Resin-impregnated boron nitride sintered body and use for same

Patent metadata

Field	Value
Publication number	US-10087112-B2
Application number	US-201414895469-A
Country	US
Kind code	B2
Filing date	Jun 2, 2014
Priority date	Jun 3, 2013
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

First claim

The invention claimed is:

1. A resin-impregnated boron nitride sintered body, comprising:
30 to 90 volume % of a boron nitride sintered body having hexagonal boron nitride particles bonded three-dimensionally; and
10 to 70 volume % of a resin; wherein
the boron nitride sintered body has a porosity of 10 to 70%;
the hexagonal boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more;
the boron nitride sintered body has a graphitization index (GI) by powder X-ray diffractometry is 4.0 or less;
the boron nitride sintered body is plate-shaped; and
an a-axis of the hexagonal boron nitride particles is aligned with respect to a plate-thickness direction of the boron nitride sintered body.

2. The resin-impregnated boron nitride sintered body of claim 1 , wherein a shore hardness measured with respect to the plate-thickness direction of the resin-impregnated boron nitride sintered body is 25HS or lower.

3. The resin-impregnated boron nitride sintered body of claim 1 , wherein:
a three-point bending strength measured with respect to the plate-thickness direction of the boron nitride sintered body is 3 to 15 MPa; and
a thermal conductivity measured from the plate-thickness direction of the boron nitride sintered body is 40 to 110 W/(m·K).

4. The resin-impregnated boron nitride sintered body of claim 2 , wherein:
a three-point bending strength measured with respect to the plate-thickness direction of the boron nitride sintered body is 3 to 15 MPa; and
a thermal conductivity measured from the plate-thickness direction of the boron nitride sintered body is 40 to 110 W/(m·K).

5. The resin-impregnated boron nitride sintered body of claim 1 , wherein the resin is a thermosetting resin.

6. A heat dissipating member using the resin-impregnated boron nitride sintered body of claim 1 .

7. A substrate for power module using the heat dissipating member of claim 6 .

8. A double-side heat dissipating power module for automobiles using the heat dissipating member of claim 6 .

Assignees

• Denka Company Ltd

Inventors

• Ikarashi Koki
• Nonaka Shuhei
• Mitsunaga Toshikatsu
• Hirotsuru Hideki
• Shiiba Mitsuru

Classifications

• H10W70/695

  Organic materials · CPC title

• H10W40/251

  Organics · CPC title

• C04B2235/5292

  Flakes, platelets or plates · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• C04B2235/5472

  Bimodal, multi-modal or multi-fraction · CPC title