Flexible substrate with integrated circuit

Patent metadata

Field	Value
Publication number	US-10086620-B2
Application number	US-201715842469-A
Country	US
Kind code	B2
Filing date	Dec 14, 2017
Priority date	Apr 30, 2012
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an integrated circuit connected to the single flexible substrate, and an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller. The electrical connector pad array includes first electrical connector pads connected to the integrated circuit and second electrical connector pads for connection to a fluid dispensing die.

First claim

What is claimed is:

1. A flexible circuit for a fluid cartridge, comprising
a single flexible substrate;
an integrated circuit connected to the single flexible substrate; and
an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller, the electrical connector pad array including first electrical connector pads connected to the integrated circuit and second electrical connector pads for connection to a fluid dispensing die.

2. The flexible circuit of claim 1 , wherein the integrated circuit includes a secure microcontroller.

3. The flexible circuit of claim 1 , wherein at least a portion of the first and the second electrical connector pads are arranged on one straight line.

4. The flexible circuit of claim 1 , wherein:
the integrated circuit is arranged between the electrical connector pad array and a side edge of the single flexible substrate; and
an axis of symmetry of the electrical connector pad array is arranged parallel to and at a distance from a longitudinal center line of the single flexible substrate.

5. The flexible circuit of claim 1 , comprising the fluid dispensing die and wherein the electrical connector pad array includes at least one electrical connector pad that is connected to both the integrated circuit and the fluid dispensing die.

6. The flexible circuit of claim 1 , wherein the first electrical connector pads include at least four first electrical connector pads.

7. The flexible circuit of claim 1 comprising:
bond pads for connecting the integrated circuit to a conductor line connected to the electrical connector pads; and
an encapsulation layer covering the integrated circuit, the bond pads, and the electrical connector pad array.

8. The flexible circuit of claim 1 , comprising the fluid dispensing die and wherein:
the single flexible substrate includes a first window and a second window;
the integrated circuit is connected to the single flexible substrate near edges of the first window; and
the fluid dispensing die is connected to the single flexible substrate near edges of the second window.

9. A fluid cartridge, comprising
a fluid reservoir;
a fluid dispensing die;
a single flexible substrate;
a first integrated circuit connected to the single flexible substrate;
an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller, the electrical connector pad array including first electrical connector pads connected to the integrated circuit and second electrical connector pads connected to the fluid dispensing die;
a second integrated circuit connected to at least one of the second electrical connector pads, distanced from the first integrated circuit, connected to the fluid dispensing die, and configured to signal actuators in the fluid dispensing die;
a cartridge ID stored on the second integrated circuit; and
an authentication code stored on the first integrated circuit, the authentication code corresponding to the cartridge ID so that the cartridge ID and the authentication code can be matched by the host controller.

10. A fluid cartridge comprising
a flexible substrate;
an integrated circuit connected to the flexible substrate;
a fluid dispensing die connected to the same flexible substrate as the integrated circuit; and
a constant electrical connector pad array arranged on the same flexible substrate as the integrated circuit and the fluid dispensing die, for connection to a host controller, the electrical connector pad array including first electrical connector pads connected to the integrated circuit and second electrical connector pads connected to actuators in the fluid dispensing die.

11. A method of manufacturing a flexible circuit for a fluid cartridge, comprising
providing a constant array of first and second electrical connector pads on a flexible substrate;
connecting an integrated circuit to the flexible substrate;
connecting a fluid dispensing die to the flexible substrate;
connecting the integrated circuit to the first electrical connector pads; and
connecting the fluid dispensing die to the second electrical connector pads.

12. The method of claim 11 , comprising:
positioning the fluid dispensing die and the integrated circuit with respect to corresponding windows in the flexible substrate; and wherein
connecting the integrated circuit to the first electrical connector pads includes gang bonding the integrated circuit to first conductor lines on the flexible substrate; and
connecting the fluid dispensing die to the second electrical connector pads includes gang boding the fluid dispensing die to second conductor lines on the flexible substrate in the same process step with gang bonding the integrated circuit to the first conductor lines.

13. The method of claim 12 , comprising encapsulating the electrical connector pads and the integrated circuit with the same material using the same encapsulation tool.

14. The method of claim 11 , wherein the integrated circuit includes a secure microcontroller.

15. The method of claim 11 , comprising:
writing a cartridge ID on the fluid dispensing die; and
writing an authentication code on the integrated circuit, the authentication code corresponding to the cartridge ID on the fluid dispensing die.

16. The cartridge of claim 9 , wherein:
the first integrated circuit is arranged between the electrical connector pad array and a side edge of the single flexible substrate; and
an axis of symmetry of the electrical connector pad array is arranged parallel to and at a distance from a longitudinal center line of the single flexible substrate.

17. The cartridge of claim 9 , wherein the electrical connector pad array includes at least one electrical connector pad that is connected to both the integrated circuit and the fluid dispensing die.

18. The cartridge of claim 10 , wherein:
the integrated circuit is arranged between the electrical connector pad array and a side edge of the flexible substrate; and
an axis of symmetry of the electrical connector pad array is arranged parallel to and at a distance from a longitudinal center line of the flexible substrate.

19. The cartridge of claim 10 , wherein the electrical connector pad array includes at least one electrical connector pad that is connected to both the integrated circuit and the fluid dispensing die.

Assignees

• Hewlett Packard Development Co

Inventors

• Campbell-Brown Iain
• Walsh Mark
• Oliver John
• Ward Jefferson P
• Shipman Amy

Classifications

• H10W72/0198

  batch processes · CPC title

• B41J2/17543 Primary

  Cartridge presence detection or type identification · CPC title

• B41J2/17546

  electronically · CPC title

• H01L2224/97

  Electricity · mapped topic

• B41J2/17553

  Outer structure · CPC title