Laser processing machine

Patent metadata

Field	Value
Publication number	US-10086475-B2
Application number	US-201815892100-A
Country	US
Kind code	B2
Filing date	Feb 8, 2018
Priority date	Jul 22, 2010
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

Laser processing machines, such as laser cutting machine, including a work table receiving workpiece, and work arm with a laser cutting head. Laser cutting head includes nozzle receiving device and nozzle. Via nozzle laser beam may be directed onto work piece. Machine includes main drives moving work arm and/or the laser cutting head on X-Y-Z axes to process work piece, as well as an alignment unit to adjust laser beam. An adjusting station includes receiving unit fixing nozzle and/or the nozzle receiving device during centering of nozzle. The alignment unit has head element in laser cutting head. Head element receives nozzle and/or the nozzle receiving device and is slidable in X-Y directions, via the main drives. Head element may be fixed in a selected position, within the laser cutting head, via clamping device releasable during nozzle centering at adjusting station.

First claim

The invention claimed is:

1. A process for aligning a laser processing machine laser beam, the method comprising:
moving a laser head to a nozzle adjustment station with laser head main drives;
placing a nozzle of the laser head in a nozzle receiving unit of the nozzle adjustment station;
fixing, in the receiving unit, the nozzle of the laser head against movement under action of the laser head main drives;
controllably releasing a clamping device in the laser head to allow lateral sliding between the nozzle fixed in the nozzle receiving unit and the laser head;
aligning a laser beam in the nozzle by repositioning the laser head with the laser head main drives; and
activating the clamping device to fix the beam-aligned nozzle to the laser head.

2. The process according to claim 1 , further comprising:
applying pneumatic pressure to a piston to controllably release the clamping device in the laser head to allow lateral sliding between the nozzle fixed in the nozzle receiving unit and the laser head; and
applying spring pressure to activate the clamping device to fix the beam-aligned nozzle to the laser head.

3. The process according to claim 2 , wherein the pneumatic pressure acts in opposition to the spring pressure, further comprising removing the pneumatic pressure to allow the spring pressure to activate the clamping device.

4. The process according to claim 1 , further comprising aligning the laser beam by respositioning the laser head in the XY directions with the laser head main drives after the clamping mechanism is released.

5. The process according to claim 1 , further comprising controlling the clamping device by moving the clamping device from a first position in which said clamping device fixes said laterally-slidable head piece to a second position in which said laterally-slidable head piece is released.

6. The process according to claim 1 , wherein said releasable clamping device includes an annular piston, the process further comprising controllably releasing said clamping device by moving said annular piston from a first position, in which said annular piston fixes said laterally-slidable head piece, to a second position, in which said annular piston releases said laterally-slidable head piece.

7. The process according to claim 6 , further comprising fixing said clamping device by moving said annular piston from said second position to said first position.

8. The process according to claim 1 , further comprising determining a position of the laser beam and then repositioning the laser head to align the laser beam.

9. The process according to claim 8 , further comprising determining a position of the laser beam using a target adhered to an underside of the nozzle by forming a hole in the target with a pulse of the laser beam, wherein the laser head is repositioned based on a location of the hole in the target.

10. The process according to claim 9 , further comprising determining the location of the hole in the target with a camera by taking an image of the hole.

11. The process according to claim 9 , further comprising analyzing the image and repositioning the laser head based on the analysis of the image.

12. The process according to claim 1 , wherein repositioning the laser head includes moving the laser head in at least one of X and Y directions.

13. The process according to claim 1 , wherein said clamping device includes first and second clamping surfaces, the process further comprising releasing said clamping device by separating said first and second clamping surfaces.

14. The process according to claim 13 , further comprising activating said clamping device by bringing said first and second clamping surfaces into contact with each other with a bias force.

15. The process according to claim 1 , further comprising positioning the X Y coordinate space with the laser head main drives.

16. A process for aligning a laser processing machine laser beam, of the method comprising:
moving a laser head to a nozzle adjustment station with laser head main drives;
placing a nozzle of the laser head in a nozzle receiving unit of the nozzle adjustment station;
fixing, in the receiving unit, the nozzle of the laser head against movement under action of the laser head main drives;
determining a position of the laser beam;
releasing a clamping device in the laser head to allow lateral sliding between the nozzle fixed in the nozzle receiving unit and the laser head;
repositioning the laser head with the laser head main drives based on the determined position of the laser beam such that the laser beam is aligned with respect to the nozzle; and
activating the clamping device to fix the beam-aligned nozzle to the laser head.

17. The process of claim 16 , wherein determining a position of the laser beam includes:
positioning a target;
performing a laser pulse to form a hole in the target
determining a position of the hole in the target; and
moving the laser head to align the laser beam in the nozzle based on the position of the hole in the target.

18. The process of claim 16 , wherein determining a positon of the laser beam includes:
transporting a target into a predetermined position relative to the nozzle;
positioning an absorption plate underneath the target;
forming a hole in the target with a laser pulse;
removing the absorption plate and acquiring an image of the hole the target with a camera system;
comparing the image of the hole in the target with a calibration position; and
if the position of the hole does not coincide with the calibration position, releasing the clamping device and correcting an alignment of the laser beam with the main drives by moving the laser head relative to the nozzle based on an error determined from the position of the hole in the target and the calibration position; and
activating the clamping device.

19. The process of claim 16 , wherein the clamping device comprises a piston, further comprising releasing the clamping device by introducing a pneumatic pressure to move the piston from a first position in which the laser head is fixed to the nozzle to a second position in which a position of the laser head can be changed relative to the nozzle.

20. The process of claim 19 , further comprising removing the pneumatic pressure to activate the clamping mechanism such that the position of the laser head is fixed with respect to the nozzle.

Assignees

• Bystronic Laser Ag

Inventors

• Cathry Daniel
• Imboden Ernest
• Bugmann Tobias
• Broger David
• Perrin Thierry

Classifications

• Y10T29/49778

  with aligning, guiding, or instruction · CPC title

• B23K26/38 Primary

  by boring or cutting · CPC title

• B23K26/705

  Beam measuring devices · CPC title

• B23K26/043

  along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus · CPC title

• B23K26/04 Primary

  Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light · CPC title