Method of fabricating substrate structure and substrate structure fabricated by the same method

Patent metadata

Field	Value
Publication number	US-10087527-B2
Application number	US-201414265369-A
Country	US
Kind code	B2
Filing date	Apr 30, 2014
Priority date	Apr 30, 2014
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

First claim

What is claimed is:

1. A method of fabricating a substrate structure comprising:
forming a first metal layer directly on a base;
forming a first protective layer directly on the first metal layer, so that the first protective layer is in direct contact with the first metal layer;
forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, wherein the second protective layer physically contacts a top surface of the base;
patterning the second protective layer to form a pattern having an opening exposing the first protective layer; and
forming a second metal layer within the opening of the second protective layer and directly on the first protective layer, wherein the second protective layer covers a top surface and at least two opposite side surfaces of the first protective layer without covering a top surface of the second metal layer, and the second protective layer is laser sensitive and is capable of being etched by applying laser thereto, and
wherein the second protective layer encircles the first metal layer and the first protective layer with the second metal layer and the base.

2. The method of claim 1 , wherein the compound is selected from a group of Octadecanethiol, Nonanethiol, 1-Hexadecanethiol, 1-Butanethiol, tert-Nonyl mercaptan, Benzyl mercaptan, and Thiophenol.

3. The method of claim 1 , wherein the step of forming the first metal layer directly on the base comprises:
using laser to form a recess in the base; and
disposing the first metal layer within the recess.

4. The method of claim 1 , wherein the step of forming the second protective layer comprises:
applying a solution of the compound to the first protective layer.

5. The method of claim 1 , wherein the step of patterning the second protective layer comprises etching the second protective layer with laser to form the pattern.

6. The method of claim 1 , wherein a material of the first metal layer is copper or aluminium.

7. The method of claim 1 , wherein the first protective layer is a diffusion barrier layer which prevents diffusion between the first metal layer and the second metal layer and prevents oxidation of the first metal layer.

8. The method of claim 7 , wherein a material of the first protective layer is nickel or silver.

9. The method of claim 1 , wherein the step of forming the first metal layer comprises forming the first metal layer directly on the base by using electroless plating.

10. The method of claim 1 , wherein the step of forming the second metal layer comprises forming the second metal layer directly on the first protective layer by using electroless plating.

11. The method of claim 1 , wherein the step of patterning the second protective layer is performed without a photomask.

12. The method of claim 1 , wherein the step of forming the second protective layer is performed without spraying of polymeric resin.

13. A substrate structure comprising:
a base having a recess therein;
a first metal layer fitted in the recess of the base;
a first protective layer disposed on the first metal layer, wherein the first protective layer is in direct contact with the first metal layer;
a second protective layer comprising a thiol compound, wherein the second protective layer is disposed on the first protective layer and is laser sensitive, thereby the second protective layer being capable of being etched by applying laser thereto, and the second protective layer has a pattern which comprises an opening exposing the first protective layer; and
a second metal layer disposed within the opening of the second protective layer and disposed on the first protective layer, wherein the second protective layer covers a top surface and at least two opposite side surfaces of the first protective layer without covering a top surface of the second metal layer, and the second protective layer physically contacts a top surface of the base, thereby encircling the first metal layer and the first protective layer with the second metal layer and the base.

14. The substrate structure of claim 13 , wherein the thiol compound is Octadecanethiol.

15. The substrate structure of claim 13 , wherein the thiol compound is selected from a group of Nonanethiol, 1-Hexadecanethiol, 1-Butanethiol, tert-Nonyl mercaptan, Benzyl mercaptan, and Thiophenol.

16. The substrate structure of claim 13 , wherein a material of the first metal layer is copper or aluminium.

17. The substrate structure of claim 13 , wherein the first protective layer is a diffusion barrier layer which prevents diffusion between the first metal layer and the second metal layer and prevents oxidation.

18. The substrate structure of claim 17 , wherein a material of the first protective layer is nickel or silver or chromium.

19. The substrate structure of claim 13 , wherein a material of the base is polymer.

20. The substrate structure of claim 13 , wherein a material of the second metal layer is gold.

Assignees

• Wistron Neweb Corp

Inventors

• Radi Babak
• Chen Shih-Hong
• Kuo Yu-Fu
• Chen Chun-Lin
• Chen Jing-Wen

Classifications

• H10W76/17

  characterised by their materials · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W20/4432

  the principal metal being a noble metal, e.g. gold · CPC title

• H10W20/4424

  Copper alloys · CPC title

• H10W20/4421

  the principal metal being copper · CPC title