs, GaP, and Ge. 9. The method according to claim 1 , wherein the photoelectric conversion layer further comprises a second p-type semiconductor layer and a second n-type semiconductor layer; the first n-type semiconductor layer is interposed between the first p-type semiconductor layer and the second p-type semiconductor layer; and the second p-type semiconductor layer is interposed between the first n-type semiconductor layer and the second n-type semiconductor layer. 10. The method according to claim 1 , wherein the first p-type semiconductor layer and the first n-type semiconductor layer are formed of a different semiconductor from each other. 11. The method according to claim 1 , wherein the stacked structure further comprises a NiO y particle or a NiO y layer (0<y≤1); and the In x Ga 1-x N layer is interposed between the NiO y particle or the NiO y layer and the metal layer. 12. A carbon dioxide reduction device comprising: a cathode chamber storing a first electrolyte solution containing carbon dioxide; an anode chamber storing a second electrolyte solution; a proton exchange membrane interposed between the cathode chamber and the anode chamber; a cathode electrode that is in contact with the first electrolyte solution and that comprises a metal or a metal compound on the surface thereof; and an anode electrode that is in contact with the second electrolyte solution, wherein the carbon dioxide reduction device does not comprise an external power supply; the anode electrode comprises a stacked structure of a photoelectric conversion layer, a metal layer, and an In x Ga 1-x N layer (where 0<x≤1); the In x Ga 1-x N layer is of i-type or n-type; the metal layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer; the metal layer covers a part of the photoelectric conversion layer; the photoelectric conversion layer comprises a first p-type semiconductor layer and a first n-type semiconductor layer; the first p-type semiconductor layer is electrically connected to the In x Ga 1-x N layer; and the first n-type semiconductor layer is electrically connected to the cathode electrode. 13. A method for reducing carbon dioxide, comprising: (a) preparing a carbon dioxide reduction device comprising: a cathode chamber storing a first electrolyte solution containing carbon dioxide; an anode chamber storing a second electrolyte solution; a proton exchange membrane interposed between the cathode chamber and the anode chamber; a cathode electrode that is in contact with the first electrolyte solution and that comprises a metal or a metal compound on the surface thereof; and an anode electrode that is in contact with the second electrolyte solution, wherein the carbon dioxide reduction device does not comprise an external power supply; the anode electrode comprises a stacked structure of a photoelectric conversion layer, a transparent electrode layer, and an In x Ga 1-x N layer (where 0<x≤1); the In x Ga 1-x N layer is of i-type or n-type; the transparent electrode layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer; the photoelectric conversion layer comprises a first p-type semiconductor layer and a first n-type semiconductor layer; the first p-type semiconductor layer is electrically connected to the In x Ga 1-x N layer; and the first n-type semiconductor layer is electrically connected to the cathode electrode; and (b) irradiating the anode electrode with light, wherein in the step (b), a first light part included in the light is absorbed by the In x Ga 1-x N layer; a second light part included in the light travels through the In x Ga 1-x N layer; the second light part is absorbed by the photoelectric conversion layer to generate electric power in the photoelectric conversion layer; the second light part has a longer wavelength than the first light part; and the carbon dioxide contained in the first electrolyte solution is reduced on the cathode electrode. 14. The method according to claim 13 , wherein the light has a wavelength not less than 290 nanometers and not more than 840 nanometers. 15. The method according to claim 14 , wherein the light is sunlight. 16. The method according to claim 13 , wherein the value of x is not more than 0.4. 17. The method according to claim 16 , wherein the value of x is not less than 0.05. 18. The method according to claim 17 , wherein the value of x is not more than 0.15. 19. The method according to claim 13 , wherein the anode electrode further comprises an n-type GaN layer; and the GaN layer is interposed between the In x Ga 1-x

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What does patent US10087533B2 cover?
A method for reducing carbon dioxide is provided. In the present method, used is an anode electrode comprises a stacked structure of a photoelectric conversion layer, a metal layer, and an In x Ga 1-x N layer (where 0<x≤1). The In x Ga 1-x N layer is of i-type or n-type. The metal layer is interposed between the photoelectric conversion layer and the In x Ga 1-x N layer. When irradiating the an…
Who is the assignee on this patent?
Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification C25B3/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 02 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).