Method for producing substrates

Patent metadata

Field	Value
Publication number	US-10086493-B2
Application number	US-201615153327-A
Country	US
Kind code	B2
Filing date	May 12, 2016
Priority date	May 13, 2015
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

Proposed herein is a method for producing substrates, particularly those of synthetic quartz glass, while saving the substrate surface from killer defects without resorting to any large-scale apparatus and precision polishing plate, thereby reducing defects and improving yields more than in production with conventional facilities. The method for producing substrates by polishing, includes steps of placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with the surface of the substrate stocks, with the surface of the substrate stocks being coated with an impact-absorbing liquid and the lower polishing plate being rotated, and rotating the upper and lower polishing plates, with the surface of the substrate stocks being accompanied by a polishing slurry.

First claim

The invention claimed is:

1. A method for producing substrates, comprising the steps of:
placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate,
bringing an upper polishing plate into contact with each of surfaces of said substrate stocks, each of the surfaces of said substrate stocks coated with an impact-absorbing liquid, while rotating said lower polishing plate, and
polishing each of the surfaces of said substrate stocks by a polishing slurry, while rotating said upper and lower polishing plates, wherein
said impact-absorbing liquid is an aqueous solution containing at least one species selected from glycols, polyacrylic acid and derivatives thereof, poly(meth)acrylic acid and derivatives thereof, diethanolamine, and triethanolamine.

2. The method for producing substrates of claim 1 , wherein said upper polishing plate is brought into contact with each of the surfaces of said substrate stocks, with said lower polishing plate rotating at 1 rpm to 4 rpm.

3. The method for producing substrates of claim 1 , wherein said impact-absorbing liquid has a viscosity of 10 mPa·s to 100 mPa·s at 20° C.

4. The method for producing substrates of claim 1 , wherein said upper polishing plate is moved to the surface of substrate stocks until said upper polishing plate comes into contact with the each of the surfaces of substrate stocks at speed of 5 mm/second or more and 20 mm/second or less.

5. The method for producing substrates of claim 1 , wherein said polishing slurry is an aqueous dispersion containing at least one species of abrasive grains selected from the group consisting of alumina abrasive grains, silicon carbide abrasive grains, and zirconium oxide abrasive gains.

6. The method for producing substrates of claim 1 , wherein said substrate stocks have a thickness of 0.1 mm to 7 mm before polishing.

7. The method for producing substrates of claim 1 , wherein said substrate stocks are synthetic quartz glass.

8. The method for producing substrates of claim 1 , wherein said polishing step corresponds to a lapping step.

9. A method for producing substrates, comprising the steps of:
placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate,
bringing an upper polishing plate into contact with each of surfaces of said substrate stocks, each of the surfaces of said substrate stocks coated with an impact-absorbing liquid, while rotating said lower polishing plate, and
polishing each of the surfaces of said substrate stocks by a polishing slurry, while rotating said upper and lower polishing plates, wherein
said impact-absorbing liquid has a viscosity of 10 mPa·s to 100 mPa·s at 20° C.

10. The method for producing substrates of claim 9 , wherein said upper polishing plate is brought into contact with each of the surfaces of said substrate stocks, with said lower polishing plate rotating at 1 rpm to 4 rpm.

11. The method for producing substrates of claim 9 , wherein said upper polishing plate is moved to the surface of substrate stocks until said upper polishing plate comes into contact with the each of the surfaces of substrate stocks at speed of 5 mm/second or more and 20 mm/second or less.

12. The method for producing substrates of claim 9 , wherein said polishing slurry is an aqueous dispersion containing at least one species of abrasive grains selected from the group consisting of alumina abrasive grains, silicon carbide abrasive grains, and zirconium oxide abrasive gains.

13. The method for producing substrates of claim 9 , wherein said substrate stocks have a thickness of 0.1 mm to 7 mm before polishing.

14. The method for producing substrates of claim 9 , wherein said substrate stocks are synthetic quartz glass.

15. The method for producing substrates of claim 9 , wherein said polishing step corresponds to a lapping step.

Assignees

• Shinetsu Chemical Co

Inventors

• Matsui Harunobu
• Harada Daijitsu
• Takeuchi Masaki

Classifications

• B24B37/10 Primary

  for single side lapping · CPC title

• B24B7/241

  Methods · CPC title

• B24B55/00

  Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition (of general applicability for machine tools B23Q11/00; in general F16P) · CPC title

• B24B7/228

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24B37/08

  for double side lapping · CPC title